Global Thermal Interface Materials Market 2024-2028
Global Thermal Interface Materials Market 2024-2028
The thermal interface materials market is forecasted to grow by USD 3162.4 mn during 2023-2028, accelerating at a CAGR of 18.57% during the forecast period. The report on the thermal interface materials market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing demand from computers hardware manufacturing, rising demand for automobile electronics, and growing adoption of industrial automation.
Technavio's thermal interface materials market is segmented as below:
By Application
- Computers
- Telecom
- Automotive electronics
- Medical devices
- Others
By Type
- Grease and adhesive
- Taps and films
- Phase change materials
- Others
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This study identifies the advances in technology as one of the prime reasons driving the thermal interface materials market growth during the next few years. Also, increasing usage of pctims and growing use of fiber-reinforced composite materials in medical applications will lead to sizable demand in the market.
The report on the thermal interface materials market covers the following areas:
- Thermal interface materials market sizing
- Thermal interface materials market forecast
- Thermal interface materials market industry analysis
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading thermal interface materials market vendors that include 3M Co., AIM Metals and Alloys LP, AOS Thermal Compounds LLC, Bergquist, DALEBA ELECTRONICS LTD, Dow Chemical Co., DuPont de Nemours Inc., Fuji Polymer Industries Co. Ltd., GrafTech International Ltd., Henkel AG and Co. KGaA, Honeywell International Inc., Indium Corp., KITAGAWA INDUSTRIES America Inc., Laird Performance Materials, Momentive Performance Materials Inc., Parker Hannifin Corp., SEMIKRON Elektronik GmbH and Co. KG, Shin Etsu Chemical Co. Ltd., Wakefield Thermal Inc., and ZALMAN. Also, the thermal interface materials market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.