Europe Interposer and Fan-out Wafer Level Packaging Market Size, Share & Trends Analysis Report By Packaging Component & Design (Interposer, and FOWLP), By Packaging Type (2.5D, and 3D), By Device Type, By Vertical, By Country and Growth Forecast, 2023 -

Europe Interposer and Fan-out Wafer Level Packaging Market Size, Share & Trends Analysis Report By Packaging Component & Design (Interposer, and FOWLP), By Packaging Type (2.5D, and 3D), By Device Type, By Vertical, By Country and Growth Forecast, 2023 - 2030


The Europe Interposer and Fan-out Wafer Level Packaging Market would witness market growth of 10.7% CAGR during the forecast period (2023-2030).

The Germany market dominated the Europe Interposer and Fan-out Wafer Level Packaging Market by Country in 2022, and would continue to be a dominant market till 2030; thereby, achieving a market value of $3,342.3 million by 2030. The UK market is registering a CAGR of 9.7% during (2023 - 2030). Additionally, The France market would showcase a CAGR of 11.6% during (2023 - 2030).

interposer and fan-out WLP have found extensive applications in the consumer electronics sector. The demand for compact and powerful devices, such as smartphones, wearables, and tablets, has driven the integration of these packaging technologies to achieve smaller form factors and improved performance. The automotive industry has embraced interposer and fan-out WLP for applications ranging from advanced driver-assistance systems (ADAS) to in-vehicle infotainment. These packaging solutions provide reliability, durability, and performance in the challenging automotive environment.

Furthermore, in the telecommunications sector, the demand for high-speed and high-frequency components has led to the adoption of interposer and fan-out WLP. These technologies enable the integration of advanced communication devices with enhanced signal integrity and reduced signal losses. With the exponential growth of data and the demand for increased computing power, interposer and fan-out WLP have become integral to data center solutions. These packaging technologies facilitate the development of high-performance processors, memory modules, and interconnects for efficient data processing and storage.

As per the International Trade Administration data, in 2022, UK civil aerospace turnover totaled approximately $34.5 billion. The UK aerospace industry is the crown jewel for UK exports, and even though the UK does not produce large civil aircraft, 70% of domestic aerospace production is exported. In 2022, the UK defense industry turnover totaled approximately $29 billion, $15 billion of which was exported. In 2021, the UK space industry turnover totaled approximately $22 billion, $9.5 billion of which was exported. Thus, the rising aerospace sector in Europe will increase demand for interposer and fan-out wafer level packaging in the region.

Based on Packaging Component & Design, the market is segmented into Interposer, and FOWLP. Based on Packaging Type, the market is segmented into 2.5D, and 3D. Based on Device Type, the market is segmented into Memory Devices, Logic ICs, Imaging & Optoelectronics, LEDs, MEMS/Sensors, and Others. Based on Vertical, the market is segmented into Consumer Electronics, Communications, Manufacturing, Automotive, Aerospace, Medical Devices, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

List of Key Companies Profiled
  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ASE Group (ASE Technology Holding Co., Ltd.)
  • Amkor Technology, Inc.
  • JCET Group
  • Powertech Technology, Inc.
  • Advanced Micro Devices, Inc.
  • Samtec
  • SK hynix, Inc.
  • Deca Technologies, Inc. (Infineon Technologies AG)
Europe Interposer and Fan-out Wafer Level Packaging Market Report Segmentation

By Packaging Component & Design
  • Interposer
  • FOWLP
By Packaging Type
  • 2.5D
  • 3D
By Device Type
  • Memory Devices
  • Logic ICs
  • Imaging & Optoelectronics
  • LEDs
  • MEMS/Sensors
  • Others
By Vertical
  • Consumer Electronics
  • Communications
  • Manufacturing
  • Automotive
  • Aerospace
  • Medical Devices
  • Others
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe


Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Interposer and Fan-out Wafer Level Packaging Market, by Packaging Component & Design
1.4.2 Europe Interposer and Fan-out Wafer Level Packaging Market, by Packaging Type
1.4.3 Europe Interposer and Fan-out Wafer Level Packaging Market, by Device Type
1.4.4 Europe Interposer and Fan-out Wafer Level Packaging Market, by Vertical
1.4.5 Europe Interposer and Fan-out Wafer Level Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Opportunities
3.2.3 Market Restraints
3.2.4 Market Challenges
Chapter 4. Competition Analysis – Global
4.1 Market Share Analysis, 2022
4.2 Porter Five Forces Analysis
Chapter 5. Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
5.1 Europe Interposer Market by Country
5.2 Europe FOWLP Market by Country
Chapter 6. Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
6.1 Europe 2.5D Market by Country
6.2 Europe 3D Market by Country
Chapter 7. Europe Interposer and Fan-out Wafer Level Packaging Market by Device Type
7.1 Europe Memory Devices Market by Country
7.2 Europe Logic ICs Market by Country
7.3 Europe Imaging & Optoelectronics Market by Country
7.4 Europe LEDs Market by Country
7.5 Europe MEMS/Sensors Market by Country
7.6 Europe Others Market by Country
Chapter 8. Europe Interposer and Fan-out Wafer Level Packaging Market by Vertical
8.1 Europe Consumer Electronics Market by Country
8.2 Europe Communications Market by Country
8.3 Europe Manufacturing Market by Country
8.4 Europe Automotive Market by Country
8.5 Europe Aerospace Market by Country
8.6 Europe Medical Devices Market by Country
8.7 Europe Others Market by Country
Chapter 9. Europe Interposer and Fan-out Wafer Level Packaging Market by Country
9.1 Germany Interposer and Fan-out Wafer Level Packaging Market
9.1.1 Germany Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.1.2 Germany Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.1.3 Germany Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.1.4 Germany Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.2 UK Interposer and Fan-out Wafer Level Packaging Market
9.2.1 UK Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.2.2 UK Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.2.3 UK Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.2.4 UK Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.3 France Interposer and Fan-out Wafer Level Packaging Market
9.3.1 France Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.3.2 France Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.3.3 France Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.3.4 France Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.4 Russia Interposer and Fan-out Wafer Level Packaging Market
9.4.1 Russia Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.4.2 Russia Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.4.3 Russia Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.4.4 Russia Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.5 Spain Interposer and Fan-out Wafer Level Packaging Market
9.5.1 Spain Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.5.2 Spain Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.5.3 Spain Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.5.4 Spain Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.6 Italy Interposer and Fan-out Wafer Level Packaging Market
9.6.1 Italy Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.6.2 Italy Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.6.3 Italy Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.6.4 Italy Interposer and Fan-out Wafer Level Packaging Market by Vertical
9.7 Rest of Europe Interposer and Fan-out Wafer Level Packaging Market
9.7.1 Rest of Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design
9.7.2 Rest of Europe Interposer and Fan-out Wafer Level Packaging Market by Packaging Type
9.7.3 Rest of Europe Interposer and Fan-out Wafer Level Packaging Market by Device Type
9.7.4 Rest of Europe Interposer and Fan-out Wafer Level Packaging Market by Vertical
Chapter 10. Company Profiles
10.1 Taiwan Semiconductor Manufacturing Company Limited
10.1.1 Company overview
10.1.2 Financial Analysis
10.1.3 Regional Analysis
10.1.4 Research & Development Expenses
10.1.5 SWOT Analysis
10.2 Samsung Electronics Co., Ltd. (Samsung Group)
10.2.1 Company Overview
10.2.2 Financial Analysis
10.2.3 Segmental and Regional Analysis
10.2.4 Recent strategies and developments:
10.2.4.1 Partnerships, Collaborations, and Agreements:
10.2.4.2 Product Launches and Product Expansions:
10.2.5 SWOT Analysis
10.3 ASE Group (ASE Technology Holding Co., Ltd.)
10.3.1 Company Overview
10.3.2 Financial Analysis
10.3.3 Segmental and Regional Analysis
10.3.4 Research & Development Expenses
10.3.5 Recent strategies and developments:
10.3.5.1 Product Launches and Product Expansions:
10.3.6 SWOT Analysis
10.4 Amkor Technology, Inc.
10.4.1 Company Overview
10.4.2 Financial Analysis
10.4.3 Research & Development Expense
10.4.4 SWOT Analysis
10.5 JCET Group
10.5.1 Company Overview
10.5.2 Financial Analysis
10.5.3 Research & Development Expenses
10.5.4 SWOT Analysis
10.6 Powertech Technology Inc.
10.6.1 Company Overview
10.6.2 Financial Analysis
10.6.3 Regional Analysis
10.6.4 Research & Development Expenses
10.6.5 SWOT Analysis
10.7 Advanced Micro Devices, Inc.
10.7.1 Company Overview
10.7.2 Financial Analysis
10.7.3 Segmental and Regional Analysis
10.7.4 Research & Development Expenses
10.7.5 SWOT Analysis
10.8 Samtec
10.8.1 Company Overview
10.8.2 SWOT Analysis
10.9 SK hynix, Inc.
10.9.1 Company Overview
10.9.2 Financial Analysis
10.9.3 SWOT Analysis
10.10. Deca Technologies, Inc. (Infineon Technologies AG)
10.10.1 Company Overview
10.10.2 Financial Analysis
10.10.3 Segmental and Regional Analysis
10.10.4 Research & Development Expense
10.10.5 SWOT Analysis

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