Part 2: Developing Realistic Expectations for AR/VR — Device Considerations

Part 2: Developing Realistic Expectations for AR/VR — Device Considerations

This IDC Market Perspective investigates the challenges in mass-market augmented reality/virtual reality/extended reality (AR/VR/XR) devices by studying the role of sensors, onboard algorithms, semiconductor processor functionality, battery consumption, and thermal signature. AR/VR/XR devices are making great strides with the emergence of SoC chipsets from semiconductor companies that provide image, graphic, and neural network processing along with support for multiple cameras and numerous sensors. Advances in lithography are making it possible to pack a significant amount of compute and storage in small form factors such as would be needed in smart AR glasses. Mixed reality is an important class of use cases that will drive more and more innovation in device design including advanced algorithms for gaze tracking, eye tracking, gesture recognition, and facial expression recognition. Price elasticity will have a wider band to work with since premium smartphones are approaching US$1,000 per unit. "Therefore, IDC believes that mass-market devices will become a reality within three to five years and will also benefit from developments with the metaverse," says Bill Rojas, adjunct research director, IDC Asia/Pacific.

Please Note: Extended description available upon request.


Executive Snapshot
New Market Developments and Dynamics
The Important Role of Sensors in AR/VR
AR/VR Device Electric Power and Thermal Signature
Modelling Thermal Signature of Smart AR Glasses
Chipsets and Platforms for AR/VR
Connectivity for AR/VR
Other Interesting Components for AR/VR
Advice for the Technology Supplier
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Synopsis

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