Global Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Wafer Bonder Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after the wafer bonding, the interface of the atoms under the action of external forces to react to form a covalent bond bond into one, and make the interface to achieve a specific bond strength.

According to our (Global Info Research) latest study, the global Wafer Bonder market size was valued at US$ 154 million in 2023 and is forecast to a readjusted size of USD 254 million by 2030 with a CAGR of 7.5% during review period.

The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world"s leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany"s SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.

This report is a detailed and comprehensive analysis for global Wafer Bonder market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Wafer Bonder market size and forecasts, in consumption value ($ Million), sales quantity (Unit), and average selling prices (K USD/Unit), 2019-2030

Global Wafer Bonder market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Unit), and average selling prices (K USD/Unit), 2019-2030

Global Wafer Bonder market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Unit), and average selling prices (K USD/Unit), 2019-2030

Global Wafer Bonder market shares of main players, shipments in revenue ($ Million), sales quantity (Unit), and ASP (K USD/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Wafer Bonder

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Wafer Bonder market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Wafer Bonder market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Semi-Automated Wafer Bonder
Automated Wafer Bonder

Market segment by Application
MEMS
Advanced Packaging
CMOS
Others

Major players covered
EV Group
SUSS MicroTec
Tokyo Electron
AML
Mitsubishi
Ayumi Industry
SMEE

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Wafer Bonder product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Wafer Bonder, with price, sales quantity, revenue, and global market share of Wafer Bonder from 2019 to 2024.

Chapter 3, the Wafer Bonder competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Wafer Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Wafer Bonder market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Bonder.

Chapter 14 and 15, to describe Wafer Bonder sales channel, distributors, customers, research findings and conclusion.