Global Wafer-level Packaging Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Wafer-level Packaging Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.

According to our (Global Info Research) latest study, the global Wafer-level Packaging Equipment market size was valued at US$ 2943 million in 2023 and is forecast to a readjusted size of USD 5340 million by 2030 with a CAGR of 9.0% during review period.

Global Wafer-level Packaging Equipment key players include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, etc. Global top four manufacturers hold a share nearly 60%.

China Taiwan is the largest market, with a share about 30%, followed by China Mainland, and North America, both have a share about 35 percent.

In terms of product, Fan-in WLP is the largest segment, followed by Fan-out WLP, etc.

This report is a detailed and comprehensive analysis for global Wafer-level Packaging Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Wafer-level Packaging Equipment market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Wafer-level Packaging Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Wafer-level Packaging Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Wafer-level Packaging Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer-level Packaging Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer-level Packaging Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, Tokyo Seimitsu, Disco, SEMES, Suss Microtec, Veeco/CNT, Rudolph Technologies, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer-level Packaging Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Fan In
Fan Out
Others

Market segment by Application
Integrated Circuit Fabrication Process
Semiconductor Industry
Microelectromechanical Systems (MEMS)
Other

Major players covered
Applied Materials
Tokyo Electron
KLA-Tencor Corporation
EV Group
Tokyo Seimitsu
Disco
SEMES
Suss Microtec
Veeco/CNT
Rudolph Technologies

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer-level Packaging Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer-level Packaging Equipment, with price, sales quantity, revenue, and global market share of Wafer-level Packaging Equipment from 2019 to 2024.

Chapter 3, the Wafer-level Packaging Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer-level Packaging Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer-level Packaging Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer-level Packaging Equipment.

Chapter 14 and 15, to describe Wafer-level Packaging Equipment sales channel, distributors, customers, research findings and conclusion.