Advanced IC Substrate Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

Advanced IC Substrate Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028


Market Overview:

The global advanced IC substrate market size reached US$ 9.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.8 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.

Advanced integrated circuit (IC) substrate is a baseboard used to connect the printed circuit boards (PCBs) to the semiconductor chips. It is compact, durable, lightweight, energy-efficient, and cost-effective and exhibits high thermal dissipation performance. In addition, it provides high reliability and outstanding electrical properties, reduces the overall weight of PCBs, and increases their functionality and dimensional control. As a result, it is currently widely used for manufacturing miniaturized electronic products with the latest functions.

Advanced IC Substrate Market Trends:



The escalating demand for miniaturized consumer electronic products, such as tablets, laptops, smartphones, and personal computers (PCs), represents one of the key factors impelling the market growth. Moreover, the rising need for remote-controlled electrical equipment in industrial applications is contributing to the market growth. Apart from this, defense departments in various countries rely on several microelectronics, such as nuclear-armed bombers, submarines, intercontinental ballistic missiles, and space-based sensors, to make deterrence strategies that protect deployed forces, allies, and partners. Furthermore, as sensitive microelectronics are vulnerable to high levels of ionizing radiation, defense agencies are deploying advanced IC substrates to protect them in hazardous conditions. Besides this, a wide range of applications of handheld, portable, and implantable medical electronic devices in the diagnosis and treatment of various critical diseases is catalyzing the demand for advanced IC substrates in the healthcare industry. In line with this, the growing trend of cars with driverless and safety features and innovative infotainment systems are contributing to the adoption of advanced IC substrates in the automotive industry. This can also be accredited with efforts undertaken by governing agencies of numerous countries to promote green, electric vehicles (EVs) and minimize greenhouse (GHG) emissions of automobiles.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and application.

Breakup by Type:

FC BGA
FC CSP

Breakup by Application:

Consumer Electronics
Automotive and Transportation
IT and Telecom
Others

Breakup by Region:

North America

United States
Canada

Asia-Pacific

China
Japan
India
South Korea
Australia
Indonesia
Others

Europe

Germany
France
United Kingdom
Italy
Spain
Russia
Others

Latin America

Brazil
Mexico
Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujitsu Limited, Ibiden Co. Ltd., JCET Group Co. Ltd, Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation), TTM Technologies Inc. and Unimicron Technology Corporation (United Microelectronics Corporation).

Key Questions Answered in This Report:

How has the global advanced IC substrate market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global advanced IC substrate market?
What are the key regional markets?
What is the breakup of the market based on the type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global advanced IC substrate market and who are the key players?
What is the degree of competition in the industry?


1 Preface
2 Scope and Methodology
  2.1 Objectives of the Study
  2.2 Stakeholders
  2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
  2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
  2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
  4.1 Overview
  4.2 Key Industry Trends
5 Global Advanced IC Substrate Market
  5.1 Market Overview
  5.2 Market Performance
  5.3 Impact of COVID-19
  5.4 Market Forecast
6 Market Breakup by Type
  6.1 FC BGA
6.1.1 Market Trends
6.1.2 Market Forecast
  6.2 FC CSP
6.2.1 Market Trends
6.2.2 Market Forecast
7 Market Breakup by Application
  7.1 Consumer Electronics
7.1.1 Market Trends
7.1.2 Market Forecast
  7.2 Automotive and Transportation
7.2.1 Market Trends
7.2.2 Market Forecast
  7.3 IT and Telecom
7.3.1 Market Trends
7.3.2 Market Forecast
  7.4 Others
7.4.1 Market Trends
7.4.2 Market Forecast
8 Market Breakup by Region
  8.1 North America
8.1.1 United States
8.1.1.1 Market Trends
8.1.1.2 Market Forecast
8.1.2 Canada
8.1.2.1 Market Trends
8.1.2.2 Market Forecast
  8.2 Asia-Pacific
8.2.1 China
8.2.1.1 Market Trends
8.2.1.2 Market Forecast
8.2.2 Japan
8.2.2.1 Market Trends
8.2.2.2 Market Forecast
8.2.3 India
8.2.3.1 Market Trends
8.2.3.2 Market Forecast
8.2.4 South Korea
8.2.4.1 Market Trends
8.2.4.2 Market Forecast
8.2.5 Australia
8.2.5.1 Market Trends
8.2.5.2 Market Forecast
8.2.6 Indonesia
8.2.6.1 Market Trends
8.2.6.2 Market Forecast
8.2.7 Others
8.2.7.1 Market Trends
8.2.7.2 Market Forecast
  8.3 Europe
8.3.1 Germany
8.3.1.1 Market Trends
8.3.1.2 Market Forecast
8.3.2 France
8.3.2.1 Market Trends
8.3.2.2 Market Forecast
8.3.3 United Kingdom
8.3.3.1 Market Trends
8.3.3.2 Market Forecast
8.3.4 Italy
8.3.4.1 Market Trends
8.3.4.2 Market Forecast
8.3.5 Spain
8.3.5.1 Market Trends
8.3.5.2 Market Forecast
8.3.6 Russia
8.3.6.1 Market Trends
8.3.6.2 Market Forecast
8.3.7 Others
8.3.7.1 Market Trends
8.3.7.2 Market Forecast
  8.4 Latin America
8.4.1 Brazil
8.4.1.1 Market Trends
8.4.1.2 Market Forecast
8.4.2 Mexico
8.4.2.1 Market Trends
8.4.2.2 Market Forecast
8.4.3 Others
8.4.3.1 Market Trends
8.4.3.2 Market Forecast
  8.5 Middle East and Africa
8.5.1 Market Trends
8.5.2 Market Breakup by Country
8.5.3 Market Forecast
9 SWOT Analysis
  9.1 Overview
  9.2 Strengths
  9.3 Weaknesses
  9.4 Opportunities
  9.5 Threats
10  Value Chain Analysis
11  Porters Five Forces Analysis
  11.1 Overview
  11.2 Bargaining Power of Buyers
  11.3 Bargaining Power of Suppliers
  11.4 Degree of Competition
  11.5 Threat of New Entrants
  11.6 Threat of Substitutes
12  Price Analysis
13  Competitive Landscape
  13.1 Market Structure
  13.2 Key Players
  13.3 Profiles of Key Players
13.3.1 ASE Group
13.3.1.1 Company Overview
13.3.1.2 Product Portfolio
13.3.1.3 Financials
13.3.2 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
13.3.2.1 Company Overview
13.3.2.2 Product Portfolio
13.3.2.3 Financials
13.3.3 Fujitsu Limited
13.3.3.1 Company Overview
13.3.3.2 Product Portfolio
13.3.3.3 Financials
13.3.3.4 SWOT Analysis
13.3.4 Ibiden Co. Ltd.
13.3.4.1 Company Overview
13.3.4.2 Product Portfolio
13.3.4.3 Financials
13.3.4.4 SWOT Analysis
13.3.5 JCET Group Co. Ltd
13.3.5.1 Company Overview
13.3.5.2 Product Portfolio
13.3.5.3 Financials
13.3.6 Kinsus Interconnect Technology Corp.
13.3.6.1 Company Overview
13.3.6.2 Product Portfolio
13.3.6.3 Financials
13.3.7 Korea Circuit Co. Ltd.
13.3.7.1 Company Overview
13.3.7.2 Product Portfolio
13.3.7.3 Financials
13.3.8 KYOCERA Corporation
13.3.8.1 Company Overview
13.3.8.2 Product Portfolio
13.3.8.3 Financials
13.3.8.4 SWOT Analysis
13.3.9 LG Innotek Co. Ltd.
13.3.9.1 Company Overview
13.3.9.2 Product Portfolio
13.3.9.3 Financials
13.3.9.4 SWOT Analysis
13.3.10 Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation)
13.3.10.1 Company Overview
13.3.10.2 Product Portfolio
13.3.10.3 Financials
13.3.11 TTM Technologies Inc.
13.3.11.1 Company Overview
13.3.11.2 Product Portfolio
13.3.11.3 Financials
13.3.11.4 SWOT Analysis
13.3.12 Unimicron Technology Corporation (United Microelectronics Corporation)
13.3.12.1 Company Overview
13.3.12.2 Product Portfolio
13.3.12.3 Financials

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