Electronic Packaging Market Size, Share & Trends Analysis Report By Material (Plastic, Metal, Glass), By End-use (Consumer Electronics, Automotive, Aerospace & Defence, Healthcare), By Region (North America, Europe, Asia Pacific), And Segment Forecasts, 2

Electronic Packaging Market Growth & Trends

The global electronic packaging market size is anticipated to reach USD 5.22 billion by 2030 and is anticipated to expand at a CAGR of 17.29% during the forecast period, according to a new report by Grand View Research, Inc. The electronic packaging market is a crucial segment of the global electronics and semiconductor industry, playing a vital role in ensuring the performance, reliability, and longevity of electronic components. Electronic packaging encompasses a range of materials and technologies used to protect semiconductors, circuit boards, and other electronic devices from environmental factors such as heat, moisture, and mechanical stress. As the demand for high-performance computing, telecommunications, and consumer electronics continues to grow, the need for advanced electronic packaging solutions is increasing across multiple industries, including automotive, aerospace, and medical devices.

A key driver of the electronic packaging market is the rapid evolution of semiconductor technology, which necessitates highly efficient and compact packaging solutions. The shift toward miniaturization, driven by applications such as smartphones, wearables, and IoT devices, has led to the development of cutting-edge packaging techniques, including wafer-level packaging (WLP), system-in-package (SiP), and 3D integration. Additionally, as electronic devices generate more heat due to increased processing power, the demand for thermally efficient packaging materials and designs has surged. Innovations in organic substrates, ceramic packaging, and advanced encapsulants are enhancing the durability and performance of electronic components, ensuring they meet the evolving demands of modern technology.

The market players are focusing on various strategic initiatives such as mergers, acquisitions, and collaborations. For instance, in May 2024, Esko, Fiery, and Global Inkjet Systems (GIS) partnered to offer a comprehensive digital printing solution for packaging. This collaboration aims to help press manufacturers transition from analog to digital by providing pre-integrated solutions that reduce development time. The partnership combines Esko's prepress and color management, Fiery's digital front-end (DFE) technology, and GIS's printhead control systems. Together, they streamline the production process from job creation to final output, ensuring quality and efficiency.

Electronic Packaging Market Report Highlights

• Based on material, plastic held the largest share, accumulating USD 763.0 million market size in 2024.
• The consumer electronics dominated the application segmentation and accounted for the largest revenue share of over 36.39% in 2024.
• Asia Pacific dominated the electronic packaging market. Government-backed initiatives in semiconductor self-sufficiency, particularly in India and Southeast Asia, are encouraging investments in packaging infrastructure, creating new growth opportunities for local and international players.
• China was the leading manufacturer of electronic packaging in the Asia Pacific region and captured around 29% of the revenue market share in 2024 in this region.