Global ABF (Ajinomoto Build-up Film) Substrate Market Growth 2024-2030

Global ABF (Ajinomoto Build-up Film) Substrate Market Growth 2024-2030

ABF, otherwise known as “Ajinomoto Build-up Film” is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and rigid film that resists expansion and contraction with changes in temperature, making it ideal for use as a substrate between the nanometer-scale and millimeter-scale components of a processor or IC.

The ABF (Ajinomoto Build-up Film) Substrate consists of multiple layers of microcircuits, known as a “build-up substrate” which allows the formation of these miniature components as its surface is receptive to laser processing and direct copper plating. Most modern chipmakers use ABF to design the smaller components of their CPUs and GPUs.

The global ABF (Ajinomoto Build-up Film) Substrate market size is projected to grow from US$ 5683 million in 2024 to US$ 10190 million in 2030; it is expected to grow at a CAGR of 10.2% from 2024 to 2030.

LP Information, Inc. (LPI) ' newest research report, the “ABF (Ajinomoto Build-up Film) Substrate Industry Forecast” looks at past sales and reviews total world ABF (Ajinomoto Build-up Film) Substrate sales in 2023, providing a comprehensive analysis by region and market sector of projected ABF (Ajinomoto Build-up Film) Substrate sales for 2024 through 2030. With ABF (Ajinomoto Build-up Film) Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world ABF (Ajinomoto Build-up Film) Substrate industry.

This Insight Report provides a comprehensive analysis of the global ABF (Ajinomoto Build-up Film) Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on ABF (Ajinomoto Build-up Film) Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global ABF (Ajinomoto Build-up Film) Substrate market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for ABF (Ajinomoto Build-up Film) Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global ABF (Ajinomoto Build-up Film) Substrate.

The core manufacturers in global ABF (Ajinomoto Build-up Film) Substrate market are Unimicron, Ibiden, AT&S, Nan Ya PCB, Shinko Electric Industries, etc, accounting for 74% market share. Unimicron is the world's largest ABF (Ajinomoto Build-up Film) Substrate manufacturer, occupying approximately 22% of the market share. From the perspective of product type, 4-8 Layers ABF Substrate accounted for a share of 69% in the global ABF (Ajinomoto Build-up Film) Substrate market. In terms of application, PCs holds the largest share, accounting for 40% share.

This report presents a comprehensive overview, market shares, and growth opportunities of ABF (Ajinomoto Build-up Film) Substrate market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
4-8 Layers ABF Substrate
16 Layers ABF Substrate
Others

Segmentation by Application:
PCs
Server & Data Center
HPC/AI Chips
Communication
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
Zhuhai Access Semiconductor
LG InnoTek
Shennan Circuit
Shenzhen Fastprint Circuit Tech

Key Questions Addressed in this Report

What is the 10-year outlook for the global ABF (Ajinomoto Build-up Film) Substrate market?

What factors are driving ABF (Ajinomoto Build-up Film) Substrate market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do ABF (Ajinomoto Build-up Film) Substrate market opportunities vary by end market size?

How does ABF (Ajinomoto Build-up Film) Substrate break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.