Microelectronics market research reports by KnowMade

Hybrid Bonding – Patent Landscape Analysis 2024

Aug 01, 2024  |  Published by: KnowMade  |  USD 5,406

Hybrid Bonding – Patent Landscape Analysis 2024 Hybrid bonding has become a key enabler of advanced packaging Hybrid bonding combines dielectric-to-dielectric and metal-to-metal bonds to interconnect wafer-to-wafer, die-to-wafer, or die-to-die without the need for solder or other adhesives. This bon ... Read More