Worldwide Outsourced Semiconductor Assembly and Test Manufacturing Market Share, 2022 ─ Vendor Ranking and Insight
This IDC study explores the revenue performance, technological evolution, and business development of worldwide OSAT vendors in 2022, and explore future development trends."OSAT is at the core of the downstreamportion of the semiconductor industry chain and is critical to the final quality and performance of chips. With the development of HPC, AI, and ML, advanced packaging will tend to experience heterogeneous integration from 2D to 2.5D/3D. It is expected that manufacturers will increase their investment to meet the huge market demand," says Galen Zeng, senior research manager at IDC.
Please Note: Extended description available upon request.
- IDC Market Share Figure
- Executive Summary
- Advice for Technology Suppliers
- Market Share
- Who Shaped the Year
- ASE
- Amkor
- JCET
- TFME
- PTI
- Tianshui Huatian
- KYEC
- Chipbond and ChipMOS
- Sigurd
- Market Context
- Packaging Technology Development
- Capex
- Significant Market Developments
- Regional Revenue Share
- Heterogeneous Integration — Taking ASE, an ASM Leader, as an Example
- Review of 2022 and Outlook for 2023
- Methodology
- Market Definition
- Related Research
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