Global Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2), 5D/3D, and Other Type), By End User, By Regional Outlook and Forecast, 2024 - 2031

The Global Advanced Packaging Market size is expected to reach $73.16 billion by 2031, rising at a market growth of 9.2% CAGR during the forecast period.

Wafer level chip scale package (WLCSP) is unique because it involves packaging the semiconductor die at the wafer level, eliminating the need for a separate substrate. This reduces package size and height while maintaining excellent electrical and thermal performance. WLCSP is highly suitable for miniaturized devices such as sensors, MEMS, and compact consumer electronics like earbuds and fitness trackers. Hence, the wafer level CSP segment acquired 14% revenue share in the market in 2023. Its simplicity in manufacturing and the ability to produce ultra-thin, lightweight packages have made it a preferred choice for applications requiring high reliability and compact form factors. As IoT and wearable technologies expand, the demand for WLCSP will increase.

The semiconductor industry also relies on advanced packaging to support ongoing miniaturization trends. As transistor sizes continue to shrink, conventional packaging methods are insufficient to maintain connectivity and reliability. Innovative approaches, such as heterogeneous integration, which combines different types of chips into a single package, have become vital for achieving the high-density, high-performance designs required by modern devices. Additionally, the interplay between IoT and 5G further amplifies the need for innovative packaging solutions. IoT devices generate enormous volumes of data, while 5G networks facilitate their transmission with unprecedented speed and reliability. This synergy necessitates packaging technologies that provide enhanced thermal performance, signal integrity, and energy efficiency, enabling the seamless functioning of interconnected ecosystems. Therefore, the demand for advanced packaging will grow as the semiconductor industry expands and evolves.

However, the complexity of these manufacturing processes can present significant challenges to the industry. Longer production cycles are common, as advanced packaging requires multiple steps, including wafer-level packaging, die stacking, and advanced interconnect technologies. Each step must meet exacting standards, increasing the risk of defects during production. Even minor inaccuracies can lead to substantial losses, as flawed components may undermine the operational integrity of high-value electronic devices. These challenges may impede adoption, particularly for organizations that lack the requisite resources or expertise to navigate such complex processes. Moreover, the time and costs associated with troubleshooting and ensuring quality control further contribute to the overall burden. Thus, such issues may hamper the expansion of the market.

Type Outlook

Based on type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. The flip chip CSP segment procured 18% revenue share in the market in 2023. Flip chip chip scale package (CSP) integrates the chip and substrates in a small form factor, offering improved electrical performance compared to traditional wire-bonded packages. This technology is extensively employed in consumer electronics, particularly in smartphones, wearable devices, and Internet of Things (IoT) devices, where considerations of spatial limitations and cost-effectiveness are paramount.

End User Outlook

On the basis of end user, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. The consumer electronics segment recorded 36% revenue share in the market in 2023. The ever-growing demand for compact, high-performance devices such as smartphones, tablets, laptops, and wearable technology drives this dominance. The proliferation of IoT-enabled devices and the transition to 5G technology further accelerate the demand for advanced semiconductor solutions. In addition, consumer expectations for slimmer, lightweight devices with enhanced processing power and battery life fuel innovation in this segment. As consumer electronics evolve rapidly, the demand for advanced packaging solutions will remain robust.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific segment procured 46% revenue share in the market in 2023. This leadership is primarily attributed to the region's robust semiconductor manufacturing ecosystem, driven by countries like China, Taiwan, South Korea, and Japan. These nations are home to some of the largest semiconductor foundries and packaging companies, such as TSMC, Samsung, and ASE Technology, which significantly contribute to market growth. The region's adoption of cutting-edge packaging technologies has been spurred by the rising demand for consumer electronics, including laptops, cell phones, and wearable technology.

Recent Strategies Deployed in the Market

• Dec-2024: IBM introduced co-packaged optics to improve energy efficiency and bandwidth in AI computing. By integrating optical links onto chips and within data centers, this innovation reduces energy consumption by over 80%, boosting chip-to-chip communication and speeding up model training.
• Jun-2024: IBM Corporation and Rapidus have expanded their partnership to develop mass production technologies for chiplet packaging, focusing on 2nm-generation semiconductors. The collaboration aims to advance semiconductor packaging for high-performance systems, with research and manufacturing taking place at IBM's North American facilities.
• Apr-2024: Qualcomm Incorporated unveiled new AI-ready IoT platforms and the QCC730 Wi-Fi SoC at Embedded World 2024, emphasizing low-power, high-performance processing for industrial and consumer applications. These innovations enhance on-device AI, connectivity, and efficiency, supporting next-generation IoT solutions and digital transformation.
• Feb-2024: Intel Corporation and Cadence have teamed up to develop an advanced packaging flow using Intel’s EMIB technology. This collaboration streamlines the design process for multi-chiplet architectures, enhancing HPC, AI, and mobile computing, reducing design cycles, and ensuring efficient signoff.
• Dec-2023: Samsung Electronics Co., Ltd. (Samsung Semiconductor) has expanded its product offerings with advanced packaging solutions, including I-Cube and X-Cube technologies. These innovations integrate logic and memory semiconductors in 2.5D and 3D packages, enhancing performance, power efficiency, and cost-effectiveness, advancing beyond Moore's Law.

List of Key Companies Profiled

• Qualcomm Incorporated (Qualcomm Technologies, Inc.)
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Microchip Technology Incorporated
• Infineon Technologies AG
• Samsung Electronics Co., Ltd. (Samsung Group)
• Renesas Electronics Corporation
• VMware, Inc. (Broadcom Inc.)

Global Advanced Packaging Market Report Segmentation

By Type

• Flip-Chip Ball Grid Array
• Fan-out WLP
• Flip chip CSP
• Wafer level CSP
• 2.5D/3D
• Other Type

By End User

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End User

By Geography

• North America
• US
• Canada
• Mexico
• Rest of North America
• Europe
• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe
• Asia Pacific
• China
• Japan
• India
• South Korea
• Singapore
• Malaysia
• Rest of Asia Pacific
• LAMEA
• Brazil
• Argentina
• UAE
• Saudi Arabia
• South Africa
• Nigeria
• Rest of LAMEA