Europe 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029

Europe 3D IC and 2.5D IC Packaging Market Size, Share & Industry Trends Analysis Report By Packaging Technology, By End User, By Application (Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED), By Country and Growth Forecast, 2023 - 2029


The Europe 3D IC and 2.5D IC Packaging Market would witness market growth of 9.6% CAGR during the forecast period (2023-2029).

3D ICs and 2.5D ICs have the best electronic architecture. In the future, IC packaging will be required for all electrical devices. The market is consequently closely related to increasing sales and demand. The need for these semiconductors is increasing as modern technologies like high-performance computers, artificial intelligence (AI), and 5G continue to develop. Utilizing these devices enhances the bandwidth, performance, as well as latency of electronic equipment. The demand for smartphones, tablets, and gaming devices, as well as other factors, are also driving the business. In addition, demand is also anticipated to increase due to the growing adoption of advanced design in electronic goods and the move toward smaller electronic devices.

ICs are frequently the primary source of power for medical devices. These include blood collection tools, heart monitors, and some kinds of surgical instruments. As a result, surgery has been more effective because of IC-powered medical equipment, which has improved patient outcomes. These tools let surgeons carry out procedures more precisely and avoid numerous common human errors.

The European semiconductor industry is represented by an organization known as ESIA, which stands for the European Semiconductor Industry Association. In addition to advancing economic growth and responding to pressing societal issues as a supplier of essential supporting technologies, the sector offers creative solutions for the growth of local enterprises. In general, micro- and nanoelectronics allow Europe and the rest of the globe to produce at least 10% of GDP. Furthermore, IC packaging solutions in this region would benefit from expanding the semiconductor sector. Therefore, this element will fuel the regional market's expansion in the upcoming years.

The Germany market dominated the Europe 3D IC and 2.5D IC Packaging Market by Country in 2022 and would continue to be a dominant market till 2029; thereby, achieving a market value of $4,544.2 Million by 2029. The UK market is estimated to grow at a CAGR of 8.7% during (2023 - 2029). Additionally, The France market would exhibit a CAGR of 10.4% during (2023 - 2029).

Based on Packaging Technology, the market is segmented into 2.5D, 3D wafer-level chip-scale packaging (WLCSP) and 3D Through-silicon via (TSV). Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Military & Aerospace, Telecommunications and Medical Devices & Others. Based on Application, the market is segmented into Memory, Imaging & Optoelectronics, MEMS/Sensors, Logic, LED and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, ASE Group (ASE Technology Holding Co., Ltd.), Amkor Technology, Inc., Broadcom, Inc., Texas Instruments, Inc., JCET Group, Powertech Technology, Inc. and United Microelectronics Corporation.

Scope of the Study

Market Segments covered in the Report:

By Packaging Technology
  • 2.5D
  • 3D wafer-level chip-scale packaging (WLCSP)
  • 3D Through-silicon via (TSV)
By End User
  • Consumer Electronics
  • Automotive
  • Industrial
  • Military & Aerospace
  • Telecommunications
  • Medical Devices & Others
By Application
  • Memory
  • Imaging & Optoelectronics
  • MEMS/Sensors
  • Logic
  • LED
  • Others
By Country
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Companies Profiled
  • Samsung Electronics Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • ASE Group (ASE Technology Holding Co., Ltd.)
  • Amkor Technology, Inc.
  • Broadcom, Inc.
  • Texas Instruments, Inc.
  • JCET Group
  • Powertech Technology, Inc.
  • United Microelectronics Corporation
Unique Offerings from KBV Research
  • Exhaustive coverage
  • Highest number of market tables and figures
  • Subscription based model available
  • Guaranteed best price
  • Assured post sales research support with 10% customization free


Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Europe 3D IC and 2.5D IC Packaging Market, by Packaging Technology
1.4.2 Europe 3D IC and 2.5D IC Packaging Market, by End User
1.4.3 Europe 3D IC and 2.5D IC Packaging Market, by Application
1.4.4 Europe 3D IC and 2.5D IC Packaging Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.1.1 Market Composition & Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis – Global
3.1 Market Share Analysis, 2022
Chapter 4. Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
4.1 Europe 2.5D Market by Country
4.2 Europe 3D wafer-level chip-scale packaging (WLCSP) Market by Country
4.3 Europe 3D Through-silicon via (TSV) Market by Country
Chapter 5. Europe 3D IC and 2.5D IC Packaging Market by End User
5.1 Europe Consumer Electronics Market by Country
5.2 Europe Automotive Market by Country
5.3 Europe Industrial Market by Country
5.4 Europe Military & Aerospace Market by Country
5.5 Europe Telecommunications Market by Country
5.6 Europe Medical Devices & Others Market by Country
Chapter 6. Europe 3D IC and 2.5D IC Packaging Market by Application
6.1 Europe Memory Market by Country
6.2 Europe Imaging & Optoelectronics Market by Country
6.3 Europe MEMS/Sensors Market by Country
6.4 Europe Logic Market by Country
6.5 Europe LED Market by Country
6.6 Europe Others Market by Country
Chapter 7. Europe 3D IC and 2.5D IC Packaging Market by Country
7.1 Germany 3D IC and 2.5D IC Packaging Market
7.1.1 Germany 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.1.2 Germany 3D IC and 2.5D IC Packaging Market by End User
7.1.3 Germany 3D IC and 2.5D IC Packaging Market by Application
7.2 UK 3D IC and 2.5D IC Packaging Market
7.2.1 UK 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.2.2 UK 3D IC and 2.5D IC Packaging Market by End User
7.2.3 UK 3D IC and 2.5D IC Packaging Market by Application
7.3 France 3D IC and 2.5D IC Packaging Market
7.3.1 France 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.3.2 France 3D IC and 2.5D IC Packaging Market by End User
7.3.3 France 3D IC and 2.5D IC Packaging Market by Application
7.4 Russia 3D IC and 2.5D IC Packaging Market
7.4.1 Russia 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.4.2 Russia 3D IC and 2.5D IC Packaging Market by End User
7.4.3 Russia 3D IC and 2.5D IC Packaging Market by Application
7.5 Spain 3D IC and 2.5D IC Packaging Market
7.5.1 Spain 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.5.2 Spain 3D IC and 2.5D IC Packaging Market by End User
7.5.3 Spain 3D IC and 2.5D IC Packaging Market by Application
7.6 Italy 3D IC and 2.5D IC Packaging Market
7.6.1 Italy 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.6.2 Italy 3D IC and 2.5D IC Packaging Market by End User
7.6.3 Italy 3D IC and 2.5D IC Packaging Market by Application
7.7 Rest of Europe 3D IC and 2.5D IC Packaging Market
7.7.1 Rest of Europe 3D IC and 2.5D IC Packaging Market by Packaging Technology
7.7.2 Rest of Europe 3D IC and 2.5D IC Packaging Market by End User
7.7.3 Rest of Europe 3D IC and 2.5D IC Packaging Market by Application
Chapter 8. Company Profiles
8.1 Samsung Electronics Co., Ltd. (Samsung Group)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent strategies and developments:
8.1.5.1 Product Launches and Product Expansions:
8.1.6 SWOT Analysis
8.2 Taiwan Semiconductor Manufacturing Company Limited
8.2.1 Company overview
8.2.2 Financial Analysis
8.2.3 Regional Analysis
8.2.4 Research & Development Expenses
8.3 Intel Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Segmental and Regional Analysis
8.3.4 Research & Development Expenses
8.3.5 SWOT Analysis
8.4 ASE Group (ASE Technology Holding Co., Ltd.)
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expenses
8.4.5 Recent strategies and developments:
8.4.5.1 Product Launches and Product Expansions:
8.5 Amkor Technology, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Research & Development Expense
8.5.4 Recent strategies and developments:
8.5.4.1 Partnerships, Collaborations, and Agreements:
8.6 Broadcom, Inc.
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expense
8.6.5 SWOT Analysis
8.7 Texas Instruments, Inc.
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.8 JCET Group
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Research & Development Expenses
8.9 Powertech Technology Inc.
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Regional Analysis
8.9.4 Research & Development Expenses
8.10. United Microelectronics Corporation
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Regional Analysis
8.10.4 Research & Development Expenses

Download our eBook: How to Succeed Using Market Research

Learn how to effectively navigate the market research process to help guide your organization on the journey to success.

Download eBook
Cookie Settings