Semiconductor Wafer Polishing And Grinding Equipment Market Size, Share & Trends Analysis Report By Product (Polishing Machine, Grinding Machine), By Wafer Size, By End Use, By Region, And Segment Forecasts, 2025 - 2030

Semiconductor Wafer Polishing And Grinding Equipment Market Growth & Trends

The global semiconductor wafer polishing and grinding equipment market size is anticipated to reach USD 3,669.3 million by 2030 and is projected to grow at a CAGR of 4.7% from 2025 to 2030, according to a new report by Grand View Research, Inc. The semiconductor wafer polishing and grinding equipment industry is experiencing significant growth, driven by the rise of technologies like 5G, artificial intelligence (AI), and the Internet of Things (IoT), which is a major market driver. In addition, advancements in semiconductor manufacturing processes, such as the shift to more complex devices requiring higher precision and greater throughput, are creating a strong demand for wafer polishing and grinding equipment.

The market also presents lucrative opportunities, especially with the expansion of semiconductor applications across industries like automotive, healthcare, and renewable energy. The increasing use of semiconductors in electric vehicles (EVs), smart devices, and industrial automation is further driving demand. As manufacturers push for miniaturization and the development of next-generation semiconductor devices, there is an opportunity for equipment suppliers to offer innovative solutions, such as automation and AI-driven equipment, to meet the evolving needs of the industry.

The regulatory landscape for semiconductor manufacturing is stringent, with standards set by organizations such as the International Electrotechnical Commission (IEC) and other local regulatory bodies. These regulations ensure product safety, environmental compliance, and energy efficiency in semiconductor production.

Top market players are focusing on strategies that include enhancing product portfolios, investing in research and development, and forming strategic partnerships to maintain competitive advantages. Leading companies are developing next-generation equipment, incorporating advanced automation and AI technologies to improve efficiency, precision, and throughput. In addition, they are expanding their global reach through acquisitions, mergers, and collaborations with research institutions, which allow them to stay ahead of technological advancements. For instance, Delta Electronics, Inc. introduced the Wafer Edge Grinding Machine in September 2023. The machine integrates hardware and software to improve wafer quality and capacity. It features precise positioning, intuitive software, and real-time monitoring.

Semiconductor Wafer Polishing And Grinding Equipment Market Report Highlights

• The polishing machine segment accounted for the largest revenue share in 2024, due to the increasing need for high-precision surface finishes in semiconductor production. As chips become smaller and more complex, the demand for polishing machines that can deliver flawless surfaces and meet tight manufacturing tolerances is growing, supporting overall semiconductor device performance.
• Based on wafer size, the 300 mm segment accounted for the largest revenue share in 2024, as it enables the production of more semiconductors per wafer, improving yield and cost efficiency.
• Based on end use, the foundry segment led the market with the largest revenue share of 54.7% in 2024, as they play a central role in semiconductor manufacturing. As global demand for chips rises across various industries, foundries are investing in advanced wafer processing technologies to meet the high-volume and quality demands of their clients.
• Asia Pacific dominated the market with the largest revenue share of 68.7% in 2024,driven by the increasing demand for advanced semiconductors in industries such as electronics, automotive, and 5G fuels and the need for precise wafer processing technologies.
• In October 2023, Revasum and Saint-Gobain Surface Solutions (SGSS) announced their partnership to develop advanced grinding wheels for Silicon Carbide (SiC) wafers, driven by the increasing demand for high-quality SiC in power devices. The collaboration combines Revasum's semiconductor equipment expertise with SGSS's materials science competencies to create innovative surface finishing solutions, improving precision, efficiency, and surface quality in SiC wafer production.