Global Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Regional Outlook and Forecast, 2023 - 2030

Global Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Regional Outlook and Forecast, 2023 - 2030

The Global Board-to-Board Connectors Market size is expected to reach $17.5 billion by 2030, rising at a market growth of 6.2% CAGR during the forecast period. In the year 2022, the market attained a volume of 1,842.9 million units, experiencing a growth of 2.7% (2019-2022).

The demand for board-to-board connectors to facilitate connectivity between consumer electronics such as gadgets, sensors, and edge computing modules is growing as IoT devices and edge computing solutions become more widely used. Therefore, Consumer electronics segment would generate $3,943.7 million revenue in the market in 2022. As a result, there are potential for connectors that have certain qualities including low power consumption, secure connections, and durable designs for IoT and edge computing application.

The major strategies followed by the market participants are Product Launches as the key developmental strategy to keep pace with the changing demands of end users. For instance, In July, 2023, Japan Aviation Electronics Industry, Limited announced the launch of the WP55DK Series, a compact stacking type board-to-board (FPC) connector with power terminals. The launched product would be ideal for small wearable devices such as smart glasses and smartwatches. Moreover, In May, 2023, Molex, LLC launched 224G, the industry’s first chip-to-chip product offerings. The launched product would encircle next-gen cables, board-to-board connectors, backplanes, and near-ASIC connector-to-cable solutions working at speeds up to 224 Gbps-PAM4.

Based on the Analysis presented in the KBV Cardinal matrix; Amphenol Corporation and TE Connectivity Ltd. are the forerunners in the Market. In July, 2023, Kyocera Corporation unveiled 6893 Series connectors, to prevent the FPC/FFC deposits which could cause contact failure after insertion. Companies such as Kyocera Corporation, Omron Corporation, Hirose Electric Co., Ltd are some of the key innovators in the Market.

Source: KBV Research

Market Growth Factors

Continuous Technological Advances

The market for board-to-board connectors is significantly driven by swift technical improvements in several industries, including electronics and telecommunications. The use of sophisticated connectors is necessary to address the constantly growing connectivity demands due to the ongoing evolution of electronic devices and developments in numerous industries. Smartphones, tablets, and wearable technology are examples of consumer electronics continually developing new features and functionalities. Because of rapid advances in technology in several industries, there is an increasing requirement for them, which is assisting market expansion.

Rising number of data centers globally

Board-to-board connectors provide dependable connections for high-speed data transfer and computing in data center storage. Within a constrained physical space, data centers hold many servers and gadgets. Board-to-board connectors make it possible for connections to be made in small spaces, improving the data center's layout and airflow. Board-to-board connectors also make it possible to link several types of PCBs differently, making it easier to integrate specialist components and create custom solutions. The market for board-to-board connectors is anticipated to expand significantly due to the advantages of BTB connections in data centers and the expanding number of data centers globally.

Market Restraining Factors

Technical Complexity and challenges

Making sure that signals are sent with minimal loss, noise, and interference becomes increasingly important as data transfer rates rise. These difficulties are exacerbated by impedance control, reflection, insertion loss, crosstalk, noise, electromagnetic interference (EMI), skew, timing problems, material choice, and connection crosstalk. Delivering board-to-board connectors that satisfy the stringent demands of rapid data transfer systems depends on working with clients and considering the requirements of a certain application. The market's growth is anticipated to be slow throughout the forecast period due to these specific technical difficulties and complexities.

Type Outlook

By type, the market is segmented into pin headers, stacked header, shrouded header, and socket. The pin headers segment held the highest revenue share in the market in 2022. Pin headers are often more affordable compared to other kinds of board-to-board connectors. Due to their straightforward structure and design, they are competitively priced and extremely simple to produce. Because of their affordability, pin headers are frequently used in applications that call for several connectors or where cost is crucial. Pin headers are also user-friendly and simple to put together.

Pitch Outlook

On the basis of component, the market is fragmented into less than 1mm, 1mm to 2mm, and greater than 2mm. The less than 1mm segment garnered a significant revenue share in the market in 2022. Electronic equipment across various industries is increasingly becoming more miniature and compact. In order to accommodate the integration of components within constrained locations, board-to-board connectors with smaller pitch widths are required due to the rising need for smaller, lighter, and more portable systems. The compactness required for these miniature designs is provided by connectors with a pitch size of less than 1 mm.

Application Outlook

Based on end user, the market is segmented into consumer electronics, industrial automation, telecommunication, automotive, healthcare, and others. In 2022, the telecommunication segment procured a promising growth rate in the market. Especially in base stations & routers, board-to-board connectors are widely employed in communications equipment. High levels of flexibility are provided, and it is simple to update and increase capacity. Additionally, they enable different data rates and provide outstanding EMI shielding. Board-to-board interfaces will become even more crucial in communications applications as demand for larger bandwidths rises.

Regional Outlook

Region wise, the market is analysed across North America, Europe, Asia Pacific and LAMEA. In 2022, the Asia Pacific region led the market by generating the highest revenue share. The Asia Pacific region is home to many nations actively looking into smart manufacturing programs and implementing Industry 4.0 innovations. This includes incorporating automation, robotics, IoT, and data analytics into the production processes. Board-to-board connections are essential for enabling smooth connectivity and communication between various components in smart manufacturing systems, which is fuelling market expansion.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).

Partnerships, Collaborations & Agreements:

Apr-2023: HIROSE Electric Co., partnered with TraceParts, one of the world’s leading CAD-content platforms for Engineering. This partnership would release more than 10,000 ready-to-use 3D models for a variety of Hirose’s PCB mountable connectors.

May-2022: TE Connectivity Ltd. collaborated with Phoenix Contact, a manufacturer of industrial automation, interconnection, and interface solutions. Through this collaboration, both companies would develop M12 hybrid connectivity, a new Single Pair Ethernet. The launched product would align with the hybrid format defined by the International Electrotechnical Commission 63171-7 standard, which the IEC begins under the guidance of TE in 2021.

Product Launches and Product Expansions:

Jul-2023: Japan Aviation Electronics Industry, Limited announced the launch of the WP55DK Series, a compact stacking type board-to-board (FPC) connector with power terminals. The launched product would be ideal for small wearable devices such as smart glasses and smartwatches.

Jul-2023: Kyocera Corporation unveiled 6893 Series connectors. The launched product would provide a 2x improvement in foreign matter removal performance compared to its previous products, supporting to prevent the FPC/FFC deposits which could cause contact failure after insertion.

May-2023: Molex, LLC launched 224G, the industry’s first chip-to-chip product offerings. The launched product would encircle next-gen cables, board-to-board connectors, backplanes, and near-ASIC connector-to-cable solutions working at speeds up to 224 Gbps-PAM4.

Nov-2022: Hirose Electric Co., Ltd introduced BM55 Series, a newly released compact board-to-board/FPC connector. The launched product would integrate a current capacity of up to 5A along with a robustness and armored design despite its extremely small size.

Jun-2022: Molex, LLC unveiled the Molex Quad-Row Board-to-Board Connectors, highlighting the industry's first staggered-circuit layout for 30% space savings over typical connector designs. The launched product would provide product developers and device manufacturers flexibility and greater freedom to back up compact form factors, including smartphones, game consoles, smartwatches, wearables, and Augmented Reality/Virtual Reality (AR/VR) devices.

May-2022: Omron Corporation unveiled G9KB, a new high-voltage DC relay. The launched product would safely cut off the direct current in household storage systems which would increase capacity.

Dec-2021: Hirose Electric Co., Ltd unveiled GT50 Series, a 1mm pitch, small and robust wire-to-board connector. The launched product could be utilized for automotive applications because of its high heat resistance up to 125°C and robust design.

Sep-2021: TE Connectivity Ltd. unveiled the NanoRF Edge Launch connector, the single solution that could combine the RF above an optical interconnect for military and radar RF-embedded computing applications.

Feb-2021: Kyocera Corporation released 0.5mm-pitch floating board-to-board connector series. The launched product could float within ±0.85mm for easy and errorless mating.

Acquisitions and Mergers:

Dec-2021: Molex, LLC completed the acquisition of Keyssa Inc., a pioneer in high-speed contactless connectors. This acquisition would hasten Molex's strategy to further widen and diversify its micro-connector offerings with highly flexible, cable-free connectors for near-field, device-to-device applications.

Sep-2021: TE Connectivity Ltd. took over ERNI Group AG, a leading company in electronic connectivity for factory automation and automotive. Under this acquisition, ERNI accompanies TE’s wide connectivity product offerings, particularly in fine-pitch and high-speed connectors for factory automation, medical, automotive, and other industrial applications.

Scope of the Study

Market Segments covered in the Report:

By Type (Volume, Million Units, USD Million, 2019-2030)

• Pin Headers
• Stacked Header
• Shrouded Header
• Socket

By Pitch (Volume, Million Units, USD Million, 2019-2030)

• 1 mm to 2 mm
• Greater Than 2 mm
• Less Than 1 mm

By Application (Volume, Million Units, USD Million, 2019-2030)

• Consumer Electronics
• Automotive
• Industrial Automation
• Healthcare
• Telecommunication
• Others

By Geography (Volume, Million Units, USD Million, 2019-2030)

• North America
• US
• Canada
• Mexico
• Rest of North America
• Europe
• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe
• Asia Pacific
• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific
• LAMEA
• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA

Companies Profiled

• Amphenol Corporation
• TE Connectivity Ltd.
• Molex, LLC (Koch Industries, Inc.)
• Kyocera Corporation
• HARTING Technology Group
• Omron Corporation
• Japan Aviation Electronics Industry, Limited
• Hirose Electric Co., Ltd
• Samtec
• FIT Hon Teng Limited (Foxconn (Far East) Limited)

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