Semiconductor Dry Etch Systems Market - Forecasts from 2024 to 2029

Semiconductor Dry Etch Systems Market - Forecasts from 2024 to 2029

The semiconductor dry etch systems market is projected to grow at a CAGR of 4.93% to reach US$22.019 billion in 2029 from US$15.718 billion in 2022.

Semiconductor dry etch systems are tools used in the manufacturing of semiconductors, microprocessors, and other microelectronic devices. The process involves selectively removing or etching certain layers of materials from a wafer, leaving behind patterns and structures necessary for the device's functionality. Dry etching systems utilize a range of techniques, such as plasma etching, reactive ion etching, and deep reactive ion etching, to remove the material from the wafer surface. The dry etching process is an essential step in semiconductor fabrication, as it allows for the precise patterning and formation of intricate features on the surface of the wafer. These features can include channels and trenches, which are critical components of modern semiconductor devices. The ability to produce precise and uniform patterns is necessary to improve the device's performance, reduce its size, and increase its functionality.

The semiconductor dry etch systems market is driven by the increasing demand for advanced semiconductor devices and the need for high-resolution patterning capabilities. With the demand for higher processing speeds, smaller form factors, and increased functionality, the need for more precise patterning and etching capabilities is growing. As a result, dry etching has become a critical step in the semiconductor manufacturing process.

Market Drivers

The increasing demand for advanced semiconductor and electronic devices is driving the market growth.

The demand for advanced semiconductor and electronic devices, such as microprocessors, memory chips, and sensors as well as devices like mobile devices, tablets, and computers, is growing rapidly due to the increasing adoption of digital technologies in various industries. The need for higher processing speeds, smaller form factors, and increased functionality is driving the demand for more precise patterning and etching capabilities. According to the US Census Bureau, the estimated retail sales of electronic and appliance stores in the United States for 2020 was US$85.4 billion.
Technological advancement in semiconductor fabrication has provided new growth prospects.

Further, the technological advancements in the semiconductor fabrication process, such as the development of new materials, processes, and devices, are driving the demand for more advanced dry etch systems. For instance, the development of new materials, such as silicon carbide and gallium nitride, for high-power and high-frequency devices, requires more precise and uniform etching capabilities. Additionally, the increasing demand for three-dimensional (3D) structures in semiconductor devices is driving the need for deep reactive ion etching (DRIE) systems.
Based on type, the dielectric etching segment is expected to show significant growth

Dielectric etching is a process used in the semiconductor industry to selectively remove dielectric materials (insulators) from a substrate using a dry etch process. In semiconductor dry etch systems, dielectric etching is achieved using plasma etching, which involves using high-energy plasma to remove the dielectric material. Dielectric etching is used in the fabrication of various semiconductor devices such as transistors, integrated circuits, and memory chips. It is an important process in the semiconductor industry as it allows for the creation of complex and precise patterns on the surface of a substrate, which is necessary for the development of high-performance semiconductor devices.

North America accounted for a significant share of the global semiconductor dry etch systems market.

Based on geography, the semiconductor dry etch systems market is segmented into North America, South America, Europe, the Middle East and Africa, and Asia Pacific. The North American region is expected to have a significant market share in the semiconductor dry etch systems market due to the increasing demand for consumer electronics, data storage devices, and advanced technologies in the region. The presence of major market players such as Applied Materials and Lam Research in the region is also contributing to the growth of the market.

Key developments.
In August 2020: Applied Materials introduced the Centris Sym3 Y, an advanced semiconductor etching system, to its range of products. The Sym3 Y system uses RF pulsing technology to create high-aspect-ratio structures in 3D NAND, DRAM, and logic, including FinFETs and emerging gate-all-around architectures. The high-conductance chamber architecture of Sym3 Y delivers excellent etch profile control, while a novel coating material reduces defects and boosts yields.
In June 2020: RENA Technologies introduced a new single-wafer platform named Inception for all wet processes of semiconductors including cleaning, etching, stripping, and drying. The Inception platform is built to provide a suitable platform for any wet cleaning, etching, or stripping application. It includes front-end-of-line (FEoL) and back-end-of-line (BEoL) processing applications, automated wafer handling, dual movable spray arms, and separate chemical lines.

Segmentation:

By Type
Dielectric Etching
Conductor Etching
By Application
Logic & Foundry
MEMS
Sensors
Power Devices
Others
By Geography
North America
USA
Canada
Mexico
South America
Brazil
Argentina
Others
Europe
Germany
France
United Kingdom
Spain
Others
Middle East and Africa
Saudi Arabia
UAE
Israel
Others
Asia Pacific
China
Japan
India
South Korea
Indonesia
Taiwan
Others