North America ALD Equipment Market Size, Share & Industry Trends Analysis Report By Deposition Method (Plasma-enhanced, Thermal, Spatial, Roll-to-Roll & Powder and Others), By Film Type, By Application, By Country and Growth Forecast, 2022 – 2028

North America ALD Equipment Market Size, Share & Industry Trends Analysis Report By Deposition Method (Plasma-enhanced, Thermal, Spatial, Roll-to-Roll & Powder and Others), By Film Type, By Application, By Country and Growth Forecast, 2022 – 2028

The North America ALD Equipment Market would witness market growth of 7.6% CAGR during the forecast period (2022-2028).

By using elimination processes between a silicon-based molecule and a halogen-functionalized metallic molecule, a variety of metals can be deposited on a surface. Exothermic Fluor silane removal reactions are used in the majority of metal ALD procedures to deposit metal on substrate surfaces. Similar to thermal ALD, metal ALD may deposit a variety of metals on a surface at higher temperatures of about 175 to 325 °C. Thermal and metal ALD use temperatures that are higher than other processes, but they are still much lower than other CVD techniques.

Particle ALD is quite similar to traditional ALD. Particle ALD is focused on coating the full surface of a particle, in contrast to conventional ALD methods, which focuses on a flat or slightly curved surface. A particle's surface can be coated with a variety of materials, with excellent uniformity and ease of integration, without missing any portions of the particle. This technique is distinctive because it is one of the few that can handle the intricate coating geometry for spherical particles while fundamentally applying the ALD principles.

The consumer electronics segment in the region is booming and is anticipated to bolster in the coming years. According to the U.S. Department of Commerce, shipments of manufactured computer and electronic goods reached $339.4 billion in 2012, making up 5.9% of all manufacturing exports from the United States. Shipments of semiconductors and associated products, including integrated circuits, microprocessors, memory chips, diodes, transistors, solar cells, as well as other optoelectronic devices, reached $72.2 billion in 2010, accounting for one-fifth of the overall industry output. Therefore, the demand for ALD equipment is increasing, and thus, the regional ALD equipment market is expediting.

The US market dominated the North America ALD Equipment Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,349.2 Million by 2028. The Canada market is experiencing a CAGR of 10% during (2022 - 2028). Additionally, The Mexico market would exhibit a CAGR of 9.1% during (2022 - 2028).

Based on Deposition Method, the market is segmented into Plasma-enhanced, Thermal, Spatial, Roll-to-Roll & Powder and Others. Based on Film Type, the market is segmented into Oxide Films, Metal Films, Sulfide Films, Nitride Films and Fluoride Films. Based on Application, the market is segmented into Semiconductor and Non-semiconductor. Based on Semiconductor Type, the market is segmented into More Moore, Research & Development Facilities and More-than Moore. Based on Non-Semiconductor Type, the market is segmented into Energy, Medical, Conventional Optics and Coating. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Applied Materials, Inc., ASM International N.V., Tokyo Electron Ltd., Lam Research Corporation, Kurt J. Lesker, Veeco Instruments Inc., Optorun Co., Ltd., CVD Equipment Corporation, Eugene Technology Co. Ltd., and Beneq Oy.

Scope of the Study

Market Segments covered in the Report:

By Deposition Method

  • Plasma-enhanced
  • Thermal
  • Spatial
  • Roll-to-Roll & Powder
  • Others
By Film Type
  • Oxide Films
  • Metal Films
  • Sulfide Films
  • Nitride Films
  • Fluoride Films
By Application
  • Semiconductor
  • More Moore
  • Research & Development Facilities
  • More-than Moore
  • Non-semiconductor
  • Energy
  • Medical
  • Conventional Optics
  • Coating
By Country
  • US
  • Canada
  • Mexico
  • Rest of North America
Companies Profiled
  • Applied Materials, Inc.
  • ASM International N.V.
  • Tokyo Electron Ltd.
  • Lam Research Corporation
  • Kurt J. Lesker
  • Veeco Instruments Inc.
  • Optorun Co., Ltd.
  • CVD Equipment Corporation
  • Eugene Technology Co. Ltd.
  • Beneq Oy
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America ALD Equipment Market, by Deposition Method
1.4.2 North America ALD Equipment Market, by Film Type
1.4.3 North America ALD Equipment Market, by Application
1.4.4 North America ALD Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market composition and scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies deployed in ALD Equipment Market
Chapter 4. North America ALD Equipment Market by Deposition Method
4.1 North America Plasma-enhanced Market by Country
4.2 North America Thermal Market by Country
4.3 North America Spatial Market by Country
4.4 North America Roll-to-Roll & Powder Market by Country
4.5 North America Others Market by Country
Chapter 5. North America ALD Equipment Market by Film Type
5.1 North America Oxide Films Market by Country
5.2 North America Metal Films Market by Country
5.3 North America Sulfide Films Market by Country
5.4 North America Nitride Films Market by Country
5.5 North America Fluoride Films Market by Country
Chapter 6. North America ALD Equipment Market by Application
6.1 North America Semiconductor Market by Country
6.2 North America ALD Equipment Market by Semiconductor Type
6.2.1 North America More Moore Market by Country
6.2.2 North America Research & Development Facilities Market by Country
6.2.3 North America More-than Moore Market by Country
6.3 North America Non-semiconductor Market by Country
6.4 North America ALD Equipment Market by Non-Semiconductor Type
6.4.1 North America Energy Market by Country
6.4.2 North America Medical Market by Country
6.4.3 North America Conventional Optics Market by Country
6.4.4 North America Coating Market by Country
Chapter 7. North America ALD Equipment Market by Country
7.1 US ALD Equipment Market
7.1.1 US ALD Equipment Market by Deposition Method
7.1.2 US ALD Equipment Market by Film Type
7.1.3 US ALD Equipment Market by Application
7.1.3.1 US ALD Equipment Market by Semiconductor Type
7.1.3.2 US ALD Equipment Market by Non-Semiconductor Type
7.2 Canada ALD Equipment Market
7.2.1 Canada ALD Equipment Market by Deposition Method
7.2.2 Canada ALD Equipment Market by Film Type
7.2.3 Canada ALD Equipment Market by Application
7.2.3.1 Canada ALD Equipment Market by Semiconductor Type
7.2.3.2 Canada ALD Equipment Market by Non-Semiconductor Type
7.3 Mexico ALD Equipment Market
7.3.1 Mexico ALD Equipment Market by Deposition Method
7.3.2 Mexico ALD Equipment Market by Film Type
7.3.3 Mexico ALD Equipment Market by Application
7.3.3.1 Mexico ALD Equipment Market by Semiconductor Type
7.3.3.2 Mexico ALD Equipment Market by Non-Semiconductor Type
7.4 Rest of North America ALD Equipment Market
7.4.1 Rest of North America ALD Equipment Market by Deposition Method
7.4.2 Rest of North America ALD Equipment Market by Film Type
7.4.3 Rest of North America ALD Equipment Market by Application
7.4.3.1 Rest of North America ALD Equipment Market by Semiconductor Type
7.4.3.2 Rest of North America ALD Equipment Market by Non-Semiconductor Type
Chapter 8. Company Profiles
8.1 Applied Materials, Inc.
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expenses
8.1.5 Recent strategies and developments:
8.1.5.1 Acquisition and Mergers:
8.2 ASM International N.V.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Regional & Segmental Analysis
8.2.4 Regional & Segmental Analysis
8.2.5 Research & Development Expenses
8.2.6 Recent strategies and developments:
8.2.6.1 Partnerships, Collaborations, and Agreements:
8.2.6.2 Product Launches and Product Expansions:
8.2.6.3 Acquisition and Mergers:
8.3 Tokyo Electron Ltd.
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments:
8.3.5.1 Partnerships, Collaborations, and Agreements:
8.4 Lam Research Corporation
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Kurt J. Lesker Company
8.5.1 Company Overview
8.6 Veeco Instruments Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 Recent strategies and developments:
8.6.5.1 Partnerships, Collaborations, and Agreements:
8.7 Optorun Co., Ltd.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.8 CVD Equipment Corporation
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental Analysis
8.8.4 Research & Development Expenses
8.9 Eugene Technology Co. Ltd.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.10. Beneq Oy
8.10.1 Company Overview
8.10.2 Recent strategies and developments:
8.10.2.1 Product Launches and Product Expansions:

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