Global 3D Molded Interconnect Device (MID) Market Growth 2025-2031

The global 3D Molded Interconnect Device (MID) market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.

Three-Dimensional Molded Interconnect Devices: Materials, Manufacturing, Assembly and Applications for Injection Molded Circuit Carriers.

United States market for 3D Molded Interconnect Device (MID) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

China market for 3D Molded Interconnect Device (MID) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Europe market for 3D Molded Interconnect Device (MID) is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.

Global key 3D Molded Interconnect Device (MID) players cover Molex, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics, Taoglas, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.

LP Information, Inc. (LPI) ' newest research report, the “3D Molded Interconnect Device (MID) Industry Forecast” looks at past sales and reviews total world 3D Molded Interconnect Device (MID) sales in 2024, providing a comprehensive analysis by region and market sector of projected 3D Molded Interconnect Device (MID) sales for 2025 through 2031. With 3D Molded Interconnect Device (MID) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 3D Molded Interconnect Device (MID) industry.

This Insight Report provides a comprehensive analysis of the global 3D Molded Interconnect Device (MID) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on 3D Molded Interconnect Device (MID) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms’ unique position in an accelerating global 3D Molded Interconnect Device (MID) market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 3D Molded Interconnect Device (MID) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 3D Molded Interconnect Device (MID).

This report presents a comprehensive overview, market shares, and growth opportunities of 3D Molded Interconnect Device (MID) market by product type, application, key manufacturers and key regions and countries.

Segmentation by Type:
Antennae and Connectivity Modules
Sensors
Connectors and Switches
Lighting Systems
Others

Segmentation by Application:
Telecommunications
Consumer Electronics
Automotive
Medical
Military & Aerospace
Others

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Molex
TE Connectivity
Amphenol Corporation
LPKF Laser & Electronics
Taoglas
Harting
Arlington Plating Company
MID Solutions
2E Mechatronic
KYOCERA AVX
Johnan

Key Questions Addressed in this Report

What is the 10-year outlook for the global 3D Molded Interconnect Device (MID) market?

What factors are driving 3D Molded Interconnect Device (MID) market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do 3D Molded Interconnect Device (MID) market opportunities vary by end market size?

How does 3D Molded Interconnect Device (MID) break out by Type, by Application?

Please note: The report will take approximately 2 business days to prepare and deliver.