Europe Semiconductor Etch Equipment Market Size, Share & Industry Trends Analysis Report By Type, By Process (Conductor and Dielectric), By End User (Integrated Device Manufacturers, Foundry and Memory Manufacturers), By Country and Growth Forecast, 2022

Europe Semiconductor Etch Equipment Market Size, Share & Industry Trends Analysis Report By Type, By Process (Conductor and Dielectric), By End User (Integrated Device Manufacturers, Foundry and Memory Manufacturers), By Country and Growth Forecast, 2022 - 2028

The Europe Semiconductor Etch Equipment Market would witness market growth of 8.2% CAGR during the forecast period (2022-2028).

Plasma treatment removes contaminants from a fiber surface, for instance, desizing cotton. Cleaning and plasma etching technology are broadly used in semiconductor and integrated circuit manufacturing. Plasma is the fourth state of matter (the other three are gas, liquid and solid), which is electrically charged and contains free electrons, positively charged ions, and free radicals (compounds or atoms with unsatisfied chemical bonds).

While there is no net charge within the plasma as a whole, the charged particles within the plasma can and are affected by external electromagnetic fields. Electronic engineers and physicists have devised ways to manipulate these electromagnetic fields to make beams of charged particles that to the integrated circuit engineer are similar to nano-milling machines. The plasmas from which these beams are created are chemically active and highly energetic, thus highly erosive/corrosive.

Plasma etching is also known as reactive ion etching, RIE (Reactive-ion etching), which shows how corrosive the plasma can be. Earlier, the plasma chamber was lined with monolithic ceramic components. However, today, as silicon wafer sizes have significantly increased, chamber sizes have also increased and are now coated with dense, high-quality ceramic coatings like yttria or alumina. Generally, the wafer-fixturing materials are also ceramics.

Germany plans to spend around EUR 50 billion to secure its position as a significant semiconductor production location. The country has announced major investment plans for the domestic production of semiconductors. Germany is investing prominently in its microelectronics sector to make the nation an international semiconductor production force. The ambitious deployment & development of semiconductor-based applications in the energy, manufacturing, and automotive sectors is crucial to the nation to meet its climate goals. Germany’s climate neutrality targets make attractive business opportunities and favorable market conditions for many international companies. These elements are assisting the market's expansion in the region.

The Germany market dominated the Europe Semiconductor Etch Equipment Market by Country in 2021, and would continue to be a dominant market till 2028; thereby, achieving a market value of $1,800.8 Million by 2028.The UK market is anticipated to grow at a CAGR of 7.2% during (2022 - 2028). Additionally, The France market would exhibit a CAGR of 9.1% during (2022 - 2028).

Based on Type, the market is segmented into Dry and Wet. Based on Process, the market is segmented into Conductor and Dielectric. Based on End User, the market is segmented into Integrated Device Manufacturers, Foundry and Memory Manufacturers. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation), ULVAC, Inc., Hitachi High-Tech Corporation (Hitachi, Ltd.), Tokyo Electron Ltd., Applied Materials, Inc., SPTS Technologies Ltd. (KLA Corporation), ASML Holding N.V., Samco, Inc., EV Group, and Suzhou Delphi Laser Co., Ltd.

Scope of the Study

Market Segments covered in the Report:

By Type

  • Dry
  • Wet
By Process
  • Conductor
  • Dielectric
By End User
  • Integrated Device Manufacturers
  • Foundry
  • Memory Manufacturers
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Companies Profiled
  • Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
  • ULVAC, Inc.
  • Hitachi High-Tech Corporation (Hitachi, Ltd.)
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • SPTS Technologies Ltd. (KLA Corporation)
  • ASML Holding N.V.
  • Samco, Inc.
  • EV Group
  • Suzhou Delphi Laser Co., Ltd.
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Semiconductor Etch Equipment Market, by Type
1.4.2 Europe Semiconductor Etch Equipment Market, by Process
1.4.3 Europe Semiconductor Etch Equipment Market, by End User
1.4.4 Europe Semiconductor Etch Equipment Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Strategies Deployed in Semiconductor Etch Equipment Market
Chapter 4. Europe Semiconductor Etch Equipment Market by Type
4.1 Europe Dry Market by Country
4.2 Europe Wet Market by Country
Chapter 5. Europe Semiconductor Etch Equipment Market by Process
5.1 Europe Conductor Market by Country
5.2 Europe Dielectric Market by Country
Chapter 6. Europe Semiconductor Etch Equipment Market by End User
6.1 Europe Integrated Device Manufacturers Market by Country
6.2 Europe Foundry Market by Country
6.3 Europe Memory Manufacturers Market by Country
Chapter 7. Europe Semiconductor Etch Equipment Market by Country
7.1 Germany Semiconductor Etch Equipment Market
7.1.1 Germany Semiconductor Etch Equipment Market by Type
7.1.2 Germany Semiconductor Etch Equipment Market by Process
7.1.3 Germany Semiconductor Etch Equipment Market by End User
7.2 UK Semiconductor Etch Equipment Market
7.2.1 UK Semiconductor Etch Equipment Market by Type
7.2.2 UK Semiconductor Etch Equipment Market by Process
7.2.3 UK Semiconductor Etch Equipment Market by End User
7.3 France Semiconductor Etch Equipment Market
7.3.1 France Semiconductor Etch Equipment Market by Type
7.3.2 France Semiconductor Etch Equipment Market by Process
7.3.3 France Semiconductor Etch Equipment Market by End User
7.4 Russia Semiconductor Etch Equipment Market
7.4.1 Russia Semiconductor Etch Equipment Market by Type
7.4.2 Russia Semiconductor Etch Equipment Market by Process
7.4.3 Russia Semiconductor Etch Equipment Market by End User
7.5 Spain Semiconductor Etch Equipment Market
7.5.1 Spain Semiconductor Etch Equipment Market by Type
7.5.2 Spain Semiconductor Etch Equipment Market by Process
7.5.3 Spain Semiconductor Etch Equipment Market by End User
7.6 Italy Semiconductor Etch Equipment Market
7.6.1 Italy Semiconductor Etch Equipment Market by Type
7.6.2 Italy Semiconductor Etch Equipment Market by Process
7.6.3 Italy Semiconductor Etch Equipment Market by End User
7.7 Rest of Europe Semiconductor Etch Equipment Market
7.7.1 Rest of Europe Semiconductor Etch Equipment Market by Type
7.7.2 Rest of Europe Semiconductor Etch Equipment Market by Process
7.7.3 Rest of Europe Semiconductor Etch Equipment Market by End User
Chapter 8. Company Profiles
8.1 Panasonic Industry Co., Ltd. (Panasonic Holdings Corporation)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Partnerships, Collaborations, and Agreements:
8.1.6 SWOT Analysis
8.2 ULVAC, Inc.
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expenses
8.2.5 Recent strategies and developments:
8.2.5.1 Partnerships, Collaborations, and Agreements:
8.3 Hitachi High-Tech Corporation (Hitachi, Ltd.)
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent strategies and developments:
8.3.5.1 Product Launches and Product Expansions:
8.4 Tokyo Electron Ltd.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Applied Materials, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Segmental and Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 Recent strategies and developments:
8.5.5.1 Product Launches and Product Expansions:
8.6 SPTS Technologies Ltd. (KLA Corporation)
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.7 ASML Holding N.V.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Regional Analysis
8.7.4 Research & Development Expenses
8.8 Samco, Inc.
8.8.1 Company Overview
8.8.2 Recent strategies and developments:
8.8.2.1 Product Launches and Product Expansions:
8.9 EV Group
8.9.1 Company Overview
8.10. Suzhou Delphi Laser Co., Ltd.
8.10.1 Company Overview

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