Global 3D IC & 2.5D IC Packaging Market Growth 2023-2029

Global 3D IC & 2.5D IC Packaging Market Growth 2023-2029

A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

LPI (LP Information)' newest research report, the “3D IC & 2.5D IC Packaging Industry Forecast” looks at past sales and reviews total world 3D IC & 2.5D IC Packaging sales in 2022, providing a comprehensive analysis by region and market sector of projected 3D IC & 2.5D IC Packaging sales for 2023 through 2029. With 3D IC & 2.5D IC Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world 3D IC & 2.5D IC Packaging industry.

This Insight Report provides a comprehensive analysis of the global 3D IC & 2.5D IC Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on 3D IC & 2.5D IC Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global 3D IC & 2.5D IC Packaging market.

This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for 3D IC & 2.5D IC Packaging and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global 3D IC & 2.5D IC Packaging.

The global 3D IC & 2.5D IC Packaging market size is projected to grow from US$ million in 2022 to US$ million in 2029; it is expected to grow at a CAGR of % from 2023 to 2029.

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

This report presents a comprehensive overview, market shares, and growth opportunities of 3D IC & 2.5D IC Packaging market by product type, application, key manufacturers and key regions and countries.

Market Segmentation:

Segmentation by type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Segmentation by application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies

This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries

The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering

Key Questions Addressed in this Report

What is the 10-year outlook for the global 3D IC & 2.5D IC Packaging market?

What factors are driving 3D IC & 2.5D IC Packaging market growth, globally and by region?

Which technologies are poised for the fastest growth by market and region?

How do 3D IC & 2.5D IC Packaging market opportunities vary by end market size?

How does 3D IC & 2.5D IC Packaging break out type, application?

What are the influences of COVID-19 and Russia-Ukraine war?

Please note: The report will take approximately 2 business days to prepare and deliver.