North America DRAM Module and Component Market Size, Share & Industry Trends Analysis Report By Type (LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others), By Memory, By Industry, By Country and Growth Forecast, 2022 – 2028

North America DRAM Module and Component Market Size, Share & Industry Trends Analysis Report By Type (LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others), By Memory, By Industry, By Country and Growth Forecast, 2022 – 2028

The North America DRAM Module and Component Market would witness market growth of 1.1% CAGR during the forecast period (2022-2028).

The truth that the capacitors leak charge over time is also a problem. As a result, the capacitors must be refreshed on a regular basis in order to keep the data recorded in memory. Refreshing works in the same way as reading and ensures that no data is lost. The charge on a DRAM cell is dynamically updated every so often, which is how DRAM gets its "Dynamic" designation.

Desktop and laptop computers, as well as servers, use DRAM modules. Demand for laptops increased significantly after lockdowns as offices and classrooma shifted to the digital world, and classes and meetings started being held on online platforms. Thus, the DRAM module market is expected to grow in terms of revenue as sales of smartphones, laptops/tablets, digital cameras, and other devices continue to climb.

The region is a major computer industry hub, with strong R&D support and substantial financial backing, resulting in high memory usage. Consumer gadgets like as smart home devices, smart wearables, and gaming consoles are all popular in the region. One of the primary reasons for the growth of the DRAM module and components market in the region is the presence of some of the leading players in the industry, such as Micron Technology, Inc., Kingston Technology Corporation, and SMART Modular Technologies.

The US market dominated the North America DRAM Module and Component Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $21,636.2 million by 2028. The Canada market is anticipated to grow at a CAGR of 3.4% during (2022 - 2028). Additionally, The Mexico market would display a CAGR of 2.5% during (2022 - 2028).

Based on Type, the market is segmented into LPDRAM, DDR2, DDR5, GDDR, HBM, DDR4, DDR3, and Others. Based on Memory, the market is segmented into Above 8 GB, 6-8GB, 3-4GB, 2GB, and Others. Based on Industry, the market is segmented into Servers, Automobiles, Consumer Electronics, Computers, Mobile Devices, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., SK hynix, Inc., Super Micro Computer, Inc., Nanya Technology Corporation, Winbond Electronics Corporation, Micron Technology, Inc., Powerchip Technology Corporation, ADATA Technology Co., Ltd., Etron Technology, Inc., and Kingston Technology Company, Inc.

Scope of the Study

Market Segments covered in the Report:

By Type

  • LPDRAM
  • DDR2
  • DDR5
  • GDDR
  • HBM
  • DDR4
  • DDR3
  • Others
By Memory
  • Above 8 GB
  • 6-8GB
  • 3-4GB
  • 2GB
  • Others
By Industry
  • Servers
  • Automobiles
  • Consumer Electronics
  • Computers
  • Mobile Devices
  • Others
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America
Companies Profiled
  • Samsung Electronics Co., Ltd.
  • SK hynix, Inc.
  • Super Micro Computer, Inc.
  • Nanya Technology Corporation
  • Winbond Electronics Corporation
  • Micron Technology, Inc.
  • Powerchip Technology Corporation
  • ADATA Technology Co., Ltd.
  • Etron Technology, Inc.
  • Kingston Technology Company, Inc.
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America DRAM Module and Component Market, by Type
1.4.2 North America DRAM Module and Component Market, by Memory
1.4.3 North America DRAM Module and Component Market, by Industry
1.4.4 North America DRAM Module and Component Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in DRAM Module and Component Market
Chapter 4. North America DRAM Module and Component Market by Type
4.1 North America LPDRAM Market by Country
4.2 North America DDR2 Market by Country
4.3 North America DDR5 Market by Country
4.4 North America GDDR Market by Country
4.5 North America HBM Market by Country
4.6 North America DDR4 Market by Country
4.7 North America DDR3 Market by Country
4.8 North America Others Market by Country
Chapter 5. North America DRAM Module and Component Market by Memory
5.1 North America Above 8 GB Market by Country
5.2 North America 6-8GB Market by Country
5.3 North America 3-4GB Market by Country
5.4 North America 2GB Market by Country
5.5 North America Others Market by Country
Chapter 6. North America DRAM Module and Component Market by Industry
6.1 North America Servers Market by Country
6.2 North America Automobiles Market by Country
6.3 North America Consumer Electronics Market by Country
6.4 North America Computers Market by Country
6.5 North America Mobile Devices Market by Country
6.6 North America Others Market by Country
Chapter 7. North America DRAM Module and Component Market by Country
7.1 US DRAM Module and Component Market
7.1.1 US DRAM Module and Component Market by Type
7.1.2 US DRAM Module and Component Market by Memory
7.1.3 US DRAM Module and Component Market by Industry
7.2 Canada DRAM Module and Component Market
7.2.1 Canada DRAM Module and Component Market by Type
7.2.2 Canada DRAM Module and Component Market by Memory
7.2.3 Canada DRAM Module and Component Market by Industry
7.3 Mexico DRAM Module and Component Market
7.3.1 Mexico DRAM Module and Component Market by Type
7.3.2 Mexico DRAM Module and Component Market by Memory
7.3.3 Mexico DRAM Module and Component Market by Industry
7.4 Rest of North America DRAM Module and Component Market
7.4.1 Rest of North America DRAM Module and Component Market by Type
7.4.2 Rest of North America DRAM Module and Component Market by Memory
7.4.3 Rest of North America DRAM Module and Component Market by Industry
Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.1 Financial Analysis
8.1.2 Segmental and Regional Analysis
8.1.3 Research & Development Expense
8.1.4 Recent strategies and developments:
8.1.4.1 Product Launches and Product Expansions:
8.2 SK hynix, Inc.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expense
8.2.5 Recent strategies and developments:
8.2.5.1 Product Launches and Product Expansions:
8.3 Super Micro Computer, Inc.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional Analysis
8.3.4 Research & Development Expense
8.4 Nanya Technology Corporation
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional & Segmental Analysis
8.4.4 Research & Development Expenses
8.5 Winbond Electronics Corporation
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expense
8.5.5 Recent strategies and developments:
8.5.5.1 Partnerships, Collaborations, and Agreements:
8.6 Micron Technology, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 Recent strategies and developments:
8.6.5.1 Product Launches and Product Expansions:
8.7 Powerchip Technology Corporation
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Regional Analysis
8.7.4 Research & Development Expenses
8.8 ADATA Technology Co., Ltd.
8.8.1 Company Overview
8.8.2 Recent strategies and developments:
8.8.2.1 Product Launches and Product Expansions:
8.9 Etron Technology, Inc.
8.9.1 Company Overview
8.10. Kingston Technology Company, Inc.
8.10.1 Company Overview
8.10.2 Recent strategies and developments:
8.10.2.1 Partnerships, Collaborations, and Agreements:

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