Photonic Integrated Circuit Market Report by Component (Lasers, MUX/DEMUX, Optical Amplifiers, Modulators, Attenuators, Detectors), Raw Material (Indium Phosphide (InP), Gallium Arsenide (GaAs), Lithium Niobate (LiNbO3), Silicon, Silica-on-Silicon), Integ

Photonic Integrated Circuit Market Report by Component (Lasers, MUX/DEMUX, Optical Amplifiers, Modulators, Attenuators, Detectors), Raw Material (Indium Phosphide (InP), Gallium Arsenide (GaAs), Lithium Niobate (LiNbO3), Silicon, Silica-on-Silicon), Integration (Monolithic Integration, Hybrid Integration, Module Integration), Application (Optical Fiber Communication, Optical Fiber Sensor, Biomedical, Quantum Computing), and Region 2024-2032


The global photonic integrated circuit market size reached US$ 11.6 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 51.5 Billion by 2032, exhibiting a growth rate (CAGR) of 17.67% during 2024-2032. The expanding cloud computing and data storage industry, the widespread product applications in medical imaging, diagnostics, and optical sensing, the increasing demand for Lidar systems, and the growth of undersea and satellite optical communication networks are some of the factors propelling the market.

A photonic integrated circuit (PIC) is a groundbreaking technology that harnesses photonics principles to integrate various optical components onto a single chip. Like electronic integrated circuits (ICs), PICs consolidate multiple functions onto a single platform. Still, instead of electrical signals, they manipulate and transmit photons (light) for telecommunications, data communication, and beyond applications. They offer several advantages. They are highly efficient, enabling rapid data transmission at high bandwidths while consuming less power than traditional electronic circuits. Additionally, PICs are inherently immune to electromagnetic interference and can transmit data over longer distances without signal degradation. These features are particularly valuable in emerging technologies like 5G networks, where fast and reliable data transmission is critical. Moreover, PICs play a pivotal role in emerging fields like quantum computing and sensing, where manipulating individual photons is essential. Their compact size and scalability make them increasingly essential in industries aiming for miniaturization and increased performance. As technology advances, they are poised to revolutionize how we process and transmit data, offering solutions to the ever-growing demand for faster, more efficient, and more secure information exchange.

The global market is majorly driven by the increasing demand for higher data transmission rates, particularly in telecommunications and data centers. In line with this, the rapid expansion of 5G networks and the looming transition to 6G require the integration of photonics to handle unprecedented data loads and communication speeds, further fueling the adoption of PICs. Furthermore, the emergence of cutting-edge technologies like quantum computing and quantum communication relies heavily on PICs to manipulate and control individual photons, enabling groundbreaking advancements in these fields. Besides, PIC manufacturing techniques' scalability and cost-effectiveness make these devices increasingly accessible to a broader range of industries and applications, from healthcare to automotive. The environmental advantages of photonics, such as reduced energy consumption and heat generation, align with the global push for sustainability, driving the market's growth as industries seek eco-friendly solutions.

Photonic Integrated Circuit Market Trends/Drivers:

Expanding defense sector

The expanding defense sector is offering numerous opportunities for the market. Modern military operations increasingly rely on advanced technology for communication, surveillance, and precision targeting. PICs play a pivotal role in enhancing these capabilities. In the military, secure and high-speed data transmission is crucial. PICs enable optical communication systems that offer greater bandwidth, lower latency, and enhanced security compared to traditional electronic systems. This is vital for transmitting sensitive information and maintaining operational effectiveness. Furthermore, the development of laser-based weaponry and directed energy systems requires precise control of optical signals. PICs enable the manipulation and management of laser beams for applications like target designation and countermeasures against threats. Moreover, the photonic sensors, often based on PICs, enhance situational awareness by providing high-resolution imaging, infrared sensing, and Lidar capabilities. These technologies are essential for surveillance, reconnaissance, and threat detection. Besides, PICs' compact size and integration capabilities are especially valuable in defense applications where space is limited, such as in unmanned aerial vehicles (UAVs) and soldier-worn equipment. As defense agencies worldwide modernize their capabilities, the demand for advanced photonic technologies like PICs continues to grow, making them a critical component of defense systems and a key driver for the market's expansion.

Rapid technological advancements in photonics

Rapid technological advancements in photonics are favorably impacting the market. These advancements continually push the boundaries of what is possible regarding data processing, communication, and sensing using light-based technologies. Photonics has enabled the development of high-speed optical communication systems, essential for the ever-increasing demand for data transmission in applications like 5G, data centers, and long-distance fiber optics. PICs facilitate these high data rates with their ability to integrate various photonic components. Advancements in manufacturing techniques have led to smaller and more efficient PICs. This miniaturization is essential for limited space applications like mobile devices, biomedical devices, and aerospace technology. Furthermore, photonics is a cornerstone of emerging technologies like quantum computing, quantum communication, and LiDAR. PICs are central in manipulating and controlling photons in these cutting-edge fields. Photonics advancements have led to more sensitive and accurate optical sensors in environmental monitoring, healthcare, and security applications. As technological innovations continue to emerge in photonics, the versatility and efficiency of PICs make them a driving force in various industries, positioning the market for sustained growth and further breakthroughs in light-based technologies.

Rapid expansion of data centers

The rapid expansion of data centers is fueling the market growth. In an increasingly digital world, data centers are the backbone of cloud computing, storage, and internet services, demanding high-speed, energy-efficient, and scalable solutions, all enriched by PICs. Data centers require lightning-fast data transmission to handle massive volumes of information. PICs enable high-speed optical communication within and between data centers, reducing latency and improving overall performance. The energy consumption of data centers is a significant concern. PICs consume less power than their electronic counterparts, helping data centers achieve energy efficiency goals and reduce operational costs. As data centers grow to meet escalating data demands, PICs provide a scalable solution. Their compact nature allows for efficient integration into existing data center infrastructures. Photonic interconnects using PICs are essential for connecting servers, switches, and routers within data centers, streamlining data flow, and reducing bottlenecks. With the relentless expansion of digital services and cloud computing, the demand for efficient, high-performance data centers remains unabated. PICs are at the forefront of this transformation, facilitating the growth and optimization of data centers and, consequently, driving the market.

Photonic Integrated Circuit Industry Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global photonic integrated circuit market report, along with forecasts at the global, regional and country levels for 2024-2032. Our report has categorized the market based on component, raw material, integration, and application.

Breakup by Component:
  • Lasers
  • MUX/DEMUX
  • Optical Amplifiers
  • Modulators
  • Attenuators
  • Detectors
Lasers dominates the market

The report has provided a detailed breakup and analysis of the market based on the component. This includes lasers, MUX/DEMUX, optical amplifiers, modulators, attenuators, and detectors. According to the report, lasers represented the largest segment.

Lasers are fundamental components within PICs, and their role is pivotal in various applications across industries. They are integral to optical communication systems, where PICs play a vital role. The demand for high-speed data transmission, especially in 5G networks, data centers, and long-haul fiber optics, drives the need for more efficient and compact lasers within PICs. They are used in various sensing applications, including LiDAR for autonomous vehicles, environmental monitoring, and industrial processes. As these technologies advance, PICs incorporating lasers become increasingly essential for precision and reliability.

Furthermore, lasers play a crucial role in medical applications, such as diagnostics, surgery, and imaging. PICs that integrate lasers offer miniaturized and cost-effective solutions, promoting their adoption in the healthcare sector. They are used for targeting, range finding, and communications in defense and aerospace applications. The development of more compact and efficient laser sources through PICs enhances these capabilities. They are fundamental to quantum computing and quantum communication. PICs with lasers enable the manipulation of photons for quantum information processing.

Breakup by Raw Material:
  • ndium Phosphide (InP)
  • Gallium Arsenide (GaAs)
  • Lithium Niobate (LiNbO3)
  • Silicon
  • Silica-on-Silicon
Indium phosphide (InP) dominates the market

The report has provided a detailed breakup and analysis of the market based on the raw material. This includes indium phosphide (InP), gallium arsenide (GaAs), lithium niobate (LiNbO3), silicon, and silica-on-silicon. According to the report, indium phosphide (InP) represented the largest segment.

Indium Phosphide (InP) is a pivotal raw material driving the growth of the photonic integrated circuit (PIC) market. Known for its exceptional optical and electronic properties, InP is a foundation for manufacturing high-performance PICs. Its wide bandgap, high electron mobility, and compatibility with optical and electronic components make it a preferred choice for creating PICs that excel in optical communication, sensing, and computing applications.

InP-based PICs enable faster data transmission, higher bandwidths, and improved energy efficiency, making them crucial for emerging technologies like 5G networks, data centers, LiDAR systems, and quantum computing. As demand for advanced optical solutions continues to rise, the utilization of InP as a raw material underscores its significance in the development of cutting-edge PICs. It contributes substantially to the market's growth and innovation.

Breakup by Integration:
  • Monolithic Integration
  • Hybrid Integration
  • Module Integration
Monolithic integration dominates the market

The report has provided a detailed breakup and analysis of the market based on the integration. This includes monolithic integration, hybrid integration, and module integration. According to the report, monolithic integration represented the largest segment.

Monolithic integration is a pivotal category shaping the market. This approach integrates all optical components, such as lasers, waveguides, and detectors, onto a single semiconductor substrate. Monolithic integration offers several key advantages, including compact size, high performance, and cost-effectiveness.

PICs developed through monolithic integration can achieve superior levels of integration and efficiency, making them ideal for applications where space, power, and precision are critical, such as data centers, telecommunications networks, and optical sensing devices. This approach simplifies manufacturing processes, reduces the risk of alignment errors, and enables the creation of highly customized and specialized PICs tailored to specific applications. As the demand for smaller, faster, and more efficient photonic solutions grows, monolithic integration remains a driving force in advancing PIC technology and expanding its presence across various industries.

Breakup by Application:
  • Optical Fiber Communication
  • Optical Fiber Sensor
  • Biomedical
  • Quantum Computing
Optical fiber communication dominates the market

The report has provided a detailed breakup and analysis of the market based on the application. This includes optical fiber communication, optical fiber sensor, biomedical, and quantum computing. According to the report, optical fiber communication represented the largest segment.

Optical fiber communication is one of the primary applications propelling the growth of the photonic integrated circuit (PIC) market. PICs find extensive use in optical fiber communication systems, serving as the backbone for high-speed data transmission, internet connectivity, and telecommunication networks. PICs enable more efficient and cost-effective optical communication solutions by integrating optical components like lasers, modulators, detectors, and waveguides onto a single chip. They enhance data rates, reduce power consumption, and facilitate the management of complex optical signals.

With the continuous expansion of data traffic and the need for faster and more reliable communication, the demand for PICs in optical fiber communication remains robust. As technologies like 5G and beyond evolve, PICs are instrumental in meeting the growing demands for high-capacity and low-latency optical communication networks, solidifying their role as a key driver of market growth in this critical application domain.

Breakup by Region:
  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa
North America exhibits a clear dominance, accounting for the largest market share

The market research report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, North America accounted for the largest market share.

North America serves as a prominent region driving the market. With its growing technology sector and robust investments in research and development, it is at the forefront of PIC innovation and adoption. The region boasts a strong presence of leading PIC companies, research institutions, and universities focused on advancing photonic technologies. PICs find wide-ranging applications here, particularly in data centers, telecommunications networks, aerospace, and healthcare.

Furthermore, the growing demand for high-speed internet, data analytics, and emerging technologies like 5G and quantum computing fuels the adoption of PICs. Besides, government initiatives and investments in infrastructure development bolster the expansion of optical communication networks, driving the need for more efficient and advanced PIC solutions. As a result, North America plays a pivotal role in shaping the global PIC market and remains a dynamic hub for innovation and market growth in this domain.

Competitive Landscape:

Top companies are strengthening market growth through several strategic initiatives. They invest heavily in research and development, constantly pushing the boundaries of PIC technology. They innovate by developing new materials, manufacturing processes, and design methodologies, leading to improved performance, reduced costs, and expanded applications. Furthermore, these companies offer a wide range of PIC products catering to diverse industries such as telecommunications, data centers, healthcare, and aerospace. This diversification expands the market's reach and addresses various customer needs. Collaboration with industry giants, academic institutions, and research organizations enhances the development and adoption of PIC technology. These partnerships foster innovation and market growth. Moreover, the top companies often have a global presence, with sales and manufacturing operations in key markets. This global footprint facilitates market penetration and ensures timely delivery to customers worldwide. Besides, they actively engage in educational initiatives, helping raise awareness about the benefits and applications of PICs. This outreach contributes to market education and fosters demand. These companies provide customized solutions and consultancy services, tailoring PIC designs to meet specific customer requirements, further expanding their market influence. Additionally, the leading companies adhere to stringent quality standards and certifications, instilling trust in their products' reliability and performance.

The report has provided a comprehensive analysis of the competitive landscape in the photonic integrated circuit market. Detailed profiles of all major companies have also been provided.
  • Broadcom Inc.
  • ColorChip Ltd.
  • Hamamatsu Photonics K.K.
  • I-VI Incorporated
  • nfinera Corporation
  • ntel Corporation
  • LioniX International
  • POET Technologies
  • VLC Photonics S.L. (Hitachi Ltd.).
Recent Developments:
  • n August 2023, Broadcom Inc. announced the availability of the industry's most secure and highest density Gen 7 64G Fibre Channel Director— the 512-port and 256-port Brocade X7 Directors.
  • n August 2023, Hamamatsu Photonics KK introduced TOKUSPEC 1.3.0, an improved software tool version exclusively crafted for its mini-spectrometers.
  • n September 2022, II-VI Incorporated introduced an ultrahigh-resolution telemetry module, or optical channel monitor (UHR-OCM).
Key Questions Answered in This Report

1. How big is the global photonic integrated circuit market?

2. What is the expected growth rate of the global photonic integrated circuit market during 2024-2032?

3. What are the key factors driving the global photonic integrated circuit market?

4. What has been the impact of COVID-19 on the global photonic integrated circuit market?

5. What is the breakup of the global photonic integrated circuit market based on the component?

6. What is the breakup of the global photonic integrated circuit market based on the raw material?

7. What is the breakup of the global photonic integrated circuit market based on the integration?

8. What is the breakup of the global photonic integrated circuit market based on the application?

9. What are the key regions in the global photonic integrated circuit market?

10. Who are the key players/companies in the global photonic integrated circuit market?


1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Photonic Integrated Circuit Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Component
6.1 Lasers
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 MUX/DEMUX
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Optical Amplifiers
6.3.1 Market Trends
6.3.2 Market Forecast
6.4 Modulators
6.4.1 Market Trends
6.4.2 Market Forecast
6.5 Attenuators
6.5.1 Market Trends
6.5.2 Market Forecast
6.6 Detectors
6.6.1 Market Trends
6.6.2 Market Forecast
7 Market Breakup by Raw Material
7.1 Indium Phosphide (InP)
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Gallium Arsenide (GaAs)
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Lithium Niobate (LiNbO3)
7.3.1 Market Trends
7.3.2 Market Forecast
7.4 Silicon
7.4.1 Market Trends
7.4.2 Market Forecast
7.5 Silica-on-Silicon
7.5.1 Market Trends
7.5.2 Market Forecast
8 Market Breakup by Integration
8.1 Monolithic Integration
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Hybrid Integration
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Module Integration
8.3.1 Market Trends
8.3.2 Market Forecast
9 Market Breakup by Application
9.1 Optical Fiber Communication
9.1.1 Market Trends
9.1.2 Market Forecast
9.2 Optical Fiber Sensor
9.2.1 Market Trends
9.2.2 Market Forecast
9.3 Biomedical
9.3.1 Market Trends
9.3.2 Market Forecast
9.4 Quantum Computing
9.4.1 Market Trends
9.4.2 Market Forecast
10 Market Breakup by Region
10.1 North America
10.1.1 United States
10.1.1.1 Market Trends
10.1.1.2 Market Forecast
10.1.2 Canada
10.1.2.1 Market Trends
10.1.2.2 Market Forecast
10.2 Asia-Pacific
10.2.1 China
10.2.1.1 Market Trends
10.2.1.2 Market Forecast
10.2.2 Japan
10.2.2.1 Market Trends
10.2.2.2 Market Forecast
10.2.3 India
10.2.3.1 Market Trends
10.2.3.2 Market Forecast
10.2.4 South Korea
10.2.4.1 Market Trends
10.2.4.2 Market Forecast
10.2.5 Australia
10.2.5.1 Market Trends
10.2.5.2 Market Forecast
10.2.6 Indonesia
10.2.6.1 Market Trends
10.2.6.2 Market Forecast
10.2.7 Others
10.2.7.1 Market Trends
10.2.7.2 Market Forecast
10.3 Europe
10.3.1 Germany
10.3.1.1 Market Trends
10.3.1.2 Market Forecast
10.3.2 France
10.3.2.1 Market Trends
10.3.2.2 Market Forecast
10.3.3 United Kingdom
10.3.3.1 Market Trends
10.3.3.2 Market Forecast
10.3.4 Italy
10.3.4.1 Market Trends
10.3.4.2 Market Forecast
10.3.5 Spain
10.3.5.1 Market Trends
10.3.5.2 Market Forecast
10.3.6 Russia
10.3.6.1 Market Trends
10.3.6.2 Market Forecast
10.3.7 Others
10.3.7.1 Market Trends
10.3.7.2 Market Forecast
10.4 Latin America
10.4.1 Brazil
10.4.1.1 Market Trends
10.4.1.2 Market Forecast
10.4.2 Mexico
10.4.2.1 Market Trends
10.4.2.2 Market Forecast
10.4.3 Others
10.4.3.1 Market Trends
10.4.3.2 Market Forecast
10.5 Middle East and Africa
10.5.1 Market Trends
10.5.2 Market Breakup by Country
10.5.3 Market Forecast
11 SWOT Analysis
11.1 Overview
11.2 Strengths
11.3 Weaknesses
11.4 Opportunities
11.5 Threats
12 Value Chain Analysis
13 Porters Five Forces Analysis
13.1 Overview
13.2 Bargaining Power of Buyers
13.3 Bargaining Power of Suppliers
13.4 Degree of Competition
13.5 Threat of New Entrants
13.6 Threat of Substitutes
14 Price Analysis
15 Competitive Landscape
15.1 Market Structure
15.2 Key Players
15.3 Profiles of Key Players
15.3.1 Broadcom Inc.
15.3.1.1 Company Overview
15.3.1.2 Product Portfolio
15.3.1.3 Financials
15.3.1.4 SWOT Analysis
15.3.2 ColorChip Ltd.
15.3.2.1 Company Overview
15.3.2.2 Product Portfolio
15.3.3 Hamamatsu Photonics K.K.
15.3.3.1 Company Overview
15.3.3.2 Product Portfolio
15.3.3.3 Financials
15.3.4 II-VI Incorporated
15.3.4.1 Company Overview
15.3.4.2 Product Portfolio
15.3.4.3 Financials
15.3.5 Infinera Corporation
15.3.5.1 Company Overview
15.3.5.2 Product Portfolio
15.3.5.3 Financials
15.3.6 Intel Corporation
15.3.6.1 Company Overview
15.3.6.2 Product Portfolio
15.3.6.3 Financials
15.3.6.4 SWOT Analysis
15.3.7 LioniX International
15.3.7.1 Company Overview
15.3.7.2 Product Portfolio
15.3.8 POET Technologies
15.3.8.1 Company Overview
15.3.8.2 Product Portfolio
15.3.8.3 Financials
15.3.9 VLC Photonics S.L. (Hitachi Ltd.)
15.3.9.1 Company Overview
15.3.9.2 Product Portfolio

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