Global Polyamide-imide Market Size, Share & Industry Trends Analysis Report By Application (Molding Resins, Wire Enamels, Coating, Fiber, and Others), By Regional Outlook and Forecast, 2023 - 2030
The Global Polyamide-imide Market size is expected to reach $1.1 billion by 2030, rising at a market growth of 7.5% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,69,296.7 Tonnes, experiencing a growth of 6.7% (2019-2022).
The wire enamels segment acquired a prominent revenue share in the market in 2022. Consequently, the wire enamels segment captured $23.6 Million revenue in the market in 2022. They are primarily used to provide electrical insulation. They create a barrier between the conductor (copper or aluminum wire) and its surroundings, preventing short circuits and ensuring the safe transmission of electrical current. Wire enamels are used in various electrical and electronic products, including motors, transformers, coils, solenoids, and other components. The choice of wire enamel depends on the application's specific requirements, including temperature, voltage, and environmental conditions, to ensure that the wire offers optimal electrical performance and longevity. Some of the factors impacting the market are ongoing research and development, sustainability and lightweighting of PAI and rising health and safety concerns.
Ongoing R&D has led to the development of new PAI formulations with enhanced properties. Researchers have focused on improving thermal stability, mechanical strength, chemical resistance, and electrical insulation. These advancements have made PAI more versatile and suitable for various applications. This has led to its adoption in industries and products that may not have been traditionally used. For example, the development of PAI composites has expanded its utility in aerospace, automotive, and consumer goods. R&D initiatives have focused on finding ways to produce PAI more cost-effectively. PAI materials are known for their durability, which can expand the lifespan of components and reduce the need for replacements. This longevity contributes to sustainability efforts by reducing waste and conserving resources. The lightweight properties of PAI are crucial for applications where weight reduction is a priority. Efforts are ongoing to develop recyclable PAI materials or find ways to recycle existing PAI components. Customers are becoming more environmentally conscious and choosing lightweight, energy-efficient, and sustainable products. This demand drives manufacturers to seek materials like PAI that align with these preferences. Sustainability and light-weighting efforts are expected to continue shaping the market's future.
However, the manufacturing process of PAI may involve using certain chemicals and high-temperature processes, which can result in the emission of potentially hazardous substances. Controlling and mitigating these emissions is a critical health and safety consideration. Workers involved in producing, machining, or processing PAI materials may be exposed to chemicals and fumes that could pose health risks. Proper security measures, including personal protective equipment and adequate ventilation, are essential to protect worker health. Machining or cutting PAI materials can generate fine dust or particulate matter. Misuse of PAI materials in incompatible environments can lead to safety risks. Proper disposal and recycling of PAI waste materials are necessary to prevent environmental contamination and harm to waste management workers. Due to several health and safety concerns, the market growth will decline in the coming years.
Application Outlook
On the basis of application, the market is segmented into molding resins, wire enamels, coating, fiber, and others. In 2022, the molding resins segment dominated the market with the maximum revenue share. Molding resins come in various types, each with unique properties. This versatility allows manufacturers to choose a resin that aligns with their specific needs, whether for strength, flexibility, heat resistance, or other characteristics. Molding resins can provide excellent dimensional stability, meaning the final products maintain their shape and size even when subjected to varying temperatures or mechanical stress. Molding resins can be tailored to meet specific requirements, allowing customization of the material's properties and performance characteristics.
Regional Outlook
Region-wise, the market is analysed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific region held the highest revenue share in the market. The growth of the market in Asia Pacific has been driven by a combination of increasing industrialization, demand for high-performance materials, and a focus on research and development. The shifting trend towards lightweight components in automotive can be attributed to a cost-efficient strategy by the logistics division of various automotive industry players. In addition, surging demand for power-efficient materials in the electrical & electronics industry is expected to drive PAI demand over the forecast period.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Solvay SA, Swicofil AG, Kermel, Toyobo Co., Ltd., LG Innotek Co Ltd (LG Display), Fujifilm Holdings Corporation, Huntsman Corporation, Ensinger GmbH, Hitachi, Ltd. and Mitsubishi Chemical Holdings Corporation.
Scope of the Study
Market Segments covered in the Report:
By Application (Volume, Tonnes, USD Million, 2019-30)
- Molding Resins
- Wire Enamels
- Coating
- Fiber
- Others
By Geography (Volume, Tonnes, USD Million, 2019-30)
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Singapore
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Companies Profiled
- Solvay SA
- Swicofil AG
- Kermel
- Toyobo Co., Ltd.
- LG Innotek Co Ltd (LG Display)
- Fujifilm Holdings Corporation
- Huntsman Corporation
- Ensinger GmbH
- Hitachi, Ltd.
- Mitsubishi Chemical Holdings Corporation
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