Global Wafer Grinding and Polishing Machine Supply, Demand and Key Producers, 2023-2029

Global Wafer Grinding and Polishing Machine Supply, Demand and Key Producers, 2023-2029

The global Wafer Grinding and Polishing Machine market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

Wafer grinding and polishing machine is a device used for grinding and polishing semiconductor wafers. It is mainly used in the post process of semiconductor manufacturing, for thinning wafers, removing surface defects, improving flatness and surface roughness, and adjusting the thickness and size of wafers. Wafer grinding and polishing machines typically use automated operating methods, which can process multiple wafers for grinding and polishing simultaneously. The main working process includes the following steps: grinding: In the grinding stage, the wafer is placed on a grinding plate, and the surface of the wafer is ground using grinding particles by rotating and applying appropriate grinding pressure, thereby removing a certain thickness of the wafer. Polishing: In the polishing stage, the surface of the wafer after grinding is placed on the polishing disc, in contact with the polishing pad. By rotating the disc and applying appropriate polishing pressure, using polishing liquid as the medium, the wafer surface is further ground and polished to achieve higher flatness and smoothness. Cleaning and Inspection: After grinding and polishing, the wafer needs to undergo subsequent steps such as cleaning and inspection to remove residual particles, polishing solution, and other impurities, and undergo quality inspection. Wafer grinding and polishing machines play an important role in semiconductor manufacturing processes, which can be used to prepare flat wafer surfaces to meet the requirements of devices. It is widely used in fields such as integrated circuit manufacturing, optoelectronic device manufacturing, sensor manufacturing, etc., helping to improve the quality of wafers, enhance device performance, and promote the development of the semiconductor industry.

This report studies the global Wafer Grinding and Polishing Machine production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Wafer Grinding and Polishing Machine, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Wafer Grinding and Polishing Machine that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Wafer Grinding and Polishing Machine total production and demand, 2018-2029, (Units)

Global Wafer Grinding and Polishing Machine total production value, 2018-2029, (USD Million)

Global Wafer Grinding and Polishing Machine production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Units)

Global Wafer Grinding and Polishing Machine consumption by region & country, CAGR, 2018-2029 & (Units)

U.S. VS China: Wafer Grinding and Polishing Machine domestic production, consumption, key domestic manufacturers and share

Global Wafer Grinding and Polishing Machine production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Units)

Global Wafer Grinding and Polishing Machine production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Units)

Global Wafer Grinding and Polishing Machine production by Application production, value, CAGR, 2018-2029, (USD Million) & (Units).

This reports profiles key players in the global Wafer Grinding and Polishing Machine market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Strasbaugh Inc., Okamoto Corporation, Logitech Ltd., Lapmaster Wolters GmbH, G&N Genauigkeits Maschinenbau Nürnberg GmbH, Engis Corporation, SpeedFam Co., Ltd. and Peter Wolters GmbH, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Wafer Grinding and Polishing Machine market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Wafer Grinding and Polishing Machine Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Wafer Grinding and Polishing Machine Market, Segmentation by Type
Single Side Grinding and Polishing Machine
Double-Sided Grinding and Polishing Machine

Global Wafer Grinding and Polishing Machine Market, Segmentation by Application
Semiconductor Manufacturing
MEMS Manufacturing
Others

Companies Profiled:
DISCO Corporation
Strasbaugh Inc.
Okamoto Corporation
Logitech Ltd.
Lapmaster Wolters GmbH
G&N Genauigkeits Maschinenbau Nürnberg GmbH
Engis Corporation
SpeedFam Co., Ltd.
Peter Wolters GmbH
Koyo Machinery USA, Inc.
ACME Electronics Corporation
KLA Corporation
Melchiorre S.r.l.
Ebara Corporation
Suprema Industries
Beijing Semicore Zkx Electronics Equipment Co., Ltd.

Key Questions Answered

1. How big is the global Wafer Grinding and Polishing Machine market?

2. What is the demand of the global Wafer Grinding and Polishing Machine market?

3. What is the year over year growth of the global Wafer Grinding and Polishing Machine market?

4. What is the production and production value of the global Wafer Grinding and Polishing Machine market?

5. Who are the key producers in the global Wafer Grinding and Polishing Machine market?

6. What are the growth factors driving the market demand?