Europe Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Country and Growth Forecast, 2022 - 2028

Europe Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Country and Growth Forecast, 2022 - 2028

The Europe Thin Wafer Market would witness market growth of 12.6% CAGR during the forecast period (2022-2028).

Only a few well-defined directions are normally where wafer cleavage happens. The wafer can be easily divided into individual chips (or "dies") by scoring it along cleavage planes, allowing the billions of individual circuit parts on a typical wafer to be divided into numerous individual circuits. Flats are sliced into one or more sides of wafers smaller than 200 mm in diameter to indicate the wafer's crystallographic planes (often a "110" face). A pair of flats at various angles also served to communicate the doping type in earlier-generation wafers. With no visual indication of the type of doping, wafers 200 mm in diameter and larger require a single tiny notch to communicate wafer orientation.

With an initial impurity doping concentration of between 1013 and 1016 atoms per cm3 of boron, phosphate, arsenic, or antimony that is added to the melt, silicon wafers are typically not 100% pure silicon, but rather are classified as either bulk n-type or p-type. However, this still results in a purity higher than 99.9999% when compared to the atomic density of a single crystal of silicon, which is 51022 atoms per cm3. It is also possible to first provide some interstitial oxygen levels to the wafers. Contamination from carbon and metal is kept to a minimum. For electronic applications, it is necessary to keep the concentrations of transition metals in particular below parts per billion.

There is a high demand for different semiconductors as well as other components in this region because both the communications and the automobile industries are quite developed. Companies in the area are investing in creating new technologies and increasing their manufacturing capacity to fulfill the industry's growing need for cutting-edge devices and components. Furthermore, during the course of the projected period, the regional wafer backgrinding tape market will expand at a faster rate due to rising consumer goods demand in the United Kingdom, France, and Germany.

The Germany market dominated the Europe Thin Wafer Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,400 million by 2028. The UK market is registering a CAGR of 11.6% during (2022 - 2028). Additionally, The France market would showcase a CAGR of 13.4% during (2022 - 2028).

Based on Wafer Size, the market is segmented into 300 mm, 200 mm and 125 mm. Based on Technology, the market is segmented into Dicing, Polishing and Grinding. Based on Application, the market is segmented into Memory, LED, MEMS, CIS, RF Devices, Interposer, Logic and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.

Scope of the Study

Market Segments covered in the Report:

By Wafer Size

• 300 mm
• 200 mm
• 125 mm

• Dicing
• Polishing
• Grinding

• Memory
• LED
• MEMS
• CIS
• RF Devices
• Interposer
• Logic
• Others

• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe

• Shin-Etsu Chemical Co., Ltd.
• SUMCO Corporation
• GlobalWafers Co., Ltd.
• Siltronic AG
• SK Siltron Co., Ltd.
• SUSS MicroTec SE
• Soitec
• DISCO Corporation
• 3M Company
• Applied Materials, Inc.

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