North America Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030

North America Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030


The North America Board-to-Board Connectors Market would witness market growth of 5.7% CAGR during the forecast period (2023-2030). In the year 2019, the North America market's volume surged to 487.1 million units, showcasing a growth of 2.4% (2019-2022).

An electrical connector known as a board-to-board connector is utilized to connect printed circuit boards (PCBs) to one another. They are among the primary categories of electronic parts. All board-to-board connections have two fundamental components: male and female connectors that snap together to establish a connection. There are numerous kinds of board-to-board connectors, all of which have a unique set of features and advantages. The most popular kind is called a pin header, consisting of a straightforward row of metal pins that may be put into corresponding holes on another PCB. Typically, pin headers are employed for low-density connections between two PCBs, like those in computer motherboards.

The market is expanding due to the rising need for electronic gadgets. Effective interconnectivity solutions are required because of the increasing adoption of tablets, smartphones, wearables, Internet of Things devices, and other electronic systems. Modern board-to-board connectors are necessary for technological breakthroughs in industries including consumer electronics, healthcare, industrial automation, and telecommunications.

As more companies see the advantages of renting from a colocation facility rather than creating their data centre infrastructure, colocation data centres are growing in popularity in the area. Incorporating technologies such as networks and connectivity devices is rapidly raising the complexity of infrastructure facilities. There will likely be more data centres in the North American region due to all these factors. The regional market is projected to expand in tandem with the expanding number of data centres in the region.

The US market dominated the North America Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,505.8 million by 2030. The Canada market is experiencing a CAGR of 8.1% during (2023 - 2030). Additionally, The Mexico market would exhibit a CAGR of 7.2% during (2023 - 2030).

Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).

Scope of the Study

Market Segments covered in the Report:

By Type (Volume, Million Units, USD Million, 2019-2030)
  • Pin Headers
  • Stacked Header
  • Shrouded Header
  • Socket
By Pitch (Volume, Million Units, USD Million, 2019-2030)
  • 1 mm to 2 mm
  • Greater Than 2 mm
  • Less Than 1 mm
By Application (Volume, Million Units, USD Million, 2019-2030)
  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Telecommunication
  • Others
By Country (Volume, Million Units, USD Million, 2019-2030)
  • US
  • Canada
  • Mexico
  • Rest of North America
Companies Profiled
  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Board-to-Board Connectors Market, by Type
1.4.2 North America Board-to-Board Connectors Market, by Pitch
1.4.3 North America Board-to-Board Connectors Market, by Application
1.4.4 North America Board-to-Board Connectors Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2020, Jan – 2023, Jul) Leading Players
4.5 Porter’s Five Force Analysis
Chapter 5. North America Board-to-Board Connectors Market by Type
5.1 North America Pin Headers Market by Country
5.2 North America Board-to-Board Connectors Market by Pin Headers Type
5.2.1 North America Stacked Header Market by Country
5.2.2 North America Shrouded Header Market by Country
5.3 North America Socket Market by Country
Chapter 6. North America Board-to-Board Connectors Market by Pitch
6.1 North America 1 mm to 2 mm Market by Country
6.2 North America Greater Than 2 mm Market by Country
6.3 North America Less Than 1 mm Market by Country
Chapter 7. North America Board-to-Board Connectors Market by Application
7.1 North America Consumer Electronics Market by Country
7.2 North America Automotive Market by Country
7.3 North America Industrial Automation Market by Country
7.4 North America Healthcare Market by Country
7.5 North America Telecommunication Market by Country
7.6 North America Others Market by Country
Chapter 8. North America Board-to-Board Connectors Market by Country
8.1 US Board-to-Board Connectors Market
8.1.1 US Board-to-Board Connectors Market by Type
8.1.1.1 US Board-to-Board Connectors Market by Pin Headers Type
8.1.2 US Board-to-Board Connectors Market by Pitch
8.1.3 US Board-to-Board Connectors Market by Application
8.2 Canada Board-to-Board Connectors Market
8.2.1 Canada Board-to-Board Connectors Market by Type
8.2.1.1 Canada Board-to-Board Connectors Market by Pin Headers Type
8.2.2 Canada Board-to-Board Connectors Market by Pitch
8.2.3 Canada Board-to-Board Connectors Market by Application
8.3 Mexico Board-to-Board Connectors Market
8.3.1 Mexico Board-to-Board Connectors Market by Type
8.3.1.1 Mexico Board-to-Board Connectors Market by Pin Headers Type
8.3.2 Mexico Board-to-Board Connectors Market by Pitch
8.3.3 Mexico Board-to-Board Connectors Market by Application
8.4 Rest of North America Board-to-Board Connectors Market
8.4.1 Rest of North America Board-to-Board Connectors Market by Type
8.4.1.1 Rest of North America Board-to-Board Connectors Market by Pin Headers Type
8.4.2 Rest of North America Board-to-Board Connectors Market by Pitch
8.4.3 Rest of North America Board-to-Board Connectors Market by Application
Chapter 9. Company Profiles
9.1 Amphenol Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 TE Connectivity Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expense
9.2.5 Recent strategies and developments:
9.2.5.1 Acquisition and Mergers:
9.2.5.2 Product Launches and Product Expansions:
9.2.5.3 Partnerships, Collaborations, and Agreements:
9.2.6 SWOT Analysis
9.3 Molex, LLC (Koch Industries, Inc.)
9.3.1 Company Overview
9.3.2 Recent strategies and developments:
9.3.2.1 Product Launches and Product Expansions:
9.3.2.2 Acquisition and Mergers:
9.3.3 SWOT Analysis
9.4 Kyocera Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.6 SWOT Analysis
9.5 HARTING Technology Group
9.5.1 Company Overview
9.5.2 Recent strategies and developments:
9.5.2.1 Partnerships, Collaborations, and Agreements:
9.5.3 SWOT Analysis
9.6 Omron Corporation
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Product Launches and Product Expansions:
9.6.6 SWOT Analysis
9.7 Japan Aviation Electronics Industry, Limited
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental Analysis
9.7.4 Recent strategies and developments:
9.7.4.1 Product Launches and Product Expansions:
9.7.5 SWOT Analysis
9.8 Hirose Electric Co., Ltd
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Recent strategies and developments:
9.8.4.1 Partnerships, Collaborations, and Agreements:
9.8.4.2 Product Launches and Product Expansions:
9.8.5 SWOT Analysis
9.9 Samtec
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. FIT Hon Teng Limited (Foxconn (Far East) Limited)
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

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