Global Wafer Fab Equipment Market 2023-2027
The wafer fab equipment market is forecasted to grow by USD 43.94 bn during 2022-2027, accelerating at a CAGR of 8.43% during the forecast period. The report on the wafer fab equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing demand for consumer electronics, increasing use of semiconductor chips in various industries, and shift from traditional silicon-based technologies to advanced technologies like 5g, ai, iot, and autonomous vehicles.
Technavio's wafer fab equipment market is segmented as below:
By Technology
- Automatic layer deposition
- Chemical vapor deposition
- Etching
- Oxidation
- Others
By End-user
- Foundry
- Memory
- Integrated device manufacturer (IDM)
By Geography
- APAC
- North America
- Europe
- Middle East and Africa
- South America
This study identifies the technological advancements in semiconductor industry as one of the prime reasons driving the wafer fab equipment market growth during the next few years. Also, growing demand for advanced packaging technologies and increasing focus on energy-efficient devices and green energy solutions will lead to sizable demand in the market.
The report on the wafer fab equipment market covers the following areas:
- Wafer fab equipment market sizing
- Wafer fab equipment market forecast
- Wafer fab equipment market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading wafer fab equipment market vendors that include ASML, AIXTRON SE, Applied Materials Inc., ASM International NV, ASMPT Ltd., Baxter International Inc., EV Group, FormFactor Inc., Hitachi Ltd., HORIBA Ltd., KLA Corp., KOKUSAI ELECTRIC CORP., Lam Research Corp., Nikon Corp., PLASMA THERM, Taiwan Semiconductor Manufacturing Co. Ltd., Teradyne Inc., Tokyo Electron Ltd., Screen Holdings Co. Ltd., and Hanmi Semiconductor Co. Ltd.. Also, the wafer fab equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.