North America Radiation Hardened Electronics Market Size, Share & Industry Trends Analysis Report By Component, By Manufacturing Technique, By Product Type, By Application (Space, Aerospace & Defense, Nuclear Power Plant, Medical), By Country and Growth F

North America Radiation Hardened Electronics Market Size, Share & Industry Trends Analysis Report By Component, By Manufacturing Technique, By Product Type, By Application (Space, Aerospace & Defense, Nuclear Power Plant, Medical), By Country and Growth Forecast, 2022 - 2028

The North America Radiation Hardened Electronics Market would witness market growth of 3.3% CAGR during the forecast period (2022-2028).

Radiation toughening is the process of creating electrical parts and circuit design resistant to damage or malfunction caused by high levels of ionizing radiation particle radiation and strong radiation, particularly in outer space especially beyond low Earth orbit, around nuclear reactors and electron beams, and during nuclear accidents or warfare. Most semiconductor electronic components are sensitive to space radiation, and radiation-hardened (rad-hard) circuits are similar to non-hardened counterparts with some design and manufacturing differences that lessen radiation damage susceptibility.

System-level radiation hardening enables the use of high-performance electronics and improves a spacecraft's capabilities, the procedures can be expensive and sacrifice the performance that designers intended from the high-performance elements. Furthermore, such procedures frequently result in a complex design, particularly when several complex commercialized microcircuits are used, each with its own set of hardening issues.

The RHESE project is one of NASA's Exploration Technology Development (ETDP) Program's several technology development activities. This program exists to ensure that the relevant supporting and improving technologies are accessible for NASA's present and future missions when they are needed. The RHESE project covers a wide range of methods for hardening space electronics against the radiation and heat extremes of space.

New materials, design methodology, reconfigurable electronics techniques, and software modeling tools are among the methods used to harden systems. The missions being built under NASA's Constellation program within the Exploration Mission Systems Directorate (ESMD), such as the lunar and Mars missions that would help achieve the goals of the Vision for Space Exploration, will be the key clients for RHESE technologies. The lunar capability of the Orion Crew Exploration Vehicle (CEV), the Lunar Lander project, Lunar Outpost elements, and Extra-Vehicular Activity (EVA) aspects are all missions that apply to the Constellation program.

The US market dominated the North America Radiation Hardened Electronics Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $554.3 million by 2028. The Canada market is anticipated to grow at a CAGR of 5.7% during (2022 - 2028). Additionally, The Mexico market would showcase a CAGR of 4.8% during (2022 - 2028).

Based on Component, the market is segmented into Power Management, Mixed Signal ICs, Processors & Controllers, and Memory. Based on Manufacturing Technique, the market is segmented into Radiation-Hardening by Design (RHBD) and Radiation-Hardening by Process (RHBP). Based on Product Type, the market is segmented into Commercial-off-the-Shelf (COTS) and Custom Made. Based on Application, the market is segmented into Space, Aerospace & Defense, Nuclear Power Plant, Medical, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Renesas Electronics Corporation, STMicroelectronics N.V., Infineon Technologies AG, Texas Instruments, Inc., Microchip Technology, Inc., Teledyne Technologies, Inc., Honeywell International, Inc., BAE Systems PLC, Xilinx, Inc., and TTM Technologies, Inc.

Scope of the Study

Market Segments covered in the Report:

By Component

• Power Management
• Mixed Signal ICs
• Processors & Controllers
• Memory

By Manufacturing Technique

• Radiation-Hardening by Design (RHBD)
• Radiation-Hardening by Process (RHBP)

By Product Type

• Commercial-off-the-Shelf (COTS)
• Custom Made

By Application

• Space
• Aerospace & Defense
• Nuclear Power Plant
• Medical
• Space

By Country

• US
• Canada
• Mexico
• Rest of North America

Companies Profiled

• Renesas Electronics Corporation
• STMicroelectronics N.V.
• Infineon Technologies AG
• Texas Instruments, Inc.
• Microchip Technology, Inc.
• Teledyne Technologies, Inc.
• Honeywell International, Inc.
• BAE Systems PLC
• Xilinx, Inc.
• TTM Technologies, Inc.

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