Global Thermal Conductive Adhesives Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Thermal Conductive Adhesives Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030


According to our (Global Info Research) latest study, the global Thermal Conductive Adhesives market size was valued at USD 78 million in 2023 and is forecast to a readjusted size of USD 97.9 million by 2030 with a CAGR of 3.3% during review period.

Thermally conductive adhesives are often used to dissipate heat from power electronics. Used to bond heat sinks, for example, their heat conductivity reduces thermal strain to prevent performance loss or failure of electronic components. Thermally conductive adhesives are also used as encapsulation compound for temperature sensors for enclosures or reactors. Adhesives with thermal conductivity are synthetic resins augmented with metallic or inorganic filler materials. The best thermal conduction coefficients can be achieved with metallic fillers such as silver or graphite. These, however, also make the adhesive electrically conductive, which is undesirable in many applications. To achieve thermal conductivity and electrical insulation at the same time, adhesives augmented with ceramic or mineral-based fillers must be used.

Shin-Etsu is the world biggest manufacturer of thermally conductive adhesives, followed Dow, Chengdu Guibo Science, etc. The top 5 manufacturers occupy 65% its market share. Asia-Pacific is the largest market, in which holds a market share of around 36%.

The Global Info Research report includes an overview of the development of the Thermal Conductive Adhesives industry chain, the market status of Battery Thermal (Silicones, Epoxies), Heat Sink (Silicones, Epoxies), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Thermal Conductive Adhesives.

Regionally, the report analyzes the Thermal Conductive Adhesives markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Thermal Conductive Adhesives market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Thermal Conductive Adhesives market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Thermal Conductive Adhesives industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., Silicones, Epoxies).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Thermal Conductive Adhesives market.

Regional Analysis: The report involves examining the Thermal Conductive Adhesives market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Thermal Conductive Adhesives market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Thermal Conductive Adhesives:

Company Analysis: Report covers individual Thermal Conductive Adhesives manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Thermal Conductive Adhesives This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Battery Thermal, Heat Sink).

Technology Analysis: Report covers specific technologies relevant to Thermal Conductive Adhesives. It assesses the current state, advancements, and potential future developments in Thermal Conductive Adhesives areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Thermal Conductive Adhesives market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Thermal Conductive Adhesives market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
Silicones
Epoxies
Polyurethanes
Acrylics

Market segment by Application
Battery Thermal
Heat Sink
IC Packaging Heat Conduction
LED Lighting Thermal
Thermal Material Potting

Major players covered
Henkel
H.B. Fuller
3M Company
Permabond Engineering Adhesives
Masterbond
Creative Materials Inc.
Panacol-Elosol GmbH
DOW Corning
Polytec PT GmbH
Lord Corporation
MG Chemicals
Protavic America
Aremco
Cast-Coat
Nagase America Corporation

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Thermal Conductive Adhesives product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Thermal Conductive Adhesives, with price, sales, revenue and global market share of Thermal Conductive Adhesives from 2019 to 2024.

Chapter 3, the Thermal Conductive Adhesives competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Thermal Conductive Adhesives breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Thermal Conductive Adhesives market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Conductive Adhesives.

Chapter 14 and 15, to describe Thermal Conductive Adhesives sales channel, distributors, customers, research findings and conclusion.


1 Market Overview
2 Manufacturers Profiles
3 Competitive Environment: Thermal Conductive Adhesives by Manufacturer
4 Consumption Analysis by Region
5 Market Segment by Type
6 Market Segment by Application
7 North America
8 Europe
9 Asia-Pacific
10 South America
11 Middle East & Africa
12 Market Dynamics
13 Raw Material and Industry Chain
14 Shipments by Distribution Channel
15 Research Findings and Conclusion
16 Appendix

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