Global 2.5D and 3D IC Packaging Market Growth (Status and Outlook) 2023-2029

Global 2.5D and 3D IC Packaging Market Growth (Status and Outlook) 2023-2029

The global 2.5D and 3D IC Packaging market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

United States market for 2.5D and 3D IC Packaging is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

China market for 2.5D and 3D IC Packaging is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Europe market for 2.5D and 3D IC Packaging is estimated to increase from US$ million in 2022 to US$ million by 2029, at a CAGR of % from 2023 through 2029.

Global key 2.5D and 3D IC Packaging players cover ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2022.

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.

LPI (LP Information)' newest research report, the “2.5D and 3D IC Packaging Industry Forecast” looks at past sales and reviews total world 2.5D and 3D IC Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected 2.5D and 3D IC Packaging sales for 2023 through 2029. With 2.5D and 3D IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 2.5D and 3D IC Packaging industry.

This Insight Report provides a comprehensive analysis of the global 2.5D and 3D IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on 2.5D and 3D IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global 2.5D and 3D IC Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 2.5D and 3D IC Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 2.5D and 3D IC Packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of 2.5D and 3D IC Packaging market by product type, application, key players and key regions and countries.

Market Segmentation:

Segmentation by type
2.5D
3D TSV
3D Wafer-level Chip-scale Packaging

Segmentation by application
Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology

Please note: The report will take approximately 2 business days to prepare and deliver.