Semiconductor Packaging Market Size, Share & Trends Analysis Report By Material (Organic Substrate, Bonding Wire, Encapsulation Resins, Die Attach Material, Ceramic Packages), By Packaging Technology, By End-use, By Region, And Segment Forecasts, 2024 - 2

Semiconductor Packaging Market Size, Share & Trends Analysis Report By Material (Organic Substrate, Bonding Wire, Encapsulation Resins, Die Attach Material, Ceramic Packages), By Packaging Technology, By End-use, By Region, And Segment Forecasts, 2024 - 2030

Semiconductor Packaging Market Trends

The global semiconductor packaging market size was estimated at USD 40.91 billion in 2023 and is expected to grow at a CAGR of 10.2% from 2024 to 2030. With the proliferation of smartphones, tablets, and other consumer electronics, the need for advanced semiconductor packaging is rising. These devices require compact and efficient packaging solutions that ensure high performance and reliability.

The automotive industry's shift towards electric vehicles (EVs) and autonomous driving technologies necessitates sophisticated semiconductor packaging to handle higher performance and reliability standards. Companies like TSMC and Intel are investing heavily in automotive-grade semiconductor solutions. The growing adoption of Artificial Intelligence (AI) and the Internet of Things (IoT) is fueling the demand for advanced packaging technologies. These technologies require high integration levels and efficient heat dissipation, driving innovations in packaging solutions like Fan-Out Wafer Level Packaging (FO-WLP) and System-in-Package (SiP).

The trend towards miniaturization in electronics is driving the need for smaller, more efficient packaging solutions. This demand is boosting the adoption of 3D packaging technologies that allow more functionalities to be packed into smaller spaces. The development of new materials such as organic substrates and advanced encapsulation resins is creating opportunities for more efficient and durable packaging solutions. For instance, in 2023, Amkor Technology launched new advanced substrate materials that enhance thermal performance and reliability.

Global Semiconductor Packaging Market Report Segmentation

This report forecasts revenue growth at global, regional, and country levels and provides an analysis of the latest industry trends in each of the sub-segments from 2018 to 2030. For this study, Grand View Research has segmented the global semiconductor packaging market report based on material, technology, end-use, and region:

• Material Outlook (Revenue, USD Million, 2018 - 2030)
• Organic Substrate
• Bonding Wire
• Leadframes
• Encapsulation Resins
• Ceramic Package
• Die Attach Material
• Thermal Interface Materials
• Solder Balls
• Others
• Technology Outlook (Revenue, USD Million, 2018 - 2030)
• Advanced Packaging
• Flip Chip
• SIP
• 5D/3D
• Embedded Die
• Fan-in Wafer Level Packaging (FI-WLP)
• Fan-out Wafer Level Packaging (FO-WLP)
• Traditional Packaging
• End-use Outlook (Revenue, USD Million, 2018 - 2030)
• Consumer Electronics
• Automotive
• Healthcare
• IT & Telecommunication
• Aerospace & Defence
• Others
• Regional Outlook (Revenue, USD Million, 2018 - 2030)
• North America
• U.S.
• Canada
• Mexico
• Europe
• Germany
• UK
• France
• Italy
• Spain
• Asia Pacific
• China
• India
• Japan
• South Korea
• Central & South America
• Brazil
• Argentina
• Middle East & Africa
• Israel
• UAE
• South Africa

Please note The report will be delivered in 4-8 business days upon order notification.