The World Market for Parts of Electronic Integrated Circuits and Microassembles: A 2024 Global Trade Perspective
This report was created for strategic planners, international executives, and import/export managers who are concerned with the market for parts of electronic integrated circuits and microassembles. With the globalization of this market, managers can no longer be contented with a local view. Nor can managers be contented with out-of-date statistics that appear several years after the fact. Professor Philip M. Parker, the Chair Professor of Management Science at INSEAD, has developed a methodology, based on macroeconomic and trade models, to estimate the market for parts of electronic integrated circuits and microassembles for those countries serving the world market via exports or supplying from various countries via imports. He does so for the current year based on a variety of key historical indicators and econometric models.
"Parts of electronic integrated circuits and microassembles" as a category is defined in this report following the definition given by the United Nations Statistics Division Classification Registry using the Standard International Trade Classification, Revision 3 (SITC, Rev. 3). The SITC code that defines "parts of electronic integrated circuits and microassembles" is 77689.
1 METHODOLOGY
1.1 OUR APPROACH
2 THE WORLD MARKET
2.1 EXPORTS
2.1.1 THE WORLD MARKET: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES EXPORT SUPPLIES IN 2024
2.2 IMPORTS
2.2.1 THE WORLD MARKET: IMPORTED PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3 EXPORTS
3.1 AFRICA: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.1.1 EXECUTIVE SUMMARY
3.1.2 ETHIOPIA
3.1.3 KENYA
3.1.4 MOROCCO
3.1.5 SOUTH AFRICA
3.1.6 TUNISIA
3.1.7 UGANDA
3.2 ASIA: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.2.1 EXECUTIVE SUMMARY
3.2.2 BRUNEI
3.2.3 CHINA
3.2.4 HONG KONG
3.2.5 INDIA
3.2.6 INDONESIA
3.2.7 JAPAN
3.2.8 MACAU
3.2.9 MALAYSIA
3.2.10 NORTH KOREA
3.2.11 SEYCHELLES
3.2.12 SINGAPORE
3.2.13 SOUTH KOREA
3.2.14 SRI LANKA
3.2.15 TAIWAN
3.2.16 THAILAND
3.2.17 THE PHILIPPINES
3.2.18 VIETNAM
3.3 EUROPE: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.3.1 EXECUTIVE SUMMARY
3.3.2 ALBANIA
3.3.3 ANDORRA
3.3.4 AUSTRIA
3.3.5 BELARUS
3.3.6 BELGIUM
3.3.7 BULGARIA
3.3.8 CROATIA
3.3.9 CYPRUS
3.3.10 DENMARK
3.3.11 ESTONIA
3.3.12 FINLAND
3.3.13 FRANCE
3.3.14 GERMANY
3.3.15 GREECE
3.3.16 HUNGARY
3.3.17 IRELAND
3.3.18 ITALY
3.3.19 LATVIA
3.3.20 LITHUANIA
3.3.21 LUXEMBOURG
3.3.22 MALTA
3.3.23 NORWAY
3.3.24 POLAND
3.3.25 PORTUGAL
3.3.26 ROMANIA
3.3.27 RUSSIA
3.3.28 SLOVAKIA
3.3.29 SLOVENIA
3.3.30 SPAIN
3.3.31 SWEDEN
3.3.32 SWITZERLAND
3.3.33 THE CZECH REPUBLIC
3.3.34 THE NETHERLANDS
3.3.35 THE UNITED KINGDOM
3.3.36 UKRAINE
3.4 LATIN AMERICA: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.4.1 EXECUTIVE SUMMARY
3.4.2 BRAZIL
3.4.3 COLOMBIA
3.4.4 COSTA RICA
3.4.5 EL SALVADOR
3.4.6 GUATEMALA
3.4.7 MEXICO
3.4.8 PANAMA
3.4.9 PERU
3.4.10 VENEZUELA
3.5 NORTH AMERICA & THE CARIBBEAN: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.5.1 EXECUTIVE SUMMARY
3.5.2 CANADA
3.5.3 THE DOMINICAN REPUBLIC
3.5.4 THE UNITED STATES
3.6 OCEANIA: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.6.1 EXECUTIVE SUMMARY
3.6.2 AUSTRALIA
3.6.3 NEW ZEALAND
3.6.4 PALAU
3.7 THE MIDDLE EAST: EXPORT SUPPLIES OF PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IN 2024
3.7.1 EXECUTIVE SUMMARY
3.7.2 ISRAEL
3.7.3 PAKISTAN
3.7.4 THE UNITED ARAB EMIRATES
3.7.5 TURKEY
3.7.6 UZBEKISTAN
4 IMPORTS
4.1 AFRICA: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.1.1 EXECUTIVE SUMMARY
4.1.2 ALGERIA
4.1.3 BOTSWANA
4.1.4 BURKINA FASO
4.1.5 EGYPT
4.1.6 ETHIOPIA
4.1.7 GUINEA
4.1.8 MAURITANIA
4.1.9 MOROCCO
4.1.10 MOZAMBIQUE
4.1.11 NAMIBIA
4.1.12 NIGERIA
4.1.13 SOUTH AFRICA
4.1.14 TANZANIA
4.1.15 ZAMBIA
4.1.16 ZIMBABWE
4.2 ASIA: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.2.1 EXECUTIVE SUMMARY
4.2.2 BRUNEI
4.2.3 CHINA
4.2.4 HONG KONG
4.2.5 INDIA
4.2.6 INDONESIA
4.2.7 JAPAN
4.2.8 MACAU
4.2.9 MALAYSIA
4.2.10 SINGAPORE
4.2.11 SOUTH KOREA
4.2.12 SRI LANKA
4.2.13 TAIWAN
4.2.14 THAILAND
4.2.15 THE PHILIPPINES
4.2.16 VIETNAM
4.3 EUROPE: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.3.1 EXECUTIVE SUMMARY
4.3.2 ALBANIA
4.3.3 AUSTRIA
4.3.4 BELARUS
4.3.5 BELGIUM
4.3.6 BULGARIA
4.3.7 CYPRUS
4.3.8 DENMARK
4.3.9 ESTONIA
4.3.10 FINLAND
4.3.11 FRANCE
4.3.12 GERMANY
4.3.13 GREECE
4.3.14 HUNGARY
4.3.15 ICELAND
4.3.16 IRELAND
4.3.17 ITALY
4.3.18 KAZAKHSTAN
4.3.19 LATVIA
4.3.20 LITHUANIA
4.3.21 LUXEMBOURG
4.3.22 MALTA
4.3.23 NORWAY
4.3.24 POLAND
4.3.25 PORTUGAL
4.3.26 ROMANIA
4.3.27 RUSSIA
4.3.28 SLOVAKIA
4.3.29 SLOVENIA
4.3.30 SPAIN
4.3.31 SWEDEN
4.3.32 SWITZERLAND
4.3.33 THE CZECH REPUBLIC
4.3.34 THE NETHERLANDS
4.3.35 THE UNITED KINGDOM
4.4 LATIN AMERICA: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.4.1 EXECUTIVE SUMMARY
4.4.2 BRAZIL
4.4.3 CHILE
4.4.4 COLOMBIA
4.4.5 ECUADOR
4.4.6 GUATEMALA
4.4.7 HONDURAS
4.4.8 MEXICO
4.4.9 PANAMA
4.4.10 PARAGUAY
4.4.11 PERU
4.5 NORTH AMERICA & THE CARIBBEAN: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.5.1 EXECUTIVE SUMMARY
4.5.2 ARUBA
4.5.3 BERMUDA
4.5.4 CANADA
4.5.5 GREENLAND
4.5.6 JAMAICA
4.5.7 THE BAHAMAS
4.5.8 THE DOMINICAN REPUBLIC
4.5.9 THE UNITED STATES
4.6 OCEANIA: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.6.1 EXECUTIVE SUMMARY
4.6.2 AUSTRALIA
4.6.3 NEW ZEALAND
4.7 THE MIDDLE EAST: PARTS OF ELECTRONIC INTEGRATED CIRCUITS AND MICROASSEMBLES IMPORTS IN 2024
4.7.1 EXECUTIVE SUMMARY
4.7.2 AZERBAIJAN
4.7.3 BAHRAIN
4.7.4 ISRAEL
4.7.5 KUWAIT
4.7.6 LEBANON
4.7.7 OMAN
4.7.8 PAKISTAN
4.7.9 QATAR
4.7.10 TURKEY
4.7.11 YEMEN
5 DISCLAIMERS, WARRANTIES, AND USER AGREEMENT PROVISIONS
5.1 DISCLAIMERS & SAFE HARBOR
5.2 ICON GROUP INTERNATIONAL, INC. USER AGREEMENT PROVISIONS