Global Thermal Management Technologies Market Size, Share & Trends Analysis Report By Material (Adhesive Material, and Non-adhesive Material), By Device, By Service, By End-use, By Regional Outlook and Forecast, 2024 - 2031

Global Thermal Management Technologies Market Size, Share & Trends Analysis Report By Material (Adhesive Material, and Non-adhesive Material), By Device, By Service, By End-use, By Regional Outlook and Forecast, 2024 - 2031

The Global Thermal Management Technologies Market size is expected to reach $27.4 billion by 2031, rising at a market growth of 9.9% CAGR during the forecast period.

Europe has grown strongly due to increasing investments in renewable energy systems, electric vehicles, and stringent environmental regulations promoting energy efficiency. Countries like Germany, the UK, and France are heavily investing in smart manufacturing and green technologies, which require robust thermal management solutions to ensure operational efficiency and sustainability. The Europe segment witnessed 30% revenue share in the market in 2023. The region's focus on achieving climate-neutral targets has accelerated the adoption of advanced cooling technologies, contributing to Europe's significant market share.

The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2024, Parker Hannifin Corporation unveiled the Hyperchill Plus-E, an eco-friendly industrial process chiller designed for HVAC, manufacturing, life sciences, oil and gas, and renewable energy applications. Additionally, In June, 2024, Delta Electronics, Inc. unveiled its advanced energy-efficient solutions for AI under the theme "Discovering Delta's Cloud to Edge AI." Highlights include ORV3-compliant 66kW and 33kW server power shelves with up to 97.5% efficiency and innovative vertical power delivery for AI accelerators.

Based on the Analysis presented in the KBV Cardinal matrix; Siemens AG is the forerunner in the Thermal Management Technologies Market. In June, 2024, Siemens AG unveiled Calibre 3D Thermal software for advanced thermal analysis of 3D integrated circuits (ICs). This tool addresses the EDA gap for 3D ICs, which stack silicon layers to boost performance and minimize footprint. Companies such as Honeywell International Inc., Eaton Corporation plc, and Parker Hannifin Corporation are some of the key innovators in Thermal Management Technologies Market.

Market Growth Factors

With the rapid evolution of technology, devices such as smartphones, laptops, tablets, and wearable devices are becoming increasingly powerful. As processing power and functionality increase, these devices generate more heat during operation. For instance, modern smartphones and laptops' high-performance processors and GPUs can run complex applications, including gaming, video editing, and AI-based tasks, which generate significant heat. Hence, it is anticipated that the demand for compact and efficient thermal management solutions will increase as consumer electronics continue to dominate markets.

Industries such as aerospace, defense, and healthcare have been revolutionized by advancements in the miniaturization of electronic components, which have enabled the development of more compact and efficient devices. However, as components shrink, they generate more heat in a smaller area, increasing the thermal management challenge. Similarly, in consumer electronics, Apple has adopted graphene-based heat spreaders in its iPhone 13 to dissipate heat from its internal components, ensuring optimal performance without compromising on the device’s slim design. Thus, advancements in miniaturization are significantly aiding in the expansion of the market.

Market Restraining Factors

Many thermal management technologies depend on specialized materials like phase-change materials (PCMs), graphene, and advanced heat sinks, offering superior thermal conductivity and heat dissipation properties. However, the production and procurement of these materials are costly, especially compared to traditional alternatives like aluminum or copper. For instance, phase-change materials, which can absorb and release large amounts of latent heat, are highly effective in managing temperature spikes. Thus, the high cost of thermal management technologies presents a significant challenge to widespread adoption.

The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Product Launches and Product Expansions.

Material Outlook

Based on material, the market is bifurcated into adhesive material and non-adhesive material. The non-adhesive material segment procured 42% revenue share in the market in 2023. Non-adhesive materials, including heat sinks, liquid cooling systems, and thermal interface materials (TIMs), are crucial for managing heat in larger applications such as industrial machinery, data centers, and electric vehicles. These materials are vital for environments that require high thermal conductivity and durable performance without adhesive properties.

Device Outlook

On the basis of device, the market is classified into conduction cooling device, convection cooling device, advanced cooling device, and others. The conduction cooling device segment acquired 42% revenue share in the market in 2023. This can be attributed to the widespread use of conduction cooling systems in various applications, where direct heat transfer through solid materials is efficient and cost-effective.

Service Outlook

By service, the market is divided into installation & calibration and optimization & post sales service. The optimization & post sales service segment garnered 42% revenue share in the market in 2023. This segment focuses on the ongoing maintenance, performance optimization, and after-sales support of thermal management systems to ensure they function efficiently. As industries strive to extend the lifespan of their equipment and reduce operational costs, there has been a growing demand for services that optimize cooling systems over time.

End-use Outlook

Based on end-use, the market is segmented into consumer electronics, service & data centers, automotive, healthcare, and others. The consumer electronics segment procured 41% revenue share in the market in 2023. The growing demand for effective thermal management solutions in devices such as smartphones, laptops, tablets, and wearable technologies is the primary factor driving the segment's expansion. The management of heat has become increasingly important in order to ensure the longevity, performance, and battery life of electronic devices as they become more compact and potent.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The North America segment recorded 36% revenue share in the market in 2023. In the United States and Canada, the region's dominance is primarily due to the pervasive adoption of advanced technologies in sectors such as data centers, electric vehicles, and consumer electronics. The demand for thermal management solutions has been significantly bolstered by the increase in industrial automation and high-performance computing, as well as the strong presence of leading market participants.

Market Competition and Attributes

The thermal management technologies market is highly competitive, driven by increasing demand across industries like electronics, automotive, and aerospace. Key factors include the need for efficient cooling solutions as devices become smaller and more powerful, especially in data centers, electric vehicles, and 5G infrastructure. Major players focus on innovations in heat sinks, liquid cooling, and phase-change materials to gain a competitive edge and meet rising performance standards.

Recent Strategies Deployed in the Market

• Jun-2024: ANSYS, Inc. teamed up with Intel Foundry's USMAG Alliance to enhance chip design for national security and government needs. Ansys will optimize its simulation tools for Intel’s process design kits, focusing on advanced thermal management with the RedHawk-SC platform to address challenges from Intel 18A's PowerVia technology.
• May-2024: Eaton Corporation plc announced the acquisition of Exertherm, a condition monitoring solutions company to boost its Brightlayer software suite with advanced thermal monitoring solutions. Exertherm’s technology enhances protection for low- and medium-voltage switchgear and motor control centers. This acquisition supports Eaton’s focus on sustainable power management and digitalization.
• Mar-2024: Schneider Electric SE is opening a new facility cooling factory in Bangalore, covering 6.5 acres with an investment of Rs 100 Crores (~10M Euro). The facility will focus on innovative cooling solutions, primarily for data centers. 85% of its products will be exported, serving the Datacenter, Building, Industry, and Infrastructure sectors.
• Mar-2024: Honeywell International Inc. unveiled the F-35’s Power and Thermal Management System (PTMS) cooling capacity to 80kW, surpassing the previous 32kW requirement. As the PTMS supplier for 20 years, Honeywell is now ideally positioned to support future mission system upgrades and modernization needs.
• Jan-2024: Delta Electronics, Inc. teamed up with Ceres Power for approximately £43 million to access Ceres' hydrogen energy stack technology. This aims to integrate Ceres' solid oxide fuel cell and electrolysis technology with Delta’s power electronics, enhancing green solutions for various sectors and starting production by late 2026.

List of Key Companies Profiled

• Schneider Electric SE
• Delta Electronics, Inc.
• Honeywell International Inc.
• Siemens AG
• STMicroelectronics N.V.
• 3M Company
• Vertiv Holdings Co.
• Eaton Corporation plc
• ANSYS, Inc.
• Parker Hannifin Corporation

Global Thermal Management Technologies Market Report Segmentation

By Material

• Adhesive Material
• Non-adhesive Material

By Device

• Conduction Cooling Device
• Convection Cooling Devices
• Advanced Cooling Devices
• Other Device

By Service

• Installation & Calibration
• Optimization & Post Sales Service

By End-use

• Consumer Electronics
• Service & Data Centers
• Automotive
• Healthcare
• Other End-use

By Geography

• North America
• US
• Canada
• Mexico
• Rest of North America
• Europe
• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe
• Asia Pacific
• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific
• LAMEA
• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA