Europe Semiconductor Etch Equipment Market Size, Share & Industry Trends Analysis Report By Type (Dry and Wet), By Process, By End User (Integrated Device Manufacturers, Foundry and Memory Manufacturers), By Country and Growth Forecast, 2023 - 2030
The Europe Semiconductor Etch Equipment Market would witness market growth of 7.8% CAGR during the forecast period (2023-2030).
Plasma treatment removes contaminants from a fiber surface, for instance, desizing cotton. Cleaning and plasma etching technology are broadly used in semiconductor and integrated circuit manufacturing. Plasma is the fourth state of matter (the other three are gas, liquid and solid), which is electrically charged and contains free electrons, positively charged ions, and free radicals (compounds or atoms with unsatisfied chemical bonds).
While there is no net charge within the plasma as a whole, the charged particles within the plasma can and are affected by external electromagnetic fields. Electronic engineers and physicists have devised ways to manipulate these electromagnetic fields to make beams of charged particles that to the integrated circuit engineer are similar to nano-milling machines. The plasmas from which these beams are created are chemically active and highly energetic, thus highly erosive/corrosive.
Plasma etching is also known as reactive ion etching, RIE (Reactive-ion etching), which shows how corrosive the plasma can be. Earlier, the plasma chamber was lined with monolithic ceramic components. However, today, as silicon wafer sizes have significantly increased, chamber sizes have also increased and are now coated with dense, high-quality ceramic coatings like yttria or alumina. Generally, the wafer-fixturing materials are also ceramics.
Germany plans to spend around EUR 50 billion to secure its position as a significant semiconductor production location. The country has announced major investment plans for the domestic production of semiconductors. Germany is investing prominently in its microelectronics sector to make the nation an international semiconductor production force. The ambitious deployment & development of semiconductor-based applications in the energy, manufacturing, and automotive sectors is crucial to the nation to meet its climate goals. Germany’s climate neutrality targets make attractive business opportunities and favorable market conditions for many international companies. These elements are assisting the market's expansion in the region.
The Germany market dominated the Europe Semiconductor Etch Equipment Market, By Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,823.6 million by 2030. The UK market is showcasing a CAGR of 6.8% during (2023 - 2030). Additionally, The France market would register a CAGR of 8.6% during (2023 - 2030).
Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, Suzhou Delphi Laser Co., Ltd and Lam Research Corporation.
Scope of the Study
Market Segments covered in the Report:
By Type
- Dry
- Wet
- Conductor
- Dielectric
- Integrated Device Manufacturers
- Foundry
- Memory Manufacturers
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
- Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
- ULVAC, Inc.
- Hitachi High-Tech Corporation (Hitachi, Ltd.)
- Tokyo Electron Ltd.
- Applied Materials, Inc.
- SPTS Technologies Ltd. (KLA Corporation)
- ASML Holding N.V.
- Samco, Inc.
- EV Group
- Suzhou Delphi Laser Co., Ltd.
- Lam Research Corporation
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- Chapter 1. Market Scope & Methodology
- 1.1 Market Definition
- 1.2 Objectives
- 1.3 Market Scope
- 1.4 Segmentation
- 1.4.1 Europe Semiconductor Etch Equipment Market, by Type
- 1.4.2 Europe Semiconductor Etch Equipment Market, by Process
- 1.4.3 Europe Semiconductor Etch Equipment Market, by End User
- 1.4.4 Europe Semiconductor Etch Equipment Market, by Country
- 1.5 Methodology for the research
- Chapter 2. Market at a Glance
- 2.1 Key Highlights
- Chapter 3. Market Overview
- 3.1 Introduction
- 3.1.1 Overview
- 3.1.1.1 Market Composition & Scenario
- 3.2 Key Factors Impacting the Market
- 3.2.1 Market Drivers
- 3.2.2 Market Restraints
- 3.3 Porter Five Forces Analysis
- Chapter 4. Strategies Deployed in Semiconductor Etch Equipment Market
- Chapter 5. Europe Semiconductor Etch Equipment Market, By Type
- 5.1 Europe Dry Market, By Country
- 5.2 Europe Wet Market, By Country
- Chapter 6. Europe Semiconductor Etch Equipment Market, By Process
- 6.1 Europe Conductor Market, By Country
- 6.2 Europe Dielectric Market, By Country
- Chapter 7. Europe Semiconductor Etch Equipment Market, By End User
- 7.1 Europe Integrated Device Manufacturers Market, By Country
- 7.2 Europe Foundry Market, By Country
- 7.3 Europe Memory Manufacturers Market, By Country
- Chapter 8. Europe Semiconductor Etch Equipment Market, By Country
- 8.1 Germany Semiconductor Etch Equipment Market
- 8.1.1 Germany Semiconductor Etch Equipment Market, By Type
- 8.1.2 Germany Semiconductor Etch Equipment Market, By Process
- 8.1.3 Germany Semiconductor Etch Equipment Market, By End User
- 8.2 UK Semiconductor Etch Equipment Market
- 8.2.1 UK Semiconductor Etch Equipment Market, By Type
- 8.2.2 UK Semiconductor Etch Equipment Market, By Process
- 8.2.3 UK Semiconductor Etch Equipment Market, By End User
- 8.3 France Semiconductor Etch Equipment Market
- 8.3.1 France Semiconductor Etch Equipment Market, By Type
- 8.3.2 France Semiconductor Etch Equipment Market, By Process
- 8.3.3 France Semiconductor Etch Equipment Market, By End User
- 8.4 Russia Semiconductor Etch Equipment Market
- 8.4.1 Russia Semiconductor Etch Equipment Market, By Type
- 8.4.2 Russia Semiconductor Etch Equipment Market, By Process
- 8.4.3 Russia Semiconductor Etch Equipment Market, By End User
- 8.5 Spain Semiconductor Etch Equipment Market
- 8.5.1 Spain Semiconductor Etch Equipment Market, By Type
- 8.5.2 Spain Semiconductor Etch Equipment Market, By Process
- 8.5.3 Spain Semiconductor Etch Equipment Market, By End User
- 8.6 Italy Semiconductor Etch Equipment Market
- 8.6.1 Italy Semiconductor Etch Equipment Market, By Type
- 8.6.2 Italy Semiconductor Etch Equipment Market, By Process
- 8.6.3 Italy Semiconductor Etch Equipment Market, By End User
- 8.7 Rest of Europe Semiconductor Etch Equipment Market
- 8.7.1 Rest of Europe Semiconductor Etch Equipment Market, By Type
- 8.7.2 Rest of Europe Semiconductor Etch Equipment Market, By Process
- 8.7.3 Rest of Europe Semiconductor Etch Equipment Market, By End User
- Chapter 9. Company Profiles
- 9.1 Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
- 9.1.1 Company Overview
- 9.1.2 Financial Analysis
- 9.1.3 Segmental and Regional Analysis
- 9.1.4 Research & Development Expenses
- 9.1.5 Recent strategies and developments:
- 9.1.5.1 Partnerships, Collaborations, and Agreements:
- 9.1.6 SWOT Analysis
- 9.2 ULVAC, Inc.
- 9.2.1 Company Overview
- 9.2.2 Financial Analysis
- 9.2.3 Segmental and Regional Analysis
- 9.2.4 Research & Development Expenses
- 9.2.5 Recent strategies and developments:
- 9.2.5.1 Partnerships, Collaborations, and Agreements:
- 9.2.5.2 Product Launches and Product Expansions:
- 9.2.6 SWOT Analysis
- 9.3 Hitachi High-Tech Corporation (Hitachi, Ltd.)
- 9.3.1 Company Overview
- 9.3.2 Financial Analysis
- 9.3.3 Segmental and Regional Analysis
- 9.3.4 Research & Development Expenses
- 9.3.5 Recent strategies and developments:
- 9.3.5.1 Product Launches and Product Expansions:
- 9.3.6 SWOT Analysis
- 9.4 Tokyo Electron Ltd.
- 9.4.1 Company Overview
- 9.4.2 Financial Analysis
- 9.4.3 Segmental and Regional Analysis
- 9.4.4 Research & Development Expenses
- 9.4.5 Recent strategies and developments:
- 9.4.5.1 Product Launches and Product Expansions:
- 9.4.5.2 Partnerships, Collaborations and Agreements:
- 9.4.6 SWOT Analysis
- 9.5 Applied Materials, Inc.
- 9.5.1 Company Overview
- 9.5.2 Financial Analysis
- 9.5.3 Segmental and Regional Analysis
- 9.5.4 Research & Development Expenses
- 9.5.5 Recent strategies and developments:
- 9.5.5.1 Product Launches and Product Expansions:
- 9.5.6 SWOT Analysis
- 9.6 SPTS Technologies Ltd. (KLA Corporation)
- 9.6.1 Company Overview
- 9.6.2 Financial Analysis
- 9.6.3 Segmental and Regional Analysis
- 9.6.4 Research & Development Expenses
- 9.6.5 SWOT Analysis
- 9.7 ASML Holding N.V.
- 9.7.1 Company Overview
- 9.7.2 Financial Analysis
- 9.7.3 Regional Analysis
- 9.7.4 Research & Development Expenses
- 9.7.5 SWOT Analysis
- 9.8 Samco, Inc.
- 9.8.1 Company Overview
- 9.8.2 Recent strategies and developments:
- 9.8.2.1 Product Launches and Product Expansions:
- 9.8.3 SWOT Analysis
- 9.9 EV Group
- 9.9.1 Company Overview
- 9.9.2 SWOT Analysis
- 9.10. Suzhou Delphi Laser Co., Ltd.
- 9.10.1 Company Overview
- 9.10.2 SWOT Analysis
- 9.11 Lam Research Corporation
- 9.11.1 Company Overview
- 9.11.2 Financial Analysis
- 9.11.3 Primary markets and Regional Analysis
- 9.11.4 Research & Development Expenses
- 9.11.5 Recent strategies and developments:
- 9.11.5.1 Product Launches and Product Expansions:
- 9.11.5.2 Acquisition and Mergers:
- 9.11.5.3 Geographical Expansions:
- 9.11.6 SWOT Analysis
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