North America Wafer Cleaning Equipment Market Size, Share & Industry Trends Analysis Report By Equipment Type, By Application (Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others), By Wafer Size, By Country and Growth Forecast, 2023 - 2030

North America Wafer Cleaning Equipment Market Size, Share & Industry Trends Analysis Report By Equipment Type, By Application (Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others), By Wafer Size, By Country and Growth Forecast, 2023 - 2030


The North America Wafer Cleaning Equipment Market would witness market growth of 8.6% CAGR during the forecast period (2023-2030). In the year 2019, the North America market's volume surged to 88.0 thousand units, showcasing a growth of 8.7% (2019-2022).

Various technologies, including wet chemical cleaning, dry cleaning, aqueous cleaning, cryogenic aerosol, and supercritical fluid cleaning, ensure the successful elimination and neutralization of these objectionable elements from the wafer's surface. Single wafer cleaning refers to treating a single wafer at a time, whereas bulk wafer cleaning refers to the simultaneous treatment of multiple wafers.

The increased adoption of micro-electro-mechanical systems (MEMS) technology in both conventional and contemporary applications is fuelling this market. This growth is also a result of the expansion of crucial wafer cleaning steps. In addition, the rising demand for wafers with 3D structures and the increasing use of silicon-based sensors, processors, and diodes in Internet of Things (IoT) applications present market participants with enticing possibilities. With these wafers' help, manufacturers can produce many devices in a single production batch. The evolution of semiconductor devices made using 300 mm wafers was influenced by this factor, which is one of its driving forces.

North America hosts numerous semiconductor fabrication facilities (fabs) producing a wide range of semiconductor devices, including microprocessors, memory chips, and sensors. Wafer cleaning equipment is critical in these fabs to ensure the cleanliness and quality of silicon wafers at various stages of the manufacturing process, such as after chemical mechanical planarization (CMP) and before photolithography. Moreover, the region is a hub for emerging technologies such as quantum computing, photonics, and advanced materials. It is used to develop and prototype components for these technologies. Therefore, with the growth of semiconductor usage in multiple sectors, the market is anticipated to grow.

The US market dominated the North America Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3.3 billion by 2030. The Canada market is poised to grow at a CAGR of 11.1% during (2023 - 2030). Additionally, The Mexico market would witness a CAGR of 10.1% during (2023 - 2030).

Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.

Scope of the Study

Market Segments covered in the Report:

By Equipment Type (Volume, Thousand units, USD Million, 2019-2030)
  • Batch Spray Cleaning System
  • Batch Immersion Cleaning System
  • Single Wafer Cryogenic System
  • Single Wafer Spray System
  • Scrubbers
By Application (Volume, Thousand units, USD Million, 2019-2030)
  • Memory
  • Interposer
  • MEMS
  • Logic
  • CIS
  • LED
  • RF Device
  • Others
By Wafer Size (Volume, Thousand units, USD Million, 2019-2030)
  • 300 mm
  • 200 mm
  • Less than Equals 150 mm
By Country (Volume, Thousand units, USD Million, 2019-2030)
  • US
  • Canada
  • Mexico
  • Rest of North America
Companies Profiled
  • Tokyo Electron Ltd.
  • SCREEN Holdings Co., Ltd
  • Applied Materials, Inc.
  • Lam Research Corporation
  • Veeco Instruments, Inc.
  • Axus Technology
  • Entegris, Inc. (Sumitomo Mitsui Financial Group)
  • SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
  • Ultron Systems, Inc.
  • Toho Technology Co., Ltd.
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Wafer Cleaning Equipment Market, by Equipment Type
1.4.2 North America Wafer Cleaning Equipment Market, by Application
1.4.3 North America Wafer Cleaning Equipment Market, by Wafer Size
1.4.4 North America Wafer Cleaning Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2022
4.2 Porter’s Five Force Analysis
Chapter 5. North America Wafer Cleaning Equipment Market, by Equipment Type
5.1 North America Batch Spray Cleaning System Market, by Country
5.2 North America Batch Immersion Cleaning System Market, by Country
5.3 North America Single Wafer Cryogenic System Market, by Country
5.4 North America Single Wafer Spray System Market, by Country
5.5 North America Scrubbers Market, by Country
Chapter 6. North America Wafer Cleaning Equipment Market, by Application
6.1 North America Memory Market, by Country
6.2 North America Interposer Market, by Country
6.3 North America MEMS Market, by Country
6.4 North America Logic Market, by Country
6.5 North America CIS Market, by Country
6.6 North America LED Market, by Country
6.7 North America RF Device Market, by Country
6.8 North America Others Market, by Country
Chapter 7. North America Wafer Cleaning Equipment Market, by Wafer Size
7.1 North America 300 mm Market, by Country
7.2 North America 200 mm Market, by Country
7.3 North America Less than Equals 150 mm Market, by Country
Chapter 8. North America Wafer Cleaning Equipment Market, by Country
8.1 US Wafer Cleaning Equipment Market
8.1.1 US Wafer Cleaning Equipment Market, by Equipment Type
8.1.2 US Wafer Cleaning Equipment Market, by Application
8.1.3 US Wafer Cleaning Equipment Market, by Wafer Size
8.2 Canada Wafer Cleaning Equipment Market
8.2.1 Canada Wafer Cleaning Equipment Market, by Equipment Type
8.2.2 Canada Wafer Cleaning Equipment Market, by Application
8.2.3 Canada Wafer Cleaning Equipment Market, by Wafer Size
8.3 Mexico Wafer Cleaning Equipment Market
8.3.1 Mexico Wafer Cleaning Equipment Market, by Equipment Type
8.3.2 Mexico Wafer Cleaning Equipment Market, by Application
8.3.3 Mexico Wafer Cleaning Equipment Market, by Wafer Size
8.4 Rest of North America Wafer Cleaning Equipment Market
8.4.1 Rest of North America Wafer Cleaning Equipment Market, by Equipment Type
8.4.2 Rest of North America Wafer Cleaning Equipment Market, by Application
8.4.3 Rest of North America Wafer Cleaning Equipment Market, by Wafer Size
Chapter 9. Company Profiles
9.1 Tokyo Electron Ltd.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.6 SWOT Analysis
9.2 SCREEN Holdings Co., Ltd
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments:
9.2.5.1 Partnerships, Collaborations, and Agreements:
9.2.5.2 Product Launches and Product Expansions:
9.2.6 SWOT Analysis
9.3 Applied Materials, Inc.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 SWOT Analysis
9.4 Lam Research Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 SWOT Analysis
9.5 Veeco Instruments, Inc.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 SWOT Analysis
9.6 Axus Technology
9.6.1 Company Overview
9.6.2 SWOT Analysis
9.7 Entegris, Inc. (Sumitomo Mitsui Financial Group)
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 SWOT Analysis
9.9 Ultron Systems, Inc.
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. Toho Technology Co., Ltd.
9.10.1 Company Overview
9.10.2 SWOT Analysis

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