North America 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

North America 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

The North America 3D IC and 2.5D IC Packaging Market would witness market growth of 9.4% CAGR during the forecast period (2023-2029).

When using a 2.5D construction, two or more functional semiconductor chips are stacked one on top of the other atop a silicon interposer to provide an incredibly high die-to-die connection density. For shorter connectivity and a smaller package footprint, active chips are incorporated into a 3D structure by stacking die. Due to their advantages in obtaining exceptionally high density of package and great energy efficiency, 2.5D & 3D have recently acquired popularity as appropriate chipset integration platforms.

The chip has a significant number of integrated tiny transistors as well as other electronic parts. This produces circuits that are factors of magnitude faster, cheaper, and smaller than those made of discrete components, enabling a high transistor density. Rapid implementation of standardized ICs in substituting designs employing discrete transistors has been made possible by the integrated circuit's mass production capability, dependability, and building-block method for IC design. ICs have changed the electronics industry and are now found in almost all electrical devices. Because of their compact size and low price, ICs like current microcontrollers and computer processors have allowed computers, mobile phones, and other home gadgets to become indispensable components of modern society.

Electric vehicles are receiving more attention from the market-leading automotive sector as a means of lowering vehicle emissions. Governments, as well as environmental organizations, are attempting to implement emission rules and laws in response to increasing concerns about the environment, which may increase the cost of producing electric drive trains and fuel-efficient engines in the coming years. In addition, the need for semiconductors is increasing due to the region's expanding automobile industry, which uses semiconductors mostly as equipment. Because of this, the market in the North American region is expected to grow rapidly in the years to come.

The US market dominated the North America 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $15,934.3 Million by 2029. The Canada market is poised to grow at a CAGR of 11.9% during (2023 - 2029). Additionally, The Mexico market would witness a CAGR of 10.9% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into U.S., Mexico, Canada, and Rest of North America.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments covered in the Report:

By Packaging Technology

• 2.5D
• 3D wafer-level chip-scale packaging (WLCSP)
• 3D Through-silicon via (TSV)

By End User

• Consumer Electronics
• Automotive
• Industrial
• Military & Aerospace
• Telecommunications
• Medical Devices & Others

By Application

• Memory
• Imaging & Optoelectronics
• MEMS/Sensors
• Logic
• LED
• Others

By Country

• US
• Canada
• Mexico
• Rest of North America

Companies Profiled

• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company Limited
• Intel Corporation
• ASE Group (ASE Technology Holding Co., Ltd.)
• Amkor Technology, Inc.
• Broadcom, Inc.
• Texas Instruments, Inc.
• JCET Group
• Powertech Technology, Inc.
• United Microelectronics Corporation

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