North America Gate Driver ICs Market Size, Share & Trends Analysis Report By Transistor Type (MOSFET, and IGBT), By Semiconductor Material (SiC, and GaN), By Mode of Attachment, By Application, By Country and Growth Forecast, 2023 - 2030

North America Gate Driver ICs Market Size, Share & Trends Analysis Report By Transistor Type (MOSFET, and IGBT), By Semiconductor Material (SiC, and GaN), By Mode of Attachment, By Application, By Country and Growth Forecast, 2023 - 2030


The North America Gate Driver ICs Market would witness market growth of 4.4% CAGR during the forecast period (2023-2030). In the year 2019, the North America market's volume surged to 165.0 million units, showcasing a growth of 10.3% (2019-2022).

Gate driver ICs, or gate driver integrated circuits, are electronic components designed to control the switching behaviour of power semiconductor devices such as MOSFETs (metal-oxide-semiconductor field-effect transistors) and IGBTs (insulated gate bipolar transistors). The gate of these high-power devices requires precise control signals to ensure efficient switching operations, minimize power losses, and optimize performance in various power electronics applications.

Gate driver ICs typically include features such as built-in protection circuits, isolation features, and temperature monitoring to enhance the reliability and safety of power electronic systems. They are commonly used in applications such as motor drives, inverters, converters, power supplies, renewable energy systems, electric vehicles, and industrial automation. Overall, these are critical components in power electronics systems, facilitating the efficient and reliable operation of high-power semiconductor devices by providing the necessary drive signals and protection mechanisms.

The expansion of 5G technology in Canada is expected to impact the market significantly, particularly in telecommunications and network infrastructure. According to Statistics Canada, in 2022, 91.3% of Canadians had access to 5G networks, and 99.5% had access to LTE networks. Additionally, in 2023, 4099 spectrum licenses were auctioned in the 3800 MHz band for a total value of $2.16 billion or $0.26 per MHz per person ($/MHz-Pop). Therefore, the expansion of the telecommunication sector in the region is propelling the growth of the market.

The US market dominated the North America Gate Driver ICs Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $424.2 Million by 2030. The Canada market is experiencing a CAGR of 6.8% during (2023 - 2030). Additionally, The Mexico market would exhibit a CAGR of 5.9% during (2023 - 2030).

Based on Transistor Type, the market is segmented into MOSFET, and IGBT. Based on Semiconductor Material, the market is segmented into SiC, and GaN. Based on Mode of Attachment, the market is segmented into On-chip, and Discrete. Based on Application, the market is segmented into Industrial, Commercial, and Residential. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

List of Key Companies Profiled
  • Infineon Technologies AG
  • Mitsubishi Electric Corporation
  • NXP Semiconductors N.V.
  • Rohm Co., Ltd.
  • STMicroelectronics N.V.
  • Toshiba Corporation
  • Semtech Corporation
  • Microchip Technology Incorporated
  • ON Semiconductor Corporation
  • Renesas Electronics Corporation
North America Gate Driver ICs Market Report Segmentation

By Transistor Type (Volume, Million Units, USD Billion, 2019-2030)
  • MOSFET
  • IGBT
By Semiconductor Material (Volume, Million Units, USD Billion, 2019-2030)
  • SiC
  • GaN
By Mode of Attachment (Volume, Million Units, USD Billion, 2019-2030)
  • On-chip
  • Discrete
By Application (Volume, Million Units, USD Billion, 2019-2030)
  • Industrial
  • Commercial
  • Residential
By Country (Volume, Million Units, USD Billion, 2019-2030)
  • US
  • Canada
  • Mexico
  • Rest of North America


Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Gate Driver ICs Market, by Transistor Type
1.4.2 North America Gate Driver ICs Market, by Semiconductor Material
1.4.3 North America Gate Driver ICs Market, by Mode of Attachment
1.4.4 North America Gate Driver ICs Market, by Application
1.4.5 North America Gate Driver ICs Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Opportunities
3.2.3 Market Restraints
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements : 2022, Jul – 2023, Nov) Leading Players
4.5 Porter’s Five Forces Analysis
Chapter 5. North America Gate Driver ICs Market, By Transistor Type
5.1 North America MOSFET Market, By Country
5.2 North America IGBT Market, By Country
Chapter 6. North America Gate Driver ICs Market, By Semiconductor Material
6.1 North America SiC Market, By Country
6.2 North America GaN Market, By Country
Chapter 7. North America Gate Driver ICs Market, By Mode of Attachment
7.1 North America On-chip Market, By Country
7.2 North America Discrete Market, By Country
Chapter 8. North America Gate Driver ICs Market, By Application
8.1 North America Industrial Market, By Country
8.2 North America Commercial Market, By Country
8.3 North America Residential Market, By Country
Chapter 9. North America Gate Driver ICs Market, By Country
9.1 US Gate Driver ICs Market
9.1.1 US Gate Driver ICs Market, By Transistor Type
9.1.2 US Gate Driver ICs Market, By Semiconductor Material
9.1.3 US Gate Driver ICs Market, By Mode of Attachment
9.1.4 US Gate Driver ICs Market, By Application
9.2 Canada Gate Driver ICs Market
9.2.1 Canada Gate Driver ICs Market, By Transistor Type
9.2.2 Canada Gate Driver ICs Market, By Semiconductor Material
9.2.3 Canada Gate Driver ICs Market, By Mode of Attachment
9.2.4 Canada Gate Driver ICs Market, By Application
9.3 Mexico Gate Driver ICs Market
9.3.1 Mexico Gate Driver ICs Market, By Transistor Type
9.3.2 Mexico Gate Driver ICs Market, By Semiconductor Material
9.3.3 Mexico Gate Driver ICs Market, By Mode of Attachment
9.3.4 Mexico Gate Driver ICs Market, By Application
9.4 Rest of North America Gate Driver ICs Market
9.4.1 Rest of North America Gate Driver ICs Market, By Transistor Type
9.4.2 Rest of North America Gate Driver ICs Market, By Semiconductor Material
9.4.3 Rest of North America Gate Driver ICs Market, By Mode of Attachment
9.4.4 Rest of North America Gate Driver ICs Market, By Application
Chapter 10. Company Profiles
10.1 Infineon Technologies AG
10.1.1 Company Overview
10.1.2 Financial Analysis
10.1.3 Segmental and Regional Analysis
10.1.4 Research & Development Expense
10.1.5 Recent strategies and developments:
10.1.5.1 Partnerships, Collaborations, and Agreements:
10.1.5.2 Acquisition and Mergers:
10.1.6 SWOT Analysis
10.2 Mitsubishi Electric Corporation
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Research & Development Expense
10.2.5 Recent strategies and developments:
10.2.5.1 Partnerships, Collaborations, and Agreements:
10.2.5.2 Acquisition and Mergers:
10.2.6 SWOT Analysis
10.3 NXP Semiconductors N.V.
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Regional Analysis
10.3.4 Research & Development Expense
10.3.5 Recent strategies and developments:
10.3.5.1 Partnerships, Collaborations, and Agreements:
10.3.5.2 Product Launches and Product Expansions:
10.3.6 SWOT Analysis
10.4 Rohm Co., Ltd.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Segmental and Regional Analysis
10.4.4 Research & Development Expense
10.4.5 Recent strategies and developments:
10.4.5.1 Partnerships, Collaborations, and Agreements:
10.4.6 SWOT Analysis
10.5 STMicroelectronics N.V.
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Segmental and Regional Analysis
10.5.4 Research & Development Expense
10.5.5 Recent strategies and developments:
10.5.5.1 Partnerships, Collaborations, and Agreements:
10.5.5.2 Product Launches and Product Expansions:
10.5.5.3 Acquisition and Mergers:
10.5.6 SWOT Analysis
10.6 Toshiba Corporation
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Segmental and Regional Analysis
10.6.4 Research and Development Expense
10.6.5 Recent strategies and developments:
10.6.5.1 Product Launches and Product Expansions:
10.6.6 SWOT Analysis
10.7 Semtech Corporation
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Regional & Segmental Analysis
10.7.4 Product Development and Engineering expenses
10.7.5 Recent strategies and developments:
10.7.5.1 Acquisition and Mergers:
10.7.6 SWOT Analysis
10.8 Microchip Technology Incorporated
10.8.1 Company Overview
10.8.2 Financial Analysis
10.8.3 Segmental and Regional Analysis
10.8.4 Research & Development Expenses
10.8.5 Recent strategies and developments:
10.8.5.1 Acquisition and Mergers:
10.8.6 SWOT Analysis
10.9 ON Semiconductor Corporation
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 Segmental and Regional Analysis
10.9.4 Research & Development Expense
10.9.5 Recent strategies and developments:
10.9.5.1 Acquisition and Mergers:
10.9.6 SWOT Analysis
10.10. Renesas Electronics Corporation
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expense
10.10.5 Recent strategies and developments:
10.10.5.1 Acquisition and Mergers:
10.10.6 SWOT Analysis

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