Global Semiconductor Chip Packaging Market 2023-2027
Technavio has been monitoring the semiconductor chip packaging market and is forecast to grow by $489.22 bn during 2022-2027, accelerating at a CAGR of 27.69% during the forecast period. Our report on the semiconductor chip packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by growing investment in fabrication facilities, rising integration of ICs in automobiles, and increase in number of fabless semiconductor companies.
Technavio's semiconductor chip packaging market is segmented as below:
By Packaging
- 3DIC TSV stacks
- 2.5D interposers
- Flip-chip wafer bumping
- FO WLP/SiP
- Others
By End-user
By Geographical Landscape
- APAC
- North America
- Europe
- South America
- Middle East and Africa
This study identifies the growing investments in lower technology nodes as one of the prime reasons driving the semiconductor chip packaging market growth during the next few years. Also, increasing focus on large-diameter wafer size and the emergence of heterogeneous integration will lead to sizable demand in the market.
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters. Our report on the semiconductor chip packaging market covers the following areas:
- Semiconductor chip packaging market sizing
- Semiconductor chip packaging market forecast
- Semiconductor chip packaging market industry analysis
Technavio's robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor chip packaging market vendors that include 3M Co., Amkor Technology Inc., Applied Materials Inc., ASE Technology Holding Co. Ltd., ASM Pacific Technology Ltd., ChipMOS TECHNOLOGIES Inc., GlobalFoundaries US Inc., Greatek Electronics Inc., Jiangsu Changdian Technology Co. Ltd., Kulicke and Soffa Industries Inc., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., SkyWater Technology Inc., SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Tokyo Electron Ltd., Unisem M Berhad, UTAC Holdings Ltd., and Veeco Instruments Inc. Also, the semiconductor chip packaging market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
Technavio presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. Technavio's market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast accurate market growth.