Global DRAM Market Size, Share & Trends Analysis Report By Technology (DDR4, DDR5 and Others), By Type, By Application (Mobile Phones, Gaming Console, Automotive, PCs/Laptops, and Others), By Regional Outlook and Forecast, 2024 - 2031

Global DRAM Market Size, Share & Trends Analysis Report By Technology (DDR4, DDR5 and Others), By Type, By Application (Mobile Phones, Gaming Console, Automotive, PCs/Laptops, and Others), By Regional Outlook and Forecast, 2024 - 2031


The Global DRAM Market size is expected to reach $163.5 billion by 2031, rising at a market growth of 6.3% CAGR during the forecast period.

Modern vehicles increasingly rely on electronic systems for infotainment, advanced driver assistance systems (ADAS), navigation, telematics, and connectivity features. These systems require robust memory solutions like DRAM to ensure smooth operation and quick data access. Consequently, the automotive segment would acquire nearly 11% of the total market share by 2031. According to the International Trade Administration (ITA), the gross domestic product (GDP) of South Africa's automotive industry as a whole was 4.3% in 2021 (2.4% manufacturing and 1.9% retail). Thus, owing to these factors, there will be enhanced demand in the segment.

Cloud computing services have completely changed how companies handle, store, and use data. As infrastructure moves more and more toward the cloud, servers and data centers are becoming increasingly essential to managing the large amounts of data that users create as they access apps, store files, and perform activities on the cloud. Big data analytics also includes handling and examining huge datasets to find insightful patterns and information that can guide corporate choices and spur innovation. Because this RAM provides the high-speed memory needed to quickly access and manipulate massive datasets, it is essential to developing real-time data processing and analytics applications. Therefore, these factors will assist in the expansion of the market. Additionally, The infotainment systems found in modern cars are very advanced and provide many capabilities, including internet access, smartphone integration, multimedia playing, and navigation. Additionally, connected vehicles rely on in-vehicle networking technologies, such as Controller Area Network (CAN), Ethernet, and FlexRay, to facilitate communication between various vehicle systems and components, including sensors, ECUs (electronic control units), and infotainment systems. Therefore, these aspects will pose lucrative growth prospects for the market.

However, establishing a DRAM fabrication facility (fab) requires a massive initial investment, often running into billions of dollars. Moreover, manufacturing benefits significantly from economies of scale, wherein larger production volumes help spread fixed costs over a greater number of units, leading to lower per-unit costs. Hence, owing to these factors, there will be reduced demand in the upcoming years.

Technology Outlook

On the basis of technology, the market is divided into DDR4, DDR5, and others. In 2023, the DDR5 segment witnessed a 20% revenue share in the market. DDR5 offers several enhancements over DDR4, including increased bandwidth, higher densities, and improved power efficiency. These improvements are particularly significant in high-performance computing applications, such as data centers, where faster memory access can translate into tangible performance gains. Hence, these aspects will pose lucrative growth prospects for the segment.

Type Outlook

Based on type, the market is segmented into double data rate SDRAM, Rambus DRAM, fast page mode DRAM, extended data out DRAM, and others. In 2023, the rambus DRAM segment garnered a 12.2% revenue share in the market. Despite its decline in the mainstream market, RDRAM still finds niche applications in specialized industries where its unique characteristics, such as high bandwidth and low latency, are particularly advantageous. These include areas like high-performance computing, networking equipment, and certain types of graphics processing. Hence, these factors can assist in the growth of the segment.

Application Outlook

Based on application, the market is divided into gaming console, PCs/laptops, automotive, mobile phones, and others. In 2023, the PCs/laptops segment witnessed 26.5% revenue share in the market. PCs and laptops are increasingly used for high-performance computing tasks such as video editing, 3D rendering, software development, and data analysis. These tasks require substantial amounts of memory bandwidth and capacity to process large datasets and perform complex computations efficiently. This RAM enables PCs and laptops to handle these demanding workloads with ease, improving productivity and reducing time-to-completion for critical tasks.

Regional Outlook

By region, the market is segmented into North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment procured 43.5% revenue share in the market in 2023. The demand for chips is rising rapidly in the Asia Pacific region, mostly due to growth in the data center, consumer electronics, automotive, and telecommunications sectors. With the proliferation of smartphones, tablets, and other electronic devices, there's a constant need for memory solutions, which boosts the demand. Hence, these factors can help in the growth of the segment.

DRAM Market Report Coverage:

Report Attribute Details

Market size value in 2023 USD 101.5 Billion

Market size forecast in 2031 USD 163.5 Billion

Base Year 2023

Historical period 2020 to 2022

Forecast Period 2024 to 2031

Revenue Growth Rate CAGR of 6.3% from 2024 to 2031

Number of Pages 259

Tables 390

Report Coverage Market Trends, Revenue Estimation and Forecast, Segmentation Analysis, Regional and Country Breakdown, Market Share Analysis, Porter’s 5 Forces Analysis, Company Profiling, Companies Strategic Developments, SWOT Analysis, Winning Imperatives

Segments Covered Technology, Type, Application, Region

Country Scope
  • North America (US, Canada, Mexico, and Rest of North America)
    • Europe (Germany, UK, France, Russia, Spain, Italy, and Rest of Europe)
    • Asia Pacific (China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific)
    • LAMEA (Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA)
    Companies Included Samsung Electronics Co., Ltd. (Samsung Group), Micron Technology, Inc., SK hynix, Inc., Transcend Information, Inc., Nanya Technology Corporation, Powerchip Technology Corporation, Winbond Electronics Corporation, Infineon Technologies AG, Kingston Technology Company, Inc. and Intel Corporation

    Recent Strategies Deployed in the Market
    • Jan-2024: Micron Technology, Inc. partnered with NAMTECH, a leading semiconductor company specializing in advanced nanotechnology solutions for various industries. Through this partnership, Micron would be able utilize India's robust talent pool in the semiconductor industry, expanding our reach both locally and internationally.
    • May-2023: Infineon Technologies AG took over Imagimob AB, a Swedish company specializing in developing edge-AI solutions for wearable and sensor-driven applications. Through this acquisition, Infineon would empower clients to harness AI/ML benefits and expedite product launches by leveraging its sophisticated sensor technology and IoT solutions.
    • Apr-2022: Winbond Electronics entered into a partnership with Infineon Technologies, a dominant player in the global semiconductor, microelectronics and IoT solutions market. Under this partnership, the companies announced the expansion of their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0. The HYPERRAM product range provides compact options to conventional pseudo-SRAM and is perfect for low power, space-constrained IoT applications that need off-chip external RAM. HYPERRAM 3.0 functions at a maximum frequency of 200MHz with a 1.8V operation voltage, which is equal to both HYPERRAM 2.0 and OCTAL xSPI RAM, however, with an improved data-transfer rate of 800MBps – double the rate that was previously present.
    • Jun-2021: Kingston Technology entered into a partnership with Digi-Key Electronics, a company that provides the biggest selection of electronic components in stock for immediate shipment. Under this partnership, Digi-Key Electronics aimed to provide a broad range of embedded memory and storage solutions to its customers. The partnership also enabled Kingston to increase its presence in the design engineering community.
    • May-2021: Samsung unveiled S2FPD01, S2FPD02, and S2FPC01, the market's foremost integrated power management ICs (PMICs) for the fifth-generation double data rate (DDR5) dual in-line memory module (DIMM). The new PMICs have improved power efficiency and low output ripple voltage, which enables data centers, enterprise servers, and PC applications to fully squeeze their DDR5 performance for incredibly demanding, memory-intensive tasks.
    List of Key Companies Profiled
    • Samsung Electronics Co., Ltd. (Samsung Group)
    • Micron Technology, Inc.
    • SK hynix, Inc.
    • Transcend Information, Inc.
    • Nanya Technology Corporation
    • Powerchip Technology Corporation
    • Winbond Electronics Corporation
    • Infineon Technologies AG
    • Kingston Technology Company, Inc.
    • Intel Corporation
    Global DRAM Market Report Segmentation

    By Technology
    • DDR4
    • DDR5
    • Others
    By Type
    • Double Data Rate SDRAM
    • Rambus DRAM
    • Fast Page Mode DRAM
    • Extended Data Out DRAM
    • Others
    By Application
    • Mobile Phones
    • Gaming Console
    • Automotive
    • PCs/Laptops
    • Others
    By Geography
    • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
    • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
    • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Singapore
    • Malaysia
    • Rest of Asia Pacific
    • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA


    Chapter 1. Market Scope & Methodology
    1.1 Market Definition
    1.2 Objectives
    1.3 Market Scope
    1.4 Segmentation
    1.4.1 Global DRAM Market, by Technology
    1.4.2 Global DRAM Market, by Type
    1.4.3 Global DRAM Market, by Application
    1.4.4 Global DRAM Market, by Geography
    1.5 Methodology for the research
    Chapter 2. Market at a Glance
    2.1 Key Highlights
    Chapter 3. Market Overview
    3.1 Introduction
    3.1.1 Overview
    3.1.1.1 Market Composition and Scenario
    3.2 Key Factors Impacting the Market
    3.2.1 Market Drivers
    3.2.2 Market Restraints
    3.2.3 Market Opportunities
    3.2.4 Market Challenges:
    Chapter 4. Competition Analysis – Global Leaders
    4.1 Market Share Analysis, 2023
    4.2 Porter Five Forces Analysis
    4.3 Strategies Deployed in DRAM Market
    Chapter 5. Global DRAM Market by Technology
    5.1 Global DDR4 Market by Region
    5.2 Global DDR5 Market by Region
    5.3 Global Others Market by Region
    Chapter 6. Global DRAM Market by Type
    6.1 Global Double Data Rate SDRAM Market by Region
    6.2 Global Rambus DRAM Market by Region
    6.3 Global Fast Page Mode DRAM Market by Region
    6.4 Global Extended Data Out DRAM Market by Region
    6.5 Global Others Market by Region
    Chapter 7. Global DRAM Market by Application
    7.1 Global Mobile Phones Market by Region
    7.2 Global Gaming Console Market by Region
    7.3 Global Automotive Market by Region
    7.4 Global PCs/Laptops Market by Region
    7.5 Global Others Market by Region
    Chapter 8. Global DRAM Market by Region
    8.1 North America DRAM Market
    8.1.1 North America DRAM Market by Technology
    8.1.1.1 North America DDR4 Market by Country
    8.1.1.2 North America DDR5 Market by Country
    8.1.1.3 North America Others Market by Country
    8.1.2 North America DRAM Market by Type
    8.1.2.1 North America Double Data Rate SDRAM Market by Country
    8.1.2.2 North America Rambus DRAM Market by Country
    8.1.2.3 North America Fast Page Mode DRAM Market by Country
    8.1.2.4 North America Extended Data Out DRAM Market by Country
    8.1.2.5 North America Others Market by Country
    8.1.3 North America DRAM Market by Application
    8.1.3.1 North America Mobile Phones Market by Country
    8.1.3.2 North America Gaming Console Market by Country
    8.1.3.3 North America Automotive Market by Country
    8.1.3.4 North America PCs/Laptops Market by Country
    8.1.3.5 North America Others Market by Country
    8.1.4 North America DRAM Market by Country
    8.1.4.1 US DRAM Market
    8.1.4.1.1 US DRAM Market by Technology
    8.1.4.1.2 US DRAM Market by Type
    8.1.4.1.3 US DRAM Market by Application
    8.1.4.2 Canada DRAM Market
    8.1.4.2.1 Canada DRAM Market by Technology
    8.1.4.2.2 Canada DRAM Market by Type
    8.1.4.2.3 Canada DRAM Market by Application
    8.1.4.3 Mexico DRAM Market
    8.1.4.3.1 Mexico DRAM Market by Technology
    8.1.4.3.2 Mexico DRAM Market by Type
    8.1.4.3.3 Mexico DRAM Market by Application
    8.1.4.4 Rest of North America DRAM Market
    8.1.4.4.1 Rest of North America DRAM Market by Technology
    8.1.4.4.2 Rest of North America DRAM Market by Type
    8.1.4.4.3 Rest of North America DRAM Market by Application
    8.2 Europe DRAM Market
    8.2.1 Europe DRAM Market by Technology
    8.2.1.1 Europe DDR4 Market by Country
    8.2.1.2 Europe DDR5 Market by Country
    8.2.1.3 Europe Others Market by Country
    8.2.2 Europe DRAM Market by Type
    8.2.2.1 Europe Double Data Rate SDRAM Market by Country
    8.2.2.2 Europe Rambus DRAM Market by Country
    8.2.2.3 Europe Fast Page Mode DRAM Market by Country
    8.2.2.4 Europe Extended Data Out DRAM Market by Country
    8.2.2.5 Europe Others Market by Country
    8.2.3 Europe DRAM Market by Application
    8.2.3.1 Europe Mobile Phones Market by Country
    8.2.3.2 Europe Gaming Console Market by Country
    8.2.3.3 Europe Automotive Market by Country
    8.2.3.4 Europe PCs/Laptops Market by Country
    8.2.3.5 Europe Others Market by Country
    8.2.4 Europe DRAM Market by Country
    8.2.4.1 Germany DRAM Market
    8.2.4.1.1 Germany DRAM Market by Technology
    8.2.4.1.2 Germany DRAM Market by Type
    8.2.4.1.3 Germany DRAM Market by Application
    8.2.4.2 UK DRAM Market
    8.2.4.2.1 UK DRAM Market by Technology
    8.2.4.2.2 UK DRAM Market by Type
    8.2.4.2.3 UK DRAM Market by Application
    8.2.4.3 France DRAM Market
    8.2.4.3.1 France DRAM Market by Technology
    8.2.4.3.2 France DRAM Market by Type
    8.2.4.3.3 France DRAM Market by Application
    8.2.4.4 Russia DRAM Market
    8.2.4.4.1 Russia DRAM Market by Technology
    8.2.4.4.2 Russia DRAM Market by Type
    8.2.4.4.3 Russia DRAM Market by Application
    8.2.4.5 Spain DRAM Market
    8.2.4.5.1 Spain DRAM Market by Technology
    8.2.4.5.2 Spain DRAM Market by Type
    8.2.4.5.3 Spain DRAM Market by Application
    8.2.4.6 Italy DRAM Market
    8.2.4.6.1 Italy DRAM Market by Technology
    8.2.4.6.2 Italy DRAM Market by Type
    8.2.4.6.3 Italy DRAM Market by Application
    8.2.4.7 Rest of Europe DRAM Market
    8.2.4.7.1 Rest of Europe DRAM Market by Technology
    8.2.4.7.2 Rest of Europe DRAM Market by Type
    8.2.4.7.3 Rest of Europe DRAM Market by Application
    8.3 Asia Pacific DRAM Market
    8.3.1 Asia Pacific DRAM Market by Technology
    8.3.1.1 Asia Pacific DDR4 Market by Country
    8.3.1.2 Asia Pacific DDR5 Market by Country
    8.3.1.3 Asia Pacific Others Market by Country
    8.3.2 Asia Pacific DRAM Market by Type
    8.3.2.1 Asia Pacific Double Data Rate SDRAM Market by Country
    8.3.2.2 Asia Pacific Rambus DRAM Market by Country
    8.3.2.3 Asia Pacific Fast Page Mode DRAM Market by Country
    8.3.2.4 Asia Pacific Extended Data Out DRAM Market by Country
    8.3.2.5 Asia Pacific Others Market by Country
    8.3.3 Asia Pacific DRAM Market by Application
    8.3.3.1 Asia Pacific Mobile Phones Market by Country
    8.3.3.2 Asia Pacific Gaming Console Market by Country
    8.3.3.3 Asia Pacific Automotive Market by Country
    8.3.3.4 Asia Pacific PCs/Laptops Market by Country
    8.3.3.5 Asia Pacific Others Market by Country
    8.3.4 Asia Pacific DRAM Market by Country
    8.3.4.1 China DRAM Market
    8.3.4.1.1 China DRAM Market by Technology
    8.3.4.1.2 China DRAM Market by Type
    8.3.4.1.3 China DRAM Market by Application
    8.3.4.2 Japan DRAM Market
    8.3.4.2.1 Japan DRAM Market by Technology
    8.3.4.2.2 Japan DRAM Market by Type
    8.3.4.2.3 Japan DRAM Market by Application
    8.3.4.3 India DRAM Market
    8.3.4.3.1 India DRAM Market by Technology
    8.3.4.3.2 India DRAM Market by Type
    8.3.4.3.3 India DRAM Market by Application
    8.3.4.4 South Korea DRAM Market
    8.3.4.4.1 South Korea DRAM Market by Technology
    8.3.4.4.2 South Korea DRAM Market by Type
    8.3.4.4.3 South Korea DRAM Market by Application
    8.3.4.5 Singapore DRAM Market
    8.3.4.5.1 Singapore DRAM Market by Technology
    8.3.4.5.2 Singapore DRAM Market by Type
    8.3.4.5.3 Singapore DRAM Market by Application
    8.3.4.6 Malaysia DRAM Market
    8.3.4.6.1 Malaysia DRAM Market by Technology
    8.3.4.6.2 Malaysia DRAM Market by Type
    8.3.4.6.3 Malaysia DRAM Market by Application
    8.3.4.7 Rest of Asia Pacific DRAM Market
    8.3.4.7.1 Rest of Asia Pacific DRAM Market by Technology
    8.3.4.7.2 Rest of Asia Pacific DRAM Market by Type
    8.3.4.7.3 Rest of Asia Pacific DRAM Market by Application
    8.4 LAMEA DRAM Market
    8.4.1 LAMEA DRAM Market by Technology
    8.4.1.1 LAMEA DDR4 Market by Country
    8.4.1.2 LAMEA DDR5 Market by Country
    8.4.1.3 LAMEA Others Market by Country
    8.4.2 LAMEA DRAM Market by Type
    8.4.2.1 LAMEA Double Data Rate SDRAM Market by Country
    8.4.2.2 LAMEA Rambus DRAM Market by Country
    8.4.2.3 LAMEA Fast Page Mode DRAM Market by Country
    8.4.2.4 LAMEA Extended Data Out DRAM Market by Country
    8.4.2.5 LAMEA Others Market by Country
    8.4.3 LAMEA DRAM Market by Application
    8.4.3.1 LAMEA Mobile Phones Market by Country
    8.4.3.2 LAMEA Gaming Console Market by Country
    8.4.3.3 LAMEA Automotive Market by Country
    8.4.3.4 LAMEA PCs/Laptops Market by Country
    8.4.3.5 LAMEA Others Market by Country
    8.4.4 LAMEA DRAM Market by Country
    8.4.4.1 Brazil DRAM Market
    8.4.4.1.1 Brazil DRAM Market by Technology
    8.4.4.1.2 Brazil DRAM Market by Type
    8.4.4.1.3 Brazil DRAM Market by Application
    8.4.4.2 Argentina DRAM Market
    8.4.4.2.1 Argentina DRAM Market by Technology
    8.4.4.2.2 Argentina DRAM Market by Type
    8.4.4.2.3 Argentina DRAM Market by Application
    8.4.4.3 UAE DRAM Market
    8.4.4.3.1 UAE DRAM Market by Technology
    8.4.4.3.2 UAE DRAM Market by Type
    8.4.4.3.3 UAE DRAM Market by Application
    8.4.4.4 Saudi Arabia DRAM Market
    8.4.4.4.1 Saudi Arabia DRAM Market by Technology
    8.4.4.4.2 Saudi Arabia DRAM Market by Type
    8.4.4.4.3 Saudi Arabia DRAM Market by Application
    8.4.4.5 South Africa DRAM Market
    8.4.4.5.1 South Africa DRAM Market by Technology
    8.4.4.5.2 South Africa DRAM Market by Type
    8.4.4.5.3 South Africa DRAM Market by Application
    8.4.4.6 Nigeria DRAM Market
    8.4.4.6.1 Nigeria DRAM Market by Technology
    8.4.4.6.2 Nigeria DRAM Market by Type
    8.4.4.6.3 Nigeria DRAM Market by Application
    8.4.4.7 Rest of LAMEA DRAM Market
    8.4.4.7.1 Rest of LAMEA DRAM Market by Technology
    8.4.4.7.2 Rest of LAMEA DRAM Market by Type
    8.4.4.7.3 Rest of LAMEA DRAM Market by Application
    Chapter 9. Company Profiles
    9.1 Samsung Electronics Co., Ltd. (Samsung Group)
    9.1.1 Company Overview
    9.1.2 Financial Analysis
    9.1.3 Segmental and Regional Analysis
    9.1.4 Research & Development Expenses
    9.1.5 Recent strategies and developments:
    9.1.5.1 Product Launches and Product Expansions:
    9.1.6 SWOT Analysis
    9.2 Micron Technology, Inc.
    9.2.1 Company Overview
    9.2.2 Financial Analysis
    9.2.3 Segmental and Regional Analysis
    9.2.4 Research & Development Expenses
    9.2.5 Recent strategies and developments:
    9.2.5.1 Partnerships, Collaborations, and Agreements:
    9.2.6 SWOT Analysis
    9.3 SK hynix, Inc.
    9.3.1 Company Overview
    9.3.2 Financial Analysis
    9.3.3 Recent strategies and developments:
    9.3.3.1 Product Launches and Product Expansions:
    9.3.4 SWOT Analysis
    9.4 Transcend Information, Inc.
    9.4.1 Company Overview
    9.4.2 Financial Analysis
    9.4.3 Regional Analysis
    9.4.4 Research & Development Expense
    9.4.5 SWOT Analysis
    9.5 Nanya Technology Corporation
    9.5.1 Company Overview
    9.5.2 Financial Analysis
    9.5.3 Research & Development Expenses
    9.5.4 SWOT Analysis
    9.6 Powerchip Technology Corporation
    9.6.1 Company Overview
    9.6.2 Financial Analysis
    9.6.3 Regional Analysis
    9.6.4 Research & Development Expenses
    9.7 Winbond Electronics Corporation
    9.7.1 Company Overview
    9.7.2 Financial Analysis
    9.7.3 Segmental and Regional Analysis
    9.7.4 Research & Development Expense
    9.7.5 Recent strategies and developments:
    9.7.5.1 Partnerships, Collaborations, and Agreements:
    9.7.6 SWOT Analysis
    9.8 Infineon Technologies AG
    9.8.1 Company Overview
    9.8.2 Financial Analysis
    9.8.3 Segmental and Regional Analysis
    9.8.4 Research & Development Expense
    9.8.5 Recent strategies and developments:
    9.8.5.1 Acquisition and Mergers:
    9.8.6 SWOT Analysis
    9.9 Kingston Technology Company, Inc.
    9.9.1 Company Overview
    9.9.2 Recent strategies and developments:
    9.9.2.1 Partnerships, Collaborations, and Agreements:
    9.9.3 SWOT Analysis
    9.10. Intel Corporation
    9.10.1 Company Overview
    9.10.2 Financial Analysis
    9.10.3 Segmental and Regional Analysis
    9.10.4 Research & Development Expenses
    9.10.5 SWOT Analysis
    Chapter 10. Winning imperatives of DRAM Market

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