Global Wafer Grinder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Wafer Grinder market size was valued at US$ 954 million in 2024 and is forecast to a readjusted size of USD 1603 million by 2031 with a CAGR of 6.9% during review period.

Wafer Grinder uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentially. The robot is able to move a wafer from the wash station to either the measuring station for after-grinding measurements or directly to an output station. During grinding of one wafer, a second wafer may be held between the measuring station and the grind station while a ground wafer is moved from the wash station to the measuring station for after-grinding measurements.

The key players of Wafer Grinder include Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, G&N, etc. The top five players of Wafer Grinder account for approximately 89% of the total market. Asia-Pacific is the largest market of Wafer Grinder accounting for about 77%, followed by America and Europe, with share 15% and 8%, separately. In terms of product type, fully automatic is the largest segment, occupied for a share of about 51%, and in terms of application, 300mm wafer is the largest segment, occupied for a share of about 82%.

This report is a detailed and comprehensive analysis for global Wafer Grinder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Wafer Grinder market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2020-2031

Global Wafer Grinder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2020-2031

Global Wafer Grinder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (USD/Unit), 2020-2031

Global Wafer Grinder market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (USD/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Grinder

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Grinder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TOKYO SEIMITSU, G&N, Okamoto Semiconductor Equipment Division, CETC, Koyo Machinery, Revasum, WAIDA MFG, Hunan Yujing Machine Industrial, SpeedFam, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Grinder market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Fully Automatic Wafer Grinders
Semi-Automatic Wafer Grinders

Market segment by Application
200mm Wafer
300mm Wafer
Others

Major players covered
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Hunan Yujing Machine Industrial
SpeedFam

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Grinder product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Grinder, with price, sales quantity, revenue, and global market share of Wafer Grinder from 2020 to 2025.

Chapter 3, the Wafer Grinder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Grinder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Grinder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Grinder.

Chapter 14 and 15, to describe Wafer Grinder sales channel, distributors, customers, research findings and conclusion.