Europe Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030

Europe Board-to-Board Connectors Market Size, Share & Industry Trends Analysis Report By Type (Pin Headers (Stacked Header, and Shrouded Header), and Socket), By Pitch, By Application, By Country and Growth Forecast, 2023 - 2030


The Europe Board-to-Board Connectors Market would witness market growth of 6.0% CAGR during the forecast period (2023-2030). In the year 2020, the Europe market's volume surged to 402.7 million units, showcasing a growth of 2.5% (2019-2022).

The market for board-to-board connectors has been impacted by the decreasing price gap between the various brands and industry competitors. The need for BTB connectors is increasing along with the performance levels of products. The market expansion for BTB connectors has been impacted by the expanding varieties of products and exceptional after-sales services. According to research, the BTB connections market is dominated by high-end or premium products.

To make single-board computers (SBCs) tiny, designers must cram as much processing power, functionality, and I/O onto that circuit board. Multiple computer boards are necessary because a single board design cannot realistically address industrial, consumer, and medical applications. Board-to-board (BTB) connectors are utilized for connecting several boards in this situation and become extremely crucial.

Given that 77 percent of Germans live in cities and towns, it is commonly understood that smart urban development employing digital technology is important. The disruption of modern urban living by technology has an opportunity to improve living standards. With all of this, the region would see a dramatic increase in adopting items like smart thermostats, lighting control, and others. The market for board-to-board connectors, which are utilized to connect control units to various sensors, will ultimately grow as a result.

The Germany market dominated the Europe Board-to-Board Connectors Market by Country in 2022 and would continue to be a dominant market till 2030; thereby, achieving a market value of $1,049.9 million by 2030. The UK market is registering a CAGR of 5.1% during (2023 - 2030). Additionally, The France market would showcase a CAGR of 6.7% during (2023 - 2030).

Based on Type, the market is segmented into Pin Headers (Stacked Header, and Shrouded Header), and Socket. Based on Pitch, the market is segmented into 1 mm to 2 mm, Greater Than 2 mm, and Less Than 1 mm. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial Automation, Healthcare, Telecommunication, and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stakeholders of the market. Key companies profiled in the report include Amphenol Corporation, TE Connectivity Ltd., Molex, LLC (Koch Industries, Inc.), Kyocera Corporation, HARTING Technology Group, Omron Corporation, Japan Aviation Electronics Industry, Limited, Hirose Electric Co., Ltd, Samtec, FIT Hon Teng Limited (Foxconn (Far East) Limited).

Scope of the Study

Market Segments covered in the Report:

By Type (Volume, Million Units, USD Million, 2019-2030)
  • Pin Headers
  • Stacked Header
  • Shrouded Header
  • Socket
By Pitch (Volume, Million Units, USD Million, 2019-2030)
  • 1 mm to 2 mm
  • Greater Than 2 mm
  • Less Than 1 mm
By Application (Volume, Million Units, USD Million, 2019-2030)
  • Consumer Electronics
  • Automotive
  • Industrial Automation
  • Healthcare
  • Telecommunication
  • Others
By Country (Volume, Million Units, USD Million, 2019-2030)
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Companies Profiled
  • Amphenol Corporation
  • TE Connectivity Ltd.
  • Molex, LLC (Koch Industries, Inc.)
  • Kyocera Corporation
  • HARTING Technology Group
  • Omron Corporation
  • Japan Aviation Electronics Industry, Limited
  • Hirose Electric Co., Ltd
  • Samtec
  • FIT Hon Teng Limited (Foxconn (Far East) Limited)
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Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe Board-to-Board Connectors Market, by Type
1.4.2 Europe Board-to-Board Connectors Market, by Pitch
1.4.3 Europe Board-to-Board Connectors Market, by Application
1.4.4 Europe Board-to-Board Connectors Market, by Country
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
Chapter 4. Competition Analysis - Global
4.1 KBV Cardinal Matrix
4.2 Recent Industry Wide Strategic Developments
4.2.1 Partnerships, Collaborations and Agreements
4.2.2 Product Launches and Product Expansions
4.2.3 Acquisition and Mergers
4.3 Market Share Analysis, 2022
4.4 Top Winning Strategies
4.4.1 Key Leading Strategies: Percentage Distribution (2019-2023)
4.4.2 Key Strategic Move: (Product Launches and Product Expansions: 2020, Jan – 2023, Jul) Leading Players
4.5 Porter’s Five Force Analysis
Chapter 5. Europe Board-to-Board Connectors Market by Type
5.1 Europe Pin Headers Market by Country
5.2 Europe Board-to-Board Connectors Market by Pin Headers Type
5.2.1 Europe Stacked Header Market by Country
5.2.2 Europe Shrouded Header Market by Country
5.3 Europe Socket Market by Country
Chapter 6. Europe Board-to-Board Connectors Market by Pitch
6.1 Europe 1 mm to 2 mm Market by Country
6.2 Europe Greater Than 2 mm Market by Country
6.3 Europe Less Than 1 mm Market by Country
Chapter 7. Europe Board-to-Board Connectors Market by Application
7.1 Europe Consumer Electronics Market by Country
7.2 Europe Automotive Market by Country
7.3 Europe Industrial Automation Market by Country
7.4 Europe Healthcare Market by Country
7.5 Europe Telecommunication Market by Country
7.6 Europe Others Market by Country
Chapter 8. Europe Board-to-Board Connectors Market by Country
8.1 Germany Board-to-Board Connectors Market
8.1.1 Germany Board-to-Board Connectors Market by Type
8.1.1.1 Germany Board-to-Board Connectors Market by Pin Headers Type
8.1.2 Germany Board-to-Board Connectors Market by Pitch
8.1.3 Germany Board-to-Board Connectors Market by Application
8.2 UK Board-to-Board Connectors Market
8.2.1 UK Board-to-Board Connectors Market by Type
8.2.1.1 UK Board-to-Board Connectors Market by Pin Headers Type
8.2.2 UK Board-to-Board Connectors Market by Pitch
8.2.3 UK Board-to-Board Connectors Market by Application
8.3 France Board-to-Board Connectors Market
8.3.1 France Board-to-Board Connectors Market by Type
8.3.1.1 France Board-to-Board Connectors Market by Pin Headers Type
8.3.2 France Board-to-Board Connectors Market by Pitch
8.3.3 France Board-to-Board Connectors Market by Application
8.4 Russia Board-to-Board Connectors Market
8.4.1 Russia Board-to-Board Connectors Market by Type
8.4.1.1 Russia Board-to-Board Connectors Market by Pin Headers Type
8.4.2 Russia Board-to-Board Connectors Market by Pitch
8.4.3 Russia Board-to-Board Connectors Market by Application
8.5 Spain Board-to-Board Connectors Market
8.5.1 Spain Board-to-Board Connectors Market by Type
8.5.1.1 Spain Board-to-Board Connectors Market by Pin Headers Type
8.5.2 Spain Board-to-Board Connectors Market by Pitch
8.5.3 Spain Board-to-Board Connectors Market by Application
8.6 Italy Board-to-Board Connectors Market
8.6.1 Italy Board-to-Board Connectors Market by Type
8.6.1.1 Italy Board-to-Board Connectors Market by Pin Headers Type
8.6.2 Italy Board-to-Board Connectors Market by Pitch
8.6.3 Italy Board-to-Board Connectors Market by Application
8.7 Rest of Europe Board-to-Board Connectors Market
8.7.1 Rest of Europe Board-to-Board Connectors Market by Type
8.7.1.1 Rest of Europe Board-to-Board Connectors Market by Pin Headers Type
8.7.2 Rest of Europe Board-to-Board Connectors Market by Pitch
8.7.3 Rest of Europe Board-to-Board Connectors Market by Application
Chapter 9. Company Profiles
9.1 Amphenol Corporation
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.4 Research & Development Expenses
9.1.5 SWOT Analysis
9.2 TE Connectivity Ltd.
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expense
9.2.5 Recent strategies and developments:
9.2.5.1 Acquisition and Mergers:
9.2.5.2 Product Launches and Product Expansions:
9.2.5.3 Partnerships, Collaborations, and Agreements:
9.2.6 SWOT Analysis
9.3 Molex, LLC (Koch Industries, Inc.)
9.3.1 Company Overview
9.3.2 Recent strategies and developments:
9.3.2.1 Product Launches and Product Expansions:
9.3.2.2 Acquisition and Mergers:
9.3.3 SWOT Analysis
9.4 Kyocera Corporation
9.4.1 Company Overview
9.4.2 Financial Analysis
9.4.3 Segmental and Regional Analysis
9.4.4 Research & Development Expenses
9.4.5 Recent strategies and developments:
9.4.5.1 Product Launches and Product Expansions:
9.4.6 SWOT Analysis
9.5 HARTING Technology Group
9.5.1 Company Overview
9.5.2 Recent strategies and developments:
9.5.2.1 Partnerships, Collaborations, and Agreements:
9.5.3 SWOT Analysis
9.6 Omron Corporation
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 Recent strategies and developments:
9.6.5.1 Product Launches and Product Expansions:
9.6.6 SWOT Analysis
9.7 Japan Aviation Electronics Industry, Limited
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental Analysis
9.7.4 Recent strategies and developments:
9.7.4.1 Product Launches and Product Expansions:
9.7.5 SWOT Analysis
9.8 Hirose Electric Co., Ltd
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Recent strategies and developments:
9.8.4.1 Partnerships, Collaborations, and Agreements:
9.8.4.2 Product Launches and Product Expansions:
9.8.5 SWOT Analysis
9.9 Samtec
9.9.1 Company Overview
9.9.2 SWOT Analysis
9.10. FIT Hon Teng Limited (Foxconn (Far East) Limited)
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis

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