North America Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Country and Growth Forecast, 2022 - 2028

North America Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Country and Growth Forecast, 2022 - 2028

The North America Thin Wafer Market would witness market growth of 12.4% CAGR during the forecast period (2022-2028).

Weak acids are used to clean wafers and get rid of contaminants. To ensure that a silicon wafer's surface is clean and free of contaminants, there are several common cleaning processes. RCA cleaning is one of the most efficient techniques. The wafers are textured to generate a rough surface when used for solar cells, increasing surface area and hence efficiency. In the etching process, the created PSG (phosphosilicate glass) is eliminated from the wafer's edge. The silicon used in wafers has a diamond cubic structure with a lattice spacing of 5.430710 and is formed from crystal with a regular crystal structure (0.5430710 nm).

When snip into wafers, the surface is associated with one of the various relative instructions known as crystal orientations. The Miller index determines orientation, with silicon often having (100) or (111) faces. Since many of a single crystal's structural and electrical properties are highly anisotropic, orientation is crucial. The crystal orientation of the wafer determines the ion implantation depths since each direction provides unique pathways for transport.

The expansion of the regional market would be supported by numerous technological advancements, inventions, and expenditures in the various industries of the area. Semiconductor chips and integrated circuits (ICs) are now widely accepted and used across North America as a result of the rising demand for smart devices and technologies. The region's wafer back grinding tape market is anticipated to grow because of the processing of larger internet-enabled data sets, improvements in sensory technology, and an increase in the use of autonomous devices.

The US market dominated the North America Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $4,644.4 million by 2028. The Canada market is showcasing a CAGR of 14.9% during (2022 - 2028). Additionally, The Mexico market would register a CAGR of 13.9% during (2022 - 2028).

Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.

Scope of the Study

Market Segments covered in the Report:

By Wafer Size

  • 300 mm
  • 200 mm
  • 125 mm
By Technology
  • Dicing
  • Polishing
  • Grinding
By Application
  • Memory
  • LED
  • MEMS
  • CIS
  • RF Devices
  • Interposer
  • Logic
  • Others
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America
Companies Profiled
  • Shin-Etsu Chemical Co., Ltd.
  • SUMCO Corporation
  • GlobalWafers Co., Ltd.
  • Siltronic AG
  • SK Siltron Co., Ltd.
  • SUSS MicroTec SE
  • Soitec
  • DISCO Corporation
  • 3M Company
  • Applied Materials, Inc.
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Thin Wafer Market, by Wafer Size
1.4.2 North America Thin Wafer Market, by Technology
1.4.3 North America Thin Wafer Market, by Application
1.4.4 North America Thin Wafer Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenarios
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in Thin Wafer Market
Chapter 4. North America Thin Wafer Market by Wafer Size
4.1 North America 300 mm Market by Country
4.2 North America 200 mm Market by Country
4.3 North America 125 mm Market by Country
Chapter 5. North America Thin Wafer Market by Technology
5.1 North America Dicing Market by Country
5.2 North America Polishing Market by Country
5.3 North America Grinding Market by Country
Chapter 6. North America Thin Wafer Market by Application
6.1 North America Memory Market by Country
6.2 North America LED Market by Country
6.3 North America MEMS Market by Country
6.4 North America CIS Market by Country
6.5 North America RF Devices Market by Country
6.6 North America Interposer Market by Country
6.7 North America Logic Market by Country
6.8 North America Others Market by Country
Chapter 7. North America Thin Wafer Market by Country
7.1 US Thin Wafer Market
7.1.1 US Thin Wafer Market by Wafer Size
7.1.2 US Thin Wafer Market by Technology
7.1.3 US Thin Wafer Market by Application
7.2 Canada Thin Wafer Market
7.2.1 Canada Thin Wafer Market by Wafer Size
7.2.2 Canada Thin Wafer Market by Technology
7.2.3 Canada Thin Wafer Market by Application
7.3 Mexico Thin Wafer Market
7.3.1 Mexico Thin Wafer Market by Wafer Size
7.3.2 Mexico Thin Wafer Market by Technology
7.3.3 Mexico Thin Wafer Market by Application
7.4 Rest of North America Thin Wafer Market
7.4.1 Rest of North America Thin Wafer Market by Wafer Size
7.4.2 Rest of North America Thin Wafer Market by Technology
7.4.3 Rest of North America Thin Wafer Market by Application
Chapter 8. Company Profiles
8.1 Shin-Etsu Chemical Co., Ltd.
8.1.1 Company Overview
8.1.1 Financial Analysis
8.1.2 Regional & Segmental Analysis
8.1.3 Research & Development Expenses
8.2 GlobalWafers Co., Ltd. (Sino-American Silicon Products Inc.)
8.2.1 Company Overview
8.3 Sumco Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expenses
8.4 3M Company
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Applied Materials, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expenses
8.6 Siltronic AG
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expenses
8.7 SK siltron Co., Ltd.
8.7.1 Company Overview
8.7.2 Recent strategies and developments:
8.7.2.1 Acquisition and Mergers:
8.8 SÜSS MicroTec SE
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expenses
8.8.5 Recent strategies and developments:
8.8.5.1 Geographical Expansions:
8.9 Soitec
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Recent strategies and developments:
8.9.4.1 Partnerships, Collaborations, and Agreements:
8.9.4.2 Product Launches and Product Expansions:
8.9.4.3 Acquisition and Mergers:
8.9.4.4 Geographical Expansions:
8.10. DISCO Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Recent strategies and developments:
8.10.3.1 Product Launches and Product Expansions:

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