Global Ultra-thin Copper Foil Supply, Demand and Key Producers, 2023-2029

Global Ultra-thin Copper Foil Supply, Demand and Key Producers, 2023-2029

The global Ultra-thin Copper Foil market size is expected to reach $ 12660 million by 2029, rising at a market growth of 22.3% CAGR during the forecast period (2023-2029).

Global 5 largest manufacturers of Ultra-thin Copper Foil are SK Nexilis, Mitsui Mining & Smelting, ILJIN Materials, Fukuda Metal Foil & Powder and Nippon Denkai, which make up over 50%. Among them, SK Nexilis is the leader with about 25% market share.

In terms of product type, 2-5μm product occupies the largest share of the total market, about 70%. And in terms of product Application, the largest application is IC Substrate, followed by Coreless Substrate.

Electrolytic Copper Foil is the copper foil produced by the electrolytic method, which is made by dissolving the copper material into a copper sulfate solution.In professional electrolysis equipment, the solution is made into the original foil by direct current electrodeposition. Ultra-thin copper foil is a key material in batteries and other electronic fields, and its thickness is generally 2-5μm. But for high-end market demand, the market demand for copper foil with a thickness of less than 5μm is showing an upward trend.

This report studies the global Ultra-thin Copper Foil production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Ultra-thin Copper Foil, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Ultra-thin Copper Foil that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Ultra-thin Copper Foil total production and demand, 2018-2029, (Tons)

Global Ultra-thin Copper Foil total production value, 2018-2029, (USD Million)

Global Ultra-thin Copper Foil production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Ultra-thin Copper Foil consumption by region & country, CAGR, 2018-2029 & (Tons)

U.S. VS China: Ultra-thin Copper Foil domestic production, consumption, key domestic manufacturers and share

Global Ultra-thin Copper Foil production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Tons)

Global Ultra-thin Copper Foil production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Ultra-thin Copper Foil production by Application production, value, CAGR, 2018-2029, (USD Million) & (Tons).

This reports profiles key players in the global Ultra-thin Copper Foil market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SK Nexilis, Mitsui Mining & Smelting, ILJIN Materials, Industrie De Nora, Fukuda Metal Foil & Powder, Nippon Denkai, Carl Schlenk, UACJ Foil Corporation and Nan Ya Plastics, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Ultra-thin Copper Foil market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Ultra-thin Copper Foil Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Ultra-thin Copper Foil Market, Segmentation by Type
Below 2μm
2-5μm

Global Ultra-thin Copper Foil Market, Segmentation by Application
IC Substrate
Coreless Substrate
Others

Companies Profiled:
SK Nexilis
Mitsui Mining & Smelting
ILJIN Materials
Industrie De Nora
Fukuda Metal Foil & Powder
Nippon Denkai
Carl Schlenk
UACJ Foil Corporation
Nan Ya Plastics
Chaohua Technology
Guangdong Jia Yuan Tech
Nuode
Shengda Electric
Tongling Nonferrous Metals Group
Shanghai Legion Compound Material
Guangzhou Fangbang Electronics
Tongling Huachuang New Material

Key Questions Answered

1. How big is the global Ultra-thin Copper Foil market?

2. What is the demand of the global Ultra-thin Copper Foil market?

3. What is the year over year growth of the global Ultra-thin Copper Foil market?

4. What is the production and production value of the global Ultra-thin Copper Foil market?

5. Who are the key producers in the global Ultra-thin Copper Foil market?

6. What are the growth factors driving the market demand?