Summary
EEE includes a wide range of products with circuity or electrical components with a power or battery supply. Almost any household or business use products like basic kitchen appliances, toys, tools to music, and ICT items, such as mobile phones, laptops, etc. EEE becomes e-waste once it has been discarded by its owner as waste without the intent of reuse. Each product has different material content, is disposed of and recycled in different ways, and is unequally harmful to the environment and human health if not managed in an environmentally sound manner.
Printed circuit board is an electronic circuit used in electronic devices to provide mechanical support. PCB mechanically supports and electrically converts electronic components using conductive pathways, tracks, or signal traces etched from copper sheets laminated onto a non-conductive substrate. They are generally made of metal circuits, chips, ICs, sockets, cables, and plastic laminates. These are the elementary component for most of the electronics in the present scenario. PCBs are present in almost all electronic devices we use on a daily basis which include computers, TVs, smartphones, washing machines, coffee makers, ovens and refrigerators etc.
E-waste recycling industry refers to the work or business contains the collecting, transporting, re-using or processing of e-waste.
In this report, we will have an oversight of the current situation and development trend of PCB e-scrap recycling industry worldwide.
According to APO Research, The global Printed Circuit Board (PCB) E-scrap Recycling market is projected to grow from US$ million in 2025 to US$ million by 2031, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for Printed Circuit Board (PCB) E-scrap Recycling is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Printed Circuit Board (PCB) E-scrap Recycling is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The China market for Printed Circuit Board (PCB) E-scrap Recycling is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Europe market for Printed Circuit Board (PCB) E-scrap Recycling is estimated to increase from $ million in 2025 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global companies of Printed Circuit Board (PCB) E-scrap Recycling include Boliden, Umicore, Aurubis, Mitsubishi Materials Corporation, Asahi Holdings, Glencore(Canada), LS-Nikko Copper, Dowa Holdings and Mitsui Mining & Smelting, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Includes
This report presents an overview of global market for Printed Circuit Board (PCB) E-scrap Recycling, market size. Analyses of the global market trends, with historic market revenue data for 2020 - 2024, estimates for 2025, and projections of CAGR through 2031.
This report researches the key producers of Printed Circuit Board (PCB) E-scrap Recycling, also provides the revenue of main regions and countries. Of the upcoming market potential for Printed Circuit Board (PCB) E-scrap Recycling, and key regions or countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Printed Circuit Board (PCB) E-scrap Recycling revenue, market share and industry ranking of main manufacturers, data from 2020 to 2025. Identification of the major stakeholders in the global Printed Circuit Board (PCB) E-scrap Recycling market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2020 to 2031. Evaluation and forecast the market size for Printed Circuit Board (PCB) E-scrap Recycling revenue, projected growth trends, production technology, application and end-user industry.
Printed Circuit Board (PCB) E-scrap Recycling Segment by Company
Boliden
Umicore
Aurubis
Mitsubishi Materials Corporation
Asahi Holdings
Glencore(Canada)
LS-Nikko Copper
Dowa Holdings
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Korea Zinc
Printed Circuit Board (PCB) E-scrap Recycling Segment by Type
Precious Metal
Copper
Others
Printed Circuit Board (PCB) E-scrap Recycling Segment by Application
Smartphones
PC & Laptop
Telecommunications
TV & Monitor
Others
Printed Circuit Board (PCB) E-scrap Recycling Segment by Region
North America
United States
Canada
Mexico
Europe
Germany
France
U.K.
Italy
Russia
Spain
Netherlands
Switzerland
Sweden
Poland
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Southeast Asia
South America
Brazil
Argentina
Chile
Middle East & Africa
Egypt
South Africa
Israel
Türkiye
GCC Countries
Study Objectives
1. To analyze and research the global status and future forecast, involving, production, value, consumption, growth rate (CAGR), market share, historical and forecast.
2. To present the key manufacturers, capacity, production, revenue, market share, and Recent Developments.
3. To split the breakdown data by regions, type, manufacturers, and Application.
4. To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints, and risks.
5. To identify significant trends, drivers, influence factors in global and regions.
6. To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
Reasons to Buy This Report
1. This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Printed Circuit Board (PCB) E-scrap Recycling market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
2. This report will help stakeholders to understand the global industry status and trends of Printed Circuit Board (PCB) E-scrap Recycling and provides them with information on key market drivers, restraints, challenges, and opportunities.
3. This report will help stakeholders to understand competitors better and gain more insights to strengthen their position in their businesses. The competitive landscape section includes the market share and rank (in volume and value), competitor ecosystem, new product development, expansion, and acquisition.
4. This report stays updated with novel technology integration, features, and the latest developments in the market.
5. This report helps stakeholders to gain insights into which regions to target globally.
6. This report helps stakeholders to gain insights into the end-user perception concerning the adoption of Printed Circuit Board (PCB) E-scrap Recycling.
7. This report helps stakeholders to identify some of the key players in the market and understand their valuable contribution.
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. Revenue of Printed Circuit Board (PCB) E-scrap Recycling in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Analysis key trends, drivers, challenges, and opportunities within the global Printed Circuit Board (PCB) E-scrap Recycling industry.
Chapter 3: Detailed analysis of Printed Circuit Board (PCB) E-scrap Recycling companies' competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Printed Circuit Board (PCB) E-scrap Recyclingrevenue, gross margin, and recent development, etc.
Chapter 7: North America (US & Canada) by type, by application and by country, revenue for each segment.
Chapter 8: Europe by type, by application and by country, revenue for each segment.
Chapter 9: China by type, and by application, revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, revenue for each segment.
Chapter 11: South America, Middle East & Africa by type, by application and by country, revenue for each segment.
Chapter 12: Concluding Insights of the report.
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