Europe Sensor Fusion Market By Technology (MEMS and Non-MEMS), By Type (IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others), By End User (Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others), By Country, Opportunity Analysis and Industry Forecast, 2021 - 2027
The Europe Sensor Fusion Market would witness market growth of 17.3% CAGR during the forecast period (2021-2027).
Sensor fusion could be used by a vehicle to combine data from many sensors of the same sort, such as radar. Taking advantage of slightly overlapping areas of view would improve perception. More than one sensor will detect objects at the same time because numerous radars are monitoring the area around a vehicle. Detections from those many sensors can be overlapped or merged using global 360° perception software, boosting the detection probability and reliability of things around the vehicle and producing a more accurate and trustworthy picture of the environment.
Previously, the computing power required to evaluate sensor data in order to discern and track objects was packed with cameras or radars. The processing capacity is centralised into a more powerful active safety domain controller with various satellite architecture method, allowing low-level sensor data to be collected from each sensor and fused in the domain controller
The strong automotive sector of this region is supporting the demand for various components based on sensor fusion. For example, Continental AG is investigating the application of artificial intelligence in sensor fusion offerings and contributing its extensive understanding of sensor technology and electronic control units to the development process. This region is popular for its high technological advancements in automobiles, which would create opportunities for the sensor fusion manufacturers to enter this region and expand their business.
The Germany market dominated the Europe Sensor Fusion Market by Country 2020, and would continue to be a dominant market till 2027; thereby, achieving a market value of $625.9 million by 2027. The UK market would witness a CAGR of 16.4% during (2021 - 2027). Additionally, The France market is experiencing a CAGR of 18.1% during (2021 - 2027).
Based on Technology, the market is segmented into MEMS and Non-MEMS. Based on Type, the market is segmented into IMU, Radar Sensors, Image Sensors, Temperature Sensors, and Others. Based on End User, the market is segmented into Consumer Electronics, Healthcare, Military & Defense, Automotive, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Analog Devices, Inc., Renesas Electronics Corporation, TDK Corporation (InvenSense, Inc.), STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Asahi Kasei Corporation, Robert Bosch GmbH, CEVA, Inc., and MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.).
Scope of the Study
Market Segments covered in the Report:
By Technology
- MEMS
- Non MEMS
- IMU
- Radar Sensors
- Image Sensors
- Temperature Sensors
- Others
- Consumer Electronics
- Healthcare
- Military & Defense
- Automotive
- Others
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Analog Devices, Inc.
- Renesas Electronics Corporation
- TDK Corporation (InvenSense, Inc.)
- STMicroelectronics N.V.
- Infineon Technologies AG
- NXP Semiconductors N.V.
- Asahi Kasei Corporation
- Robert Bosch GmbH
- CEVA, Inc.
- MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
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- Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Europe Sensor Fusion Market, by Technology
- 1.4.2 Europe Sensor Fusion Market, by Type
- 1.4.3 Europe Sensor Fusion Market, by End User
- 1.4.4 Europe Sensor Fusion Market, by Country
- 1.5 Methodology for the research
- Chapter 2. Market Overview
- 2.1 Introduction
- 2.1.1 Overview
- 2.1.1.1 Market Composition and Scenario
- 2.2 Key Factors Impacting the Market
- 2.2.1 Market Drivers
- 2.2.2 Market Restraints
- Chapter 3. Competition Analysis - Global
- 3.1 KBV Cardinal Matrix
- 3.2 Recent Industry Wide Strategic Developments
- 3.2.1 Partnerships, Collaborations and Agreements
- 3.2.2 Product Launches and Product Expansions
- 3.2.3 Acquisition and Mergers
- 3.3 Top Winning Strategies
- 3.3.1 Key Leading Strategies: Percentage Distribution (2017-2021)
- 3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements: 2017, Dec – 2021, Dec) Leading Players
- Chapter 4. Europe Sensor Fusion Market by Technology
- 4.1 Europe Sensor Fusion MEMS Market by Country
- 4.2 Europe Sensor Fusion Non MEMS Market by Country
- Chapter 5. Europe Sensor Fusion Market by Type
- 5.1 Europe IMU Sensor Fusion Market by Country
- 5.2 Europe Radar Sensors Sensor Fusion Market by Country
- 5.3 Europe Image Sensors Sensor Fusion Market by Country
- 5.4 Europe Temperature Sensors Sensor Fusion Market by Country
- 5.5 Europe Other Type Sensor Fusion Market by Country
- Chapter 6. Europe Sensor Fusion Market by End User
- 6.1 Europe Sensor Fusion Consumer Electronics Market by Country
- 6.2 Europe Sensor Fusion Healthcare Market by Country
- 6.3 Europe Sensor Fusion Military & Defense Market by Country
- 6.4 Europe Sensor Fusion Automotive Market by Country
- 6.5 Europe Sensor Fusion Others Market by Country
- Chapter 7. Europe Sensor Fusion Market by Country
- 7.1 Germany Sensor Fusion Market
- 7.1.1 Germany Sensor Fusion Market by Technology
- 7.1.2 Germany Sensor Fusion Market by Type
- 7.1.3 Germany Sensor Fusion Market by End User
- 7.2 UK Sensor Fusion Market
- 7.2.1 UK Sensor Fusion Market by Technology
- 7.2.2 UK Sensor Fusion Market by Type
- 7.2.3 UK Sensor Fusion Market by End User
- 7.3 France Sensor Fusion Market
- 7.3.1 France Sensor Fusion Market by Technology
- 7.3.2 France Sensor Fusion Market by Type
- 7.3.3 France Sensor Fusion Market by End User
- 7.4 Russia Sensor Fusion Market
- 7.4.1 Russia Sensor Fusion Market by Technology
- 7.4.2 Russia Sensor Fusion Market by Type
- 7.4.3 Russia Sensor Fusion Market by End User
- 7.5 Spain Sensor Fusion Market
- 7.5.1 Spain Sensor Fusion Market by Technology
- 7.5.2 Spain Sensor Fusion Market by Type
- 7.5.3 Spain Sensor Fusion Market by End User
- 7.6 Italy Sensor Fusion Market
- 7.6.1 Italy Sensor Fusion Market by Technology
- 7.6.2 Italy Sensor Fusion Market by Type
- 7.6.3 Italy Sensor Fusion Market by End User
- 7.7 Rest of Europe Sensor Fusion Market
- 7.7.1 Rest of Europe Sensor Fusion Market by Technology
- 7.7.2 Rest of Europe Sensor Fusion Market by Type
- 7.7.3 Rest of Europe Sensor Fusion Market by End User
- Chapter 8. Company Profiles
- 8.1 Analog Devices, Inc.
- 8.1.1 Company Overview
- 8.1.2 Financial Analysis
- 8.1.3 Regional Analysis
- 8.1.4 Research & Development Expenses
- 8.1.5 Recent strategies and developments:
- 8.1.5.1 Partnerships, Collaborations, and Agreements:
- 8.1.6 SWOT Analysis
- 8.2 Renesas Electronics Corporation
- 8.2.1 Company Overview
- 8.2.2 Financial Analysis
- 8.2.3 Segmental and Regional Analysis
- 8.2.4 Research & Development Expense
- 8.2.5 Recent strategies and developments:
- 8.2.5.1 Partnerships, Collaborations, and Agreements:
- 8.2.5.2 Acquisition and Mergers:
- 8.3 TDK Corporation (InvenSense, Inc.)
- 8.3.1 Company Overview
- 8.3.2 Financial Analysis
- 8.3.3 Regional & Segmental Analysis
- 8.3.4 Research & Development Expenses
- 8.3.5 Recent strategies and developments:
- 8.3.5.1 Partnerships, Collaborations, and Agreements:
- 8.3.5.2 Product Launches and Product Expansions:
- 8.4 STMicroelectronics N.V.
- 8.4.1 Company Overview
- 8.4.2 Financial Analysis
- 8.4.3 Segmental and Regional Analysis
- 8.4.4 Research & Development Expense
- 8.4.5 SWOT Analysis
- 8.5 Infineon Technologies AG
- 8.5.1 Company Overview
- 8.5.2 Financial Analysis
- 8.5.3 Segmental and Regional Analysis
- 8.5.4 Research & Development Expense
- 8.5.5 Recent strategies and developments:
- 8.5.5.1 Product Launches and Product Expansions:
- 8.5.6 SWOT Analysis
- 8.6 NXP Semiconductors N.V.
- 8.6.1 Company Overview
- 8.6.2 Financial Analysis
- 8.6.3 Regional Analysis
- 8.6.4 Research & Development Expense
- 8.6.5 Recent strategies and developments:
- 8.6.5.1 Product Launches and Product Expansions:
- 8.6.6 SWOT Analysis
- 8.7 Asahi Kasei Corporation
- 8.7.1 Company Overview
- 8.7.2 Financial Analysis
- 8.7.3 Segmental and Regional Analysis
- 8.7.4 Research & Development Expense
- 8.8 Robert Bosch GmbH
- 8.8.1 Company Overview
- 8.8.2 Financial Analysis
- 8.8.3 Segmental and Regional Analysis
- 8.8.4 Research & Development Expense
- 8.8.5 Recent strategies and developments:
- 8.8.5.1 Partnerships, Collaborations, and Agreements:
- 8.8.6 SWOT Analysis
- 8.9 CEVA, Inc.
- 8.9.1 Company Overview
- 8.9.2 Financial Analysis
- 8.9.3 Regional Analysis
- 8.9.4 Research & Development Expense
- 8.9.5 Recent strategies and developments:
- 8.9.5.1 Partnerships, Collaborations, and Agreements:
- 8.9.5.2 Acquisition and Mergers:
- 8.10. MEMSIC Semiconductor Co., Ltd. (IDG Capital Investment Consultant Beijing Co Ltd.)
- 8.10.1 Company Overview
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