Semiconductor Manufacturing Equipment Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

Semiconductor Manufacturing Equipment Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

The global semiconductor manufacturing equipment market size reached US$ 90.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 159.5 Billion by 2028, exhibiting a growth rate (CAGR) of 9.75% during 2023-2028.

Semiconductor manufacturing equipment refers to the processing machinery used to produce a variety of electronic and integrated circuits (ICs). Front-end and back-end are two of the most commonly used semiconductor manufacturing equipment. Front-end includes silicon-wafer fabrication, photolithography, deposition, etching, ion implantation and mechanical polishing machines, and back-end includes the machinery for assembly, packaging and testing of integrated circuits. These machines offer various benefits, such as streamlined production, improved yield and reliability, minimal design and manufacturing errors and enhanced workplace safety. As a result, they find extensive applications in the manufacturing of products for various industries such as automotive, electronics, robotics, etc.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook for the semiconductor manufacturing equipment market. Semiconductors are widely used in the manufacturing of consumer electronics, such as smartphones, tablets and laptops. Furthermore, the increasing demand for hybrid and electronic vehicles (H/EVs) is also contributing to the growth of the market. Semiconductor manufacturing equipment is used for the assembly of multiple semiconductors on a single chip to minimize electronic interference, dissipate heat and provide enhanced protection to the electronic devices in the vehicle.

Various technological advancements, such as the utilization of artificial intelligence (AI) solutions and the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. Electronics manufacturers are using IoT-enabled silicon-based sensors in the manufacturing equipment that offer remote monitoring capabilities for complex circuit boards. Other factors, including the emerging trend of device miniaturization, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor manufacturing equipment market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on equipment type, front-end equipment, back-end equipment, fab facility, product type, dimension and supply chain participant.

Breakup by Equipment Type:

Front-End
Back-End

Breakup by Front-End Equipment:

Lithography
Deposition
Cleaning
Wafer Surface Conditioning
Others

Breakup by Back-End Equipment:

Testing
Assembly and Packaging
Dicing
Bonding
Metrology
Others

Breakup by Fab Facility:

Automation
Chemical Control
Gas Control
Others

Breakup by Product Type:

Memory
Logic Components
Microprocessor
Analog Components
Optoelectronic Components
Discrete Components
Others

Breakup by Dimension:

2D
2.5D
3D

Breakup by Supply Chain Participant:

IDM Firms
OSAT Companies
Foundries

Breakup by Region:

Asia Pacific
Taiwan
China
South Korea
Japan
Singapore
India
Others
North America
United States
Canada
Europe
Germany
United Kingdom
France
Italy
Russia
Spain
Others
Latin America
Mexico
Brazil
Others
Middle East and Africa

Competitive Landscape:
The report has also analysed the competitive landscape of the market with some of the key players being Advantest Corporation, Applied Materials Inc., ASML Holdings N.V., KLA Corporation, Lam Research Corporation, Onto Innovation Inc., Plasma-Therm LLC, SCREEN Holdings Co. Ltd., Teradyne Inc., Tokyo Electron Limited and Toshiba Corporation.

Key Questions Answered in This Report

1. What was the size of the global semiconductor manufacturing equipment market in 2022?
2. What is the expected growth rate of the global semiconductor manufacturing equipment market during 2023-2028?
3. What are the key factors driving the global semiconductor manufacturing equipment market?
4. What has been the impact of COVID-19 on the global semiconductor manufacturing equipment market?
5. What is the breakup of the global semiconductor manufacturing equipment market based on the equipment type?
6. What is the breakup of the global semiconductor manufacturing equipment market based on the front-end equipment?
7. What is the breakup of the global semiconductor manufacturing equipment market based on the back-end equipment?
8. What is the breakup of the global semiconductor manufacturing equipment market based on the fab facility?
9. What is the breakup of the global semiconductor manufacturing equipment market based on the product type?
10. What is the breakup of the global semiconductor manufacturing equipment market based on the dimension?
11. What is the breakup of the global semiconductor manufacturing equipment market based on the supply chain participant?
12. What are the key regions in the global semiconductor manufacturing equipment market?
13. Who are the key players/companies in the global semiconductor manufacturing equipment market?


1 Preface
2 Scope and Methodology 
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
  2.3.1 Primary Sources
  2.3.2 Secondary Sources
2.4 Market Estimation
  2.4.1 Bottom-Up Approach
  2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Semiconductor Manufacturing Equipment Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Equipment Type
6.1 Front-End Equipment
  6.1.1 Market Trends
  6.1.2 Market Forecast
6.2 Back-End Equipment
  6.2.1 Market Trends
  6.2.2 Market Forecast
7 Front-End Equipment Market Breakup by Type
7.1 Lithography
  7.1.1 Market Trends
  7.1.2 Market Forecast
7.2 Deposition
  7.2.1 Market Trends
  7.2.2 Market Forecast
7.3 Cleaning
  7.3.1 Market Trends
  7.3.2 Market Forecast
7.4 Wafer Surface Conditioning
  7.4.1 Market Trends
  7.4.2 Market Forecast
7.5 Others
  7.5.1 Market Trends
  7.5.2 Market Forecast
8 Back-End Equipment Market Breakup by Type
8.1 Testing
  8.1.1 Market Trends
  8.1.2 Market Forecast
8.2 Assembly and Packaging
  8.2.1 Market Trends
  8.2.2 Market Forecast
8.3 Dicing
  8.3.1 Market Trends
  8.3.2 Market Forecast
8.4 Bonding
  8.4.1 Market Trends
  8.4.2 Market Forecast
8.5 Metrology
  8.5.1 Market Trends
  8.5.2 Market Forecast
8.6 Others
  8.6.1 Market Trends
  8.6.2 Market Forecast
9 Market Breakup by Fab Facility
9.1 Automation
  9.1.1 Market Trends
  9.1.2 Market Forecast
9.2 Chemical Control
  9.2.1 Market Trends
  9.2.2 Market Forecast
9.3 Gas Control
  9.3.1 Market Trends
  9.3.2 Market Forecast
9.4 Others
  9.4.1 Market Trends
  9.4.2 Market Forecast
10  Market Breakup by Product Type
10.1 Memory
  10.1.1 Market Trends
  10.1.2 Market Forecast
10.2 Logic Components
  10.2.1 Market Trends
  10.2.2 Market Forecast
10.3 Microprocessor
  10.3.1 Market Trends
  10.3.2 Market Forecast
10.4 Analog Components
  10.4.1 Market Trends
  10.4.2 Market Forecast
10.5 Optoelectronic Components
  10.5.1 Market Trends
  10.5.2 Market Forecast
10.6 Discrete Components
  10.6.1 Market Trends
  10.6.2 Market Forecast
10.7 Others
  10.7.1 Market Trends
  10.7.2 Market Forecast
11  Market Breakup by Dimension
11.1 2D
  11.1.1 Market Trends
  11.1.2 Market Forecast
11.2 2.5D
  11.2.1 Market Trends
  11.2.2 Market Forecast
11.3 3D
  11.3.1 Market Trends
  11.3.2 Market Forecast
12  Market Breakup by Supply Chain Participant
12.1 IDM Firms
  12.1.1 Market Trends
  12.1.2 Market Forecast
12.2 OSAT Companies
  12.2.1 Market Trends
  12.2.2 Market Forecast
12.3 Foundries
  12.3.1 Market Trends
  12.3.2 Market Forecast
13  Market Breakup by Region
13.1 Asia Pacific
  13.1.1 Taiwan
   13.1.1.1 Market Trends
   13.1.1.2 Market Forecast
  13.1.2 China
   13.1.2.1 Market Trends
   13.1.2.2 Market Forecast
  13.1.3 South Korea
   13.1.3.1 Market Trends
   13.1.3.2 Market Forecast
  13.1.4 Japan
   13.1.4.1 Market Trends
   13.1.4.2 Market Forecast
  13.1.5 Singapore
   13.1.5.1 Market Trends
   13.1.5.2 Market Forecast
  13.1.6 India
   13.1.6.1 Market Trends
   13.1.6.2 Market Forecast
  13.1.7 Others
   13.1.7.1 Market Trends
   13.1.7.2 Market Forecast
13.2 North America
  13.2.1 United States
   13.2.1.1 Market Trends
   13.2.1.2 Market Forecast
  13.2.2 Canada
   13.2.2.1 Market Trends
   13.2.2.2 Market Forecast
13.3 Europe
  13.3.1 Germany
   13.3.1.1 Market Trends
   13.3.1.2 Market Forecast
  13.3.2 United Kingdom
   13.3.2.1 Market Trends
   13.3.2.2 Market Forecast
  13.3.3 France
   13.3.3.1 Market Trends
   13.3.3.2 Market Forecast
  13.3.4 Italy
   13.3.4.1 Market Trends
   13.3.4.2 Market Forecast
  13.3.5 Russia
   13.3.5.1 Market Trends
   13.3.5.2 Market Forecast
  13.3.6 Spain
   13.3.6.1 Market Trends
   13.3.6.2 Market Forecast
  13.3.7 Others
   13.3.7.1 Market Trends
   13.3.7.2 Market Forecast
13.4 Latin America
  13.4.1 Mexico
   13.4.1.1 Market Trends
   13.4.1.2 Market Forecast
  13.4.2 Brazil
   13.4.2.1 Market Trends
   13.4.2.2 Market Forecast
  13.4.3 Others
   13.4.3.1 Market Trends
   13.4.3.2 Market Forecast
13.5 Middle East and Africa
  13.5.1 Market Trends
  13.5.2 Market Breakup by Country
  13.5.3 Market Forecast
14  SWOT Analysis
14.1 Overview
14.2 Strengths
14.3 Weaknesses
14.4 Opportunities
14.5 Threats
15  Value Chain Analysis
16  Porters Five Forces Analysis
16.1 Overview
16.2 Bargaining Power of Buyers
16.3 Bargaining Power of Suppliers
16.4 Degree of Competition
16.5 Threat of New Entrants
16.6 Threat of Substitutes
17  Price Analysis
18  Competitive Landscape
18.1 Market Structure
18.2 Key Players
18.3 Profiles of Key Players
  18.3.1 Advantest Corporation
   18.3.1.1 Company Overview
   18.3.1.2 Product Portfolio 
   18.3.1.3 Financials
   18.3.1.4 SWOT Analysis
  18.3.2 Applied Materials Inc.
   18.3.2.1 Company Overview
   18.3.2.2 Product Portfolio
   18.3.2.3 Financials 
   18.3.2.4 SWOT Analysis
  18.3.3 ASML Holdings N.V.
   18.3.3.1 Company Overview
   18.3.3.2 Product Portfolio 
   18.3.3.3 Financials 
   18.3.3.4 SWOT Analysis
  18.3.4 KLA Corporation
   18.3.4.1 Company Overview
   18.3.4.2 Product Portfolio 
   18.3.4.3 Financials 
   18.3.4.4 SWOT Analysis
  18.3.5 Lam Research Corporation
   18.3.5.1 Company Overview
   18.3.5.2 Product Portfolio 
   18.3.5.3 Financials 
   18.3.5.4 SWOT Analysis
  18.3.6 Onto Innovation Inc.
   18.3.6.1 Company Overview
   18.3.6.2 Product Portfolio 
   18.3.6.3 Financials
  18.3.7 Plasma-Therm LLC
   18.3.7.1 Company Overview
   18.3.7.2 Product Portfolio
  18.3.8 SCREEN Holdings Co. Ltd.
   18.3.8.1 Company Overview
   18.3.8.2 Product Portfolio 
   18.3.8.3 Financials
   18.3.8.4 SWOT Analysis
  18.3.9 Teradyne Inc.
   18.3.9.1 Company Overview
   18.3.9.2 Product Portfolio
   18.3.9.3 Financials
   18.3.9.4 SWOT Analysis
  18.3.10 Tokyo Electron Limited
   18.3.10.1 Company Overview
   18.3.10.2 Product Portfolio 
   18.3.10.3 Financials
   18.3.10.4 SWOT Analysis
  18.3.11 Toshiba Corporation
   18.3.11.1 Company Overview
   18.3.11.2 Product Portfolio 
   18.3.11.3 Financials
   18.3.11.4 SWOT Analysis

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