North America Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2), 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031

The North America Advanced Packaging Market would witness market growth of 8.4% CAGR during the forecast period (2024-2031).

The US market dominated the North America Advanced Packaging Market by Country in 2023, and would continue to be a dominant market till 2031; thereby, achieving a market value of $13,735.8 million by 2031. The Canada market is experiencing a CAGR of 10.8% during (2024 - 2031). Additionally, The Mexico market would exhibit a CAGR of 9.8% during (2024 - 2031).

Advanced packaging refers to cutting-edge techniques and technologies used in the semiconductor industry to integrate and package electronic chips to enhance their performance, efficiency, and functionality. Unlike traditional packaging methods, which primarily focus on protecting the chips and providing electrical connections, advanced packaging is designed to meet the increasing demands for miniaturization, high-speed data transfer, low power consumption, and effective thermal management. It is crucial in enabling modern electronic devices to deliver superior performance in compact form factors.

At its core, advanced packaging involves the arrangement and interconnection of semiconductor components, such as processors, memory, and sensors, into a single package. This integration is achieved using innovative techniques like System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), and 3D Integrated Circuits (3D IC). These methods allow multiple chips or components to be combined in a compact design, enabling faster communication between components, improved energy efficiency, and enhanced reliability. Advanced packaging also facilitates heterogeneous integration, where chips of different types, functionalities, or process technologies are integrated into a single unit.

The U.S. government’s strong support for domestic semiconductor manufacturing further bolsters the advanced packaging market. For example, the CHIPS for America Act funds the development of semiconductors and advanced packaging fabrication facilities nationwide, fostering innovation and production capabilities. The National Institute of Standards and Technology (NIST) also extended its funding programs through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures underscore the growing need for robust advanced packaging solutions to optimize electronic system performance and meet escalating market demands. As a result, North America remains a lucrative and rapidly growing region for the advanced packaging market throughout the forecast period.

Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2.5D/3D, and Other Type. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Other End User. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

List of Key Companies Profiled

• Qualcomm Incorporated (Qualcomm Technologies, Inc.)
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Microchip Technology Incorporated
• Infineon Technologies AG
• Samsung Electronics Co., Ltd. (Samsung Group)
• Renesas Electronics Corporation
• VMware, Inc. (Broadcom Inc.)

• Flip-Chip Ball Grid Array
• Fan-out WLP
• Flip chip CSP
• Wafer level CSP
• 2.5D/3D
• Other Type

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End User

• US
• Canada
• Mexico
• Rest of North America