Global Wafer Electrostatic Chuck Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
The Electrostatic Chucks (ESC) is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
According to our (Global Info Research) latest study, the global Wafer Electrostatic Chuck market size was valued at US$ 1747 million in 2023 and is forecast to a readjusted size of USD 2478 million by 2030 with a CAGR of 4.9% during review period.
The Global key players of Wafer Electrostatic Chuck include Applied Materials, Lam Research, SHINKO, etc. The top three players hold a share about 86%. Asia-Pacific is the largest market, and has a share about 75%. In terms of product type, Coulomb Type is the largest segment, which occupied for a share of about 69%. For application, 300 mm Wafer is the largest segment, which has a share about 78%.
This report is a detailed and comprehensive analysis for global Wafer Electrostatic Chuck market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Wafer Electrostatic Chuck market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Wafer Electrostatic Chuck market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Wafer Electrostatic Chuck market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Wafer Electrostatic Chuck market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Electrostatic Chuck
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Electrostatic Chuck market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Applied Materials, Lam Research, SHINKO, TOTO, Sumitomo Osaka Cement, MiCo, Creative Technology Corporation, Kyocera, Entegris, Krosaki Harima Corporation, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Wafer Electrostatic Chuck market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Coulomb Type
Johnsen-Rahbek (JR) Type
Market segment by Application
300 mm Wafer
200 mm Wafer
Others
Major players covered
Applied Materials
Lam Research
SHINKO
TOTO
Sumitomo Osaka Cement
MiCo
Creative Technology Corporation
Kyocera
Entegris
Krosaki Harima Corporation
NTK CERATEC
AEGISCO
Hebei Sinopack Electronic
II-VI M Cubed
Tsukuba Seiko
Calitech
Beijing U-PRECISION TECH
NGK Insulators
LK ENGINEERING
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Electrostatic Chuck product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Electrostatic Chuck, with price, sales quantity, revenue, and global market share of Wafer Electrostatic Chuck from 2019 to 2024.
Chapter 3, the Wafer Electrostatic Chuck competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Electrostatic Chuck breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer Electrostatic Chuck market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Electrostatic Chuck.
Chapter 14 and 15, to describe Wafer Electrostatic Chuck sales channel, distributors, customers, research findings and conclusion.