Global ASIC Chip Market Size, Share & Trends Analysis Report By Type (Semi- custom ASIC, Full custom ASIC, and Programmable ASIC), By End User, By Regional Outlook and Forecast, 2023 - 2030
The Global ASIC Chip Market size is expected to reach $35.5 billion by 2030, rising at a market growth of 8.2% CAGR during the forecast period.
The ever-growing demand for smartphones and tablets is a key driver for the consumer electronics segment. Thus, the consumer electronics segment acquired $2,683.1 million in 2022. ASICs are used in these devices for various functions, including signal processing, graphics rendering, and power management, contributing to enhanced performance and efficiency.
The major strategies followed by the market participants are Partnerships & Collaborations as the key developmental strategy to keep pace with the changing demands of end users. For instance, In Feb 2024, Intel Corporation signed a collaboration with Wipro to accelerate the development of advanced and innovative chip designs. Additionally, In, Jul 2022, Intel Corporation came into partnership with MediaTek to manufacture chips, leveraging the advanced process technologies offered by Intel Foundry Services (IFS).
Based on the Analysis presented in the KBV Cardinal matrix; Samsung Electronics Co., Ltd. and Taiwan Semiconductor Manufacturing Company Limited are the forerunners in the ASIC Chip Market. In Mar 2021, Samsung Electronics Co., Ltd. and Marvell Technology, Inc to accelerate the advancement of high-impact 5G solutions that provide a competitive advantage to their operators. Companies such as Texas Instruments, Inc., NVIDIA Corporation, and Infineon Technologies AG are some of the key innovators in Market.
Market Growth Factors
ASICs are known for their high performance and efficiency in specific applications. As industries demand faster and more specialized processing capabilities, ASICs are preferred to meet these performance requirements. Thus, these factors can assist in the growth of the market.
Additionally, ASICs can be designed to accelerate the computations commonly involved in AI and ML tasks, such as matrix multiplications and convolutions. This targeted optimization results in significantly higher performance than general-purpose processors that may not be as well-suited for these specific workloads. Therefore, these factors can assist in the growth of the market.
Market Restraining Factors
The substantial upfront costs associated with ASIC (application-specific integrated circuit) design and development can be a significant barrier for smaller companies or projects with limited budgets. Thus, owing to these factors, there will be reduced demand for ASIC chips in the coming years.
The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Partnerships & Collaborations.
By Type Analysis
Based on type, the market is segmented into semi-custom ASIC, programmable ASIC, and full custom ASIC. In 2022, the programmable ASIC segment garnered 18% revenue share in the market. Programmable logic devices, especially FPGAs, provide great flexibility and customization.
By End User Analysis
On the basis of end user, the market is divided into data processing systems, consumer electronics, telecommunication systems, aerospace subsystem & sensors, medical instrumentation, and others. The data processing systems segment recorded 34.2% revenue share in the market in 2022.
By Regional Analysis
By region, the market is segmented into North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific segment acquired 39% revenue share in the market. The Asia Pacific region, particularly countries like China, Japan, South Korea, and Taiwan, has been at the forefront of technology adoption and innovation.
The ASIC chip market is fiercely competitive across multiple sectors, including cryptocurrency mining, artificial intelligence, networking, and emerging technologies. Companies like BITMAIN Technologies Holding Company and Taiwan Semiconductor Manufacturing Company Limited vie for dominance in cryptocurrency mining, while tech giants such as NVIDIA, Intel, and Samsung Electronics Co., Ltd. compete vigorously in AI, networking, and telecommunications.
Recent Strategies Deployed in the Market
- Feb-2024: Intel Corporation signed a collaboration with Wipro, a multinational corporation specializing in information technology services, consulting, and business process outsourcing. Through this collaboration, both companies would accelerate the development of advanced and innovative chip designs. Moreover, the collaboration seeks to meet the increasing need for AI chip production, as companies compete to introduce products equipped with generative AI capabilities.
- Jun-2023: Advanced Micro Devices, Inc. launched AMD Versal™ Premium VP1902, a high-performance system-on-chip (SoC) designed for advanced computing and acceleration applications. The VP1902 adaptive SoC is a chipset-based solution that accelerates semiconductor design verification with double the capacity of its predecessor, enabling faster innovation and validation of ASICs and SoCs for rapid market deployment of next-gen technologies.
- Jul-2022: Intel Corporation came into partnership with MediaTek, a semiconductor company renowned for its innovative system-on-chip solutions for various electronic devices. Through this partnership, both companies would aim to manufacture chips, leveraging the advanced process technologies offered by Intel Foundry Services (IFS).
- Feb-2022: Advanced Micro Devices, Inc. took over Xilinx, a leading provider of adaptive and intelligent computing solutions, specializing in field-programmable gate arrays (FPGAs) and programmable logic devices. Through this acquisition, AMD and Xilinx would expedite their capacity to shape a new era of computing, offering an extensive range of adaptive computing platforms to drive diverse intelligent applications effectively.
- Nov-2021: ON Semiconductor Corporation and GT Advanced Technologies, a manufacturer of advanced materials and equipment for the solar and semiconductor industries. Through this acquisition, onsemi would be able to deliver comprehensive power solutions spanning from SiC crystal growth to fully integrated intelligent power modules.
- Advanced Micro Devices, Inc.
- Samsung Electronics Co., Ltd. (Samsung Group)
- ON Semiconductor Corporation
- Taiwan Semiconductor Manufacturing Company Limited
- NVIDIA Corporation
- Intel Corporation
- Infineon Technologies AG
- Texas Instruments, Inc.
- Seiko Epson Corporation
- BITMAIN Technologies Holding Company
By Type
- Semi- custom ASIC
- Full custom ASIC
- Programmable ASIC
- Data Processing Systems
- Telecommunication Systems
- Aerospace Subsystem & Sensors
- Consumer Electronics
- Medical Instrumentation
- Others
- North America
- US
- Canada
- Mexico
- Rest of North America
- Europe
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- Taiwan
- Malaysia
- Rest of Asia Pacific
- LAMEA
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
- Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Global ASIC Chip Market, by Type
- 1.4.2 Global ASIC Chip Market, by End User
- 1.4.3 Global ASIC Chip Market, by Geography
- 1.5 Methodology for the research
- Chapter 2. Market at a Glance
- 2.1 Key Highlights
- Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition and Scenario
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.2.3 Market Opportunities
- 3.2.4 Market Challenges
- Chapter 4. Competition Analysis - Global
- 4.1 KBV Cardinal Matrix
- 4.2 Recent Industry Wide Strategic Developments
- 4.2.1 Partnerships, Collaborations and Agreements
- 4.2.2 Product Launches and Product Expansions
- 4.2.3 Acquisition and Mergers
- 4.3 Market Share Analysis, 2022
- 4.4 Top Winning Strategies
- 4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
- 4.4.2 Key Strategic Move: (Partnerships, Collaborations & Agreements: 2024, Feb – 2019, Feb) Leading Players
- 4.5 Porter Five Forces Analysis
- Chapter 5. Global ASIC Chip Market by Type
- 5.1 Global Semi- custom ASIC Market by Region
- 5.2 Global Full custom ASIC Market by Region
- 5.3 Global Programmable ASIC Market by Region
- Chapter 6. Global ASIC Chip Market by End User
- 6.1 Global Data Processing Systems Market by Region
- 6.2 Global Telecommunication Systems Market by Region
- 6.3 Global Aerospace Subsystem & Sensors Market by Region
- 6.4 Global Consumer Electronics Market by Region
- 6.5 Global Medical Instrumentation Market by Region
- 6.6 Global Others Market by Region
- Chapter 7. Global ASIC Chip Market by Region
- 7.1 North America ASIC Chip Market
- 7.1.1 North America ASIC Chip Market by Type
- 7.1.1.1 North America Semi- custom ASIC Market by Country
- 7.1.1.2 North America Full custom ASIC Market by Country
- 7.1.1.3 North America Programmable ASIC Market by Country
- 7.1.2 North America ASIC Chip Market by End User
- 7.1.2.1 North America Data Processing Systems Market by Country
- 7.1.2.2 North America Telecommunication Systems Market by Country
- 7.1.2.3 North America Aerospace Subsystem & Sensors Market by Country
- 7.1.2.4 North America Consumer Electronics Market by Country
- 7.1.2.5 North America Medical Instrumentation Market by Country
- 7.1.2.6 North America Others Market by Country
- 7.1.3 North America ASIC Chip Market by Country
- 7.1.3.1 US ASIC Chip Market
- 7.1.3.1.1 US ASIC Chip Market by Type
- 7.1.3.1.2 US ASIC Chip Market by End User
- 7.1.3.2 Canada ASIC Chip Market
- 7.1.3.2.1 Canada ASIC Chip Market by Type
- 7.1.3.2.2 Canada ASIC Chip Market by End User
- 7.1.3.3 Mexico ASIC Chip Market
- 7.1.3.3.1 Mexico ASIC Chip Market by Type
- 7.1.3.3.2 Mexico ASIC Chip Market by End User
- 7.1.3.4 Rest of North America ASIC Chip Market
- 7.1.3.4.1 Rest of North America ASIC Chip Market by Type
- 7.1.3.4.2 Rest of North America ASIC Chip Market by End User
- 7.2 Europe ASIC Chip Market
- 7.2.1 Europe ASIC Chip Market by Type
- 7.2.1.1 Europe Semi- custom ASIC Market by Country
- 7.2.1.2 Europe Full custom ASIC Market by Country
- 7.2.1.3 Europe Programmable ASIC Market by Country
- 7.2.2 Europe ASIC Chip Market by End User
- 7.2.2.1 Europe Data Processing Systems Market by Country
- 7.2.2.2 Europe Telecommunication Systems Market by Country
- 7.2.2.3 Europe Aerospace Subsystem & Sensors Market by Country
- 7.2.2.4 Europe Consumer Electronics Market by Country
- 7.2.2.5 Europe Medical Instrumentation Market by Country
- 7.2.2.6 Europe Others Market by Country
- 7.2.3 Europe ASIC Chip Market by Country
- 7.2.3.1 Germany ASIC Chip Market
- 7.2.3.1.1 Germany ASIC Chip Market by Type
- 7.2.3.1.2 Germany ASIC Chip Market by End User
- 7.2.3.2 UK ASIC Chip Market
- 7.2.3.2.1 UK ASIC Chip Market by Type
- 7.2.3.2.2 UK ASIC Chip Market by End User
- 7.2.3.3 France ASIC Chip Market
- 7.2.3.3.1 France ASIC Chip Market by Type
- 7.2.3.3.2 France ASIC Chip Market by End User
- 7.2.3.4 Russia ASIC Chip Market
- 7.2.3.4.1 Russia ASIC Chip Market by Type
- 7.2.3.4.2 Russia ASIC Chip Market by End User
- 7.2.3.5 Spain ASIC Chip Market
- 7.2.3.5.1 Spain ASIC Chip Market by Type
- 7.2.3.5.2 Spain ASIC Chip Market by End User
- 7.2.3.6 Italy ASIC Chip Market
- 7.2.3.6.1 Italy ASIC Chip Market by Type
- 7.2.3.6.2 Italy ASIC Chip Market by End User
- 7.2.3.7 Rest of Europe ASIC Chip Market
- 7.2.3.7.1 Rest of Europe ASIC Chip Market by Type
- 7.2.3.7.2 Rest of Europe ASIC Chip Market by End User
- 7.3 Asia Pacific ASIC Chip Market
- 7.3.1 Asia Pacific ASIC Chip Market by Type
- 7.3.1.1 Asia Pacific Semi- custom ASIC Market by Country
- 7.3.1.2 Asia Pacific Full custom ASIC Market by Country
- 7.3.1.3 Asia Pacific Programmable ASIC Market by Country
- 7.3.2 Asia Pacific ASIC Chip Market by End User
- 7.3.2.1 Asia Pacific Data Processing Systems Market by Country
- 7.3.2.2 Asia Pacific Telecommunication Systems Market by Country
- 7.3.2.3 Asia Pacific Aerospace Subsystem & Sensors Market by Country
- 7.3.2.4 Asia Pacific Consumer Electronics Market by Country
- 7.3.2.5 Asia Pacific Medical Instrumentation Market by Country
- 7.3.2.6 Asia Pacific Others Market by Country
- 7.3.3 Asia Pacific ASIC Chip Market by Country
- 7.3.3.1 China ASIC Chip Market
- 7.3.3.1.1 China ASIC Chip Market by Type
- 7.3.3.1.2 China ASIC Chip Market by End User
- 7.3.3.2 Japan ASIC Chip Market
- 7.3.3.2.1 Japan ASIC Chip Market by Type
- 7.3.3.2.2 Japan ASIC Chip Market by End User
- 7.3.3.3 India ASIC Chip Market
- 7.3.3.3.1 India ASIC Chip Market by Type
- 7.3.3.3.2 India ASIC Chip Market by End User
- 7.3.3.4 South Korea ASIC Chip Market
- 7.3.3.4.1 South Korea ASIC Chip Market by Type
- 7.3.3.4.2 South Korea ASIC Chip Market by End User
- 7.3.3.5 Taiwan ASIC Chip Market
- 7.3.3.5.1 Taiwan ASIC Chip Market by Type
- 7.3.3.5.2 Taiwan ASIC Chip Market by End User
- 7.3.3.6 Malaysia ASIC Chip Market
- 7.3.3.6.1 Malaysia ASIC Chip Market by Type
- 7.3.3.6.2 Malaysia ASIC Chip Market by End User
- 7.3.3.7 Rest of Asia Pacific ASIC Chip Market
- 7.3.3.7.1 Rest of Asia Pacific ASIC Chip Market by Type
- 7.3.3.7.2 Rest of Asia Pacific ASIC Chip Market by End User
- 7.4 LAMEA ASIC Chip Market
- 7.4.1 LAMEA ASIC Chip Market by Type
- 7.4.1.1 LAMEA Semi- custom ASIC Market by Country
- 7.4.1.2 LAMEA Full custom ASIC Market by Country
- 7.4.1.3 LAMEA Programmable ASIC Market by Country
- 7.4.2 LAMEA ASIC Chip Market by End User
- 7.4.2.1 LAMEA Data Processing Systems Market by Country
- 7.4.2.2 LAMEA Telecommunication Systems Market by Country
- 7.4.2.3 LAMEA Aerospace Subsystem & Sensors Market by Country
- 7.4.2.4 LAMEA Consumer Electronics Market by Country
- 7.4.2.5 LAMEA Medical Instrumentation Market by Country
- 7.4.2.6 LAMEA Others Market by Country
- 7.4.3 LAMEA ASIC Chip Market by Country
- 7.4.3.1 Brazil ASIC Chip Market
- 7.4.3.1.1 Brazil ASIC Chip Market by Type
- 7.4.3.1.2 Brazil ASIC Chip Market by End User
- 7.4.3.2 Argentina ASIC Chip Market
- 7.4.3.2.1 Argentina ASIC Chip Market by Type
- 7.4.3.2.2 Argentina ASIC Chip Market by End User
- 7.4.3.3 UAE ASIC Chip Market
- 7.4.3.3.1 UAE ASIC Chip Market by Type
- 7.4.3.3.2 UAE ASIC Chip Market by End User
- 7.4.3.4 Saudi Arabia ASIC Chip Market
- 7.4.3.4.1 Saudi Arabia ASIC Chip Market by Type
- 7.4.3.4.2 Saudi Arabia ASIC Chip Market by End User
- 7.4.3.5 South Africa ASIC Chip Market
- 7.4.3.5.1 South Africa ASIC Chip Market by Type
- 7.4.3.5.2 South Africa ASIC Chip Market by End User
- 7.4.3.6 Nigeria ASIC Chip Market
- 7.4.3.6.1 Nigeria ASIC Chip Market by Type
- 7.4.3.6.2 Nigeria ASIC Chip Market by End User
- 7.4.3.7 Rest of LAMEA ASIC Chip Market
- 7.4.3.7.1 Rest of LAMEA ASIC Chip Market by Type
- 7.4.3.7.2 Rest of LAMEA ASIC Chip Market by End User
- Chapter 8. Company Profiles
- 8.1 Advanced Micro Devices, Inc.
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Segmental and Regional Analysis
- 8.1.4 Research & Development Expenses
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Product Launches and Product Expansions:
- 8.1.5.2 Acquisition and Mergers:
- 8.1.6 SWOT Analysis
- 8.2 Samsung Electronics Co., Ltd. (Samsung Group)
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Recent strategies and developments:
- 8.2.4.1 Partnerships, Collaborations, and Agreements:
- 8.2.5 SWOT Analysis
- 8.3 ON Semiconductor Corporation
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Segmental and Regional Analysis
- 8.3.4 Research & Development Expense
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Acquisition and Mergers:
- 8.3.6 SWOT Analysis
- 8.4 Taiwan Semiconductor Manufacturing Company Limited
- 8.4.1 Company overview
- 8.4.2 Financial Analysis
- 8.4.3 Regional Analysis
- 8.4.4 Research & Development Expenses
- 8.4.5 SWOT Analysis
- 8.5 NVIDIA Corporation
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Segmental and Regional Analysis
- 8.5.4 Research & Development Expenses
- 8.5.5 Recent strategies and developments:
- 8.5.5.1 Acquisition and Mergers:
- 8.6 Intel Corporation
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Segmental and Regional Analysis
- 8.6.4 Research & Development Expenses
- 8.6.5 Recent strategies and developments:
- 8.6.5.1 Partnerships, Collaborations, and Agreements:
- 8.6.5.2 Product Launches and Product Expansions:
- 8.6.5.3 Acquisition and Mergers:
- 8.6.6 SWOT Analysis
- 8.7 Infineon Technologies AG
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.7.5 Recent strategies and developments:
- 8.7.5.1 Partnerships, Collaborations, and Agreements:
- 8.7.5.2 Product Launches and Product Expansions:
- 8.7.5.3 Acquisition and Mergers:
- 8.7.6 SWOT Analysis
- 8.8 Texas Instruments, Inc.
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expense
- 8.8.5 SWOT Analysis
- 8.9 Seiko Epson Corporation
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Segmental and Regional Analysis
- 8.9.4 Research & Development Expenses
- 8.9.5 SWOT Analysis
- 8.1 BITMAIN Technologies Holding Company
- 8.10.1 Company Overview
- 8.10.2 Recent strategies and developments:
- 8.10.2.1 Partnerships, Collaborations, and Agreements:
- 8.10.2.2 Product Launches and Product Expansions:
- 8.10.3 SWOT Analysis
- Chapter 9. Winning imperatives of ASIC Chip Market
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