Global Wafer Slicing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Wafer Slicing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Wafer Slicing Equipment(that is, the Wafer scribing machine) is mainly used for packaging, is the Wafer that contain a lot of chip (Wafer) into one device, a chip particles current industry are mainly composed of mechanical blade, including the main shaft, control system, etc., due to cutting matrix for semiconductor devices, so the product yield and higher control requirements.

According to our (Global Info Research) latest study, the global Wafer Slicing Equipment market size was valued at US$ 943 million in 2023 and is forecast to a readjusted size of USD 1278 million by 2030 with a CAGR of 4.5% during review period.

Global key wafer slicing equipment manufacturers include DISCO, Tokyo Seimitsu etc.The top 1 company hold a share about 60%.Chinese Mainland is the largest market, with a share about 40%, followed by Taiwan, China and South Korea with the share about 27% and 10%.

This report is a detailed and comprehensive analysis for global Wafer Slicing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Wafer Slicing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Wafer Slicing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Wafer Slicing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Wafer Slicing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Slicing Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Slicing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Slicing Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Blade Cutting Machine
Laser Cutting Machine

Market segment by Application
Pure Foundry
IDM
OSAT
LED
Photovoltaic

Major players covered
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Slicing Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Slicing Equipment, with price, sales quantity, revenue, and global market share of Wafer Slicing Equipment from 2019 to 2024.

Chapter 3, the Wafer Slicing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Slicing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer Slicing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Slicing Equipment.

Chapter 14 and 15, to describe Wafer Slicing Equipment sales channel, distributors, customers, research findings and conclusion.