Europe Wafer Cleaning Equipment Market Size, Share & Industry Trends Analysis Report By Equipment Type, By Application (Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others), By Wafer Size, By Country and Growth Forecast, 2023 - 2030

Europe Wafer Cleaning Equipment Market Size, Share & Industry Trends Analysis Report By Equipment Type, By Application (Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others), By Wafer Size, By Country and Growth Forecast, 2023 - 2030


The Europe Wafer Cleaning Equipment Market would witness market growth of 8.9% CAGR during the forecast period (2023-2030). In the year 2020, the Europe market's volume surged to 71.8 thousand units, showcasing a growth of 9.1% (2019-2022).

Micro-electro-mechanical systems are in greater demand due to their expanding use in conventional and cutting-edge applications. These applications include medical devices, communication systems, automobile sensor devices, and inertial sensing systems. The MEMS devices' small size, which makes them suitable for various applications, is a significant factor in their widespread adoption. Microsensors, microactuators, and microstructures are integrated into a silicon substrate to form MEMS devices. Depending on its intended uses, each MEMS device has different sizes, shapes, and dimensions, some of which can be as small as one micron.

Artificial intelligence has been increasingly popular in recent years across various applications. One of the main elements propelling the development of the generative AI industry is the steadily expanding demand for generative AI, which can be attributed to the rising popularity of AI-based chatbots like ChatGPT. It is anticipated that the increasing use of these AI-based chatbots will increase demand for memory and storage devices, which will improve such devices' average selling prices trends, particularly over the coming years.

Europe has a strong emphasis on semiconductor research and development. Research institutions, universities, and public-private partnerships are actively engaged in cutting-edge semiconductor research, including materials science, device physics, and process technologies. Europe fosters a vibrant technology innovation ecosystem. Start-ups and incubators focus on semiconductor-related innovations, including novel materials, packaging technologies, and semiconductor manufacturing equipment. The context and action fields for deploying 5G networks in Germany by 2025 are described in the Federal Government's 5G Strategy. All these factors will uplift the regional market’s expansion in upcoming years.

The Germany market dominated the Europe Wafer Cleaning Equipment Market, by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,029.6 million by 2030. The UK market is estimated to witness a CAGR of 7.9% during (2023 - 2030). Additionally, The France market would register a CAGR of 9.7% during (2023 - 2030).

Based on Equipment Type, the market is segmented into Batch Spray Cleaning System, Batch Immersion Cleaning System, Single Wafer Cryogenic System, Single Wafer Spray System, and Scrubbers. Based on Application, the market is segmented into Memory, Interposer, MEMS, Logic, CIS, LED, RF Device and Others. Based on Wafer Size, the market is segmented into 300 mm, 200 mm and Less than Equals 150 mm. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Tokyo Electron Ltd., SCREEN Holdings Co., Ltd., Applied Materials, Inc., Lam Research Corporation, Veeco Instruments, Inc., Axus Technology, Entegris, Inc. (Sumitomo Mitsui Financial Group), SEMES Co., Ltd. (Samsung Electronics Co., Ltd), Ultron Systems, Inc., and Toho Technology Co., Ltd.

Scope of the Study

Market Segments covered in the Report:

By Equipment Type (Volume, Thousand units, USD Million, 2019-2030)
  • Batch Spray Cleaning System
  • Batch Immersion Cleaning System
  • Single Wafer Cryogenic System
  • Single Wafer Spray System
  • Scrubbers
By Application (Volume, Thousand units, USD Million, 2019-2030)
  • Memory
  • Interposer
  • MEMS
  • Logic
  • CIS
  • LED
  • RF Device
  • Others
By Wafer Size (Volume, Thousand units, USD Million, 2019-2030)
  • 300 mm
  • 200 mm
  • Less than Equals 150 mm
By Country (Volume, Thousand units, USD Million, 2019-2030)
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Companies Profiled
  • Tokyo Electron Ltd.
  • SCREEN Holdings Co., Ltd
  • Applied Materials, Inc.
  • Lam Research Corporation
  • Veeco Instruments, Inc.
  • Axus Technology
  • Entegris, Inc. (Sumitomo Mitsui Financial Group)
  • SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
  • Ultron Systems, Inc.
  • Toho Technology Co., Ltd.
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Wafer Cleaning Equipment Market, by Equipment Type
1.4.2 Europe Wafer Cleaning Equipment Market, by Application
1.4.3 Europe Wafer Cleaning Equipment Market, by Wafer Size
1.4.4 Europe Wafer Cleaning Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2022
4.2 Porter’s Five Force Analysis
Chapter 5. Europe Wafer Cleaning Equipment Market, by Equipment Type
5.1 Europe Batch Spray Cleaning System Market, by Country
5.2 Europe Batch Immersion Cleaning System Market, by Country
5.3 Europe Single Wafer Cryogenic System Market, by Country
5.4 Europe Single Wafer Spray System Market, by Country
5.5 Europe Scrubbers Market, by Country
Chapter 6. Europe Wafer Cleaning Equipment Market, by Application
6.1 Europe Memory Market, by Country
6.2 Europe Interposer Market, by Country
6.3 Europe MEMS Market, by Country
6.4 Europe Logic Market, by Country
6.5 Europe CIS Market, by Country
6.6 Europe LED Market, by Country
6.7 Europe RF Device Market, by Country
6.8 Europe Others Market, by Country
Chapter 7. Europe Wafer Cleaning Equipment Market, by Wafer Size
7.1 Europe 300 mm Market, by Country
7.2 Europe 200 mm Market, by Country
7.3 Europe Less than Equals 150 mm Market, by Country
Chapter 8. Europe Wafer Cleaning Equipment Market, by Country
8.1 Germany Wafer Cleaning Equipment Market
8.1.1 Germany Wafer Cleaning Equipment Market, by Equipment Type
8.1.2 Germany Wafer Cleaning Equipment Market, by Application
8.1.3 Germany Wafer Cleaning Equipment Market, by Wafer Size
8.2 UK Wafer Cleaning Equipment Market
8.2.1 UK Wafer Cleaning Equipment Market, by Equipment Type
8.2.2 UK Wafer Cleaning Equipment Market, by Application
8.2.3 UK Wafer Cleaning Equipment Market, by Wafer Size
8.3 France Wafer Cleaning Equipment Market
8.3.1 France Wafer Cleaning Equipment Market, by Equipment Type
8.3.2 France Wafer Cleaning Equipment Market, by Application
8.3.3 France Wafer Cleaning Equipment Market, by Wafer Size
8.4 Russia Wafer Cleaning Equipment Market
8.4.1 Russia Wafer Cleaning Equipment Market, by Equipment Type
8.4.2 Russia Wafer Cleaning Equipment Market, by Application
8.4.3 Russia Wafer Cleaning Equipment Market, by Wafer Size
8.5 Spain Wafer Cleaning Equipment Market
8.5.1 Spain Wafer Cleaning Equipment Market, by Equipment Type
8.5.2 Spain Wafer Cleaning Equipment Market, by Application
8.5.3 Spain Wafer Cleaning Equipment Market, by Wafer Size
8.6 Italy Wafer Cleaning Equipment Market
8.6.1 Italy Wafer Cleaning Equipment Market, by Equipment Type
8.6.2 Italy Wafer Cleaning Equipment Market, by Application
8.6.3 Italy Wafer Cleaning Equipment Market, by Wafer Size
8.7 Rest of Europe Wafer Cleaning Equipment Market
8.7.1 Rest of Europe Wafer Cleaning Equipment Market, by Equipment Type
8.7.2 Rest of Europe Wafer Cleaning Equipment Market, by Application
8.7.3 Rest of Europe Wafer Cleaning Equipment Market, by Wafer Size
Chapter 9. Company Profiles
9.1 Tokyo Electron Ltd.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 Recent strategies and developments:
9.1.5.1 Product Launches and Product Expansions:
9.1.6 SWOT Analysis
9.2 SCREEN Holdings Co., Ltd
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments:
9.2.5.1 Partnerships, Collaborations, and Agreements:
9.2.5.2 Product Launches and Product Expansions:
9.2.6 SWOT Analysis
9.3 Applied Materials, Inc.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expenses
9.3.5 SWOT Analysis
9.4 Lam Research Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 SWOT Analysis
9.5 Veeco Instruments, Inc.
9.5.1 Company Overview
9.5.2 Financial Analysis
9.5.3 Regional Analysis
9.5.4 Research & Development Expenses
9.5.5 SWOT Analysis
9.6 Axus Technology
9.6.1 Company Overview
9.6.2 SWOT Analysis
9.7 Entegris, Inc. (Sumitomo Mitsui Financial Group)
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 SEMES Co., Ltd. (Samsung Electronics Co., Ltd)
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 SWOT Analysis
9.9 Ultron Systems, Inc.
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. Toho Technology Co., Ltd.
9.10.1 Company Overview
9.10.2 SWOT Analysis

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